处理，包装，对湿气或流回敏感表面登上设备的运输和用途 (pdf20)(1)

JOINTINDUSTRYSTANDARDHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesIPC/JEDECJ-STD-033AJuly2002SupersedesIPC/JEDECJ-STD-033April1999NOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.ForTechnicalInformationContact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,VA22201-3834Phone[phone]Fax[phone]IPC2215SandersRoadNorthbrook,IL60062-6135Phone[phone]Fax:[phone]PleaseusetheStandardImprovementFormshownattheendofthisdocument.Copyright2002.JEDEC,Arlington,Virginia,andIPC,Northbrook,Illinois.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutpriorwrittenconsentofthecopyrightholdersisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesAjointstandarddevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheB-10aPlasticChipCarrierCrackingTaskGroupofIPCUsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisions.Contact:JEDECPublicationsDepartment2500WilsonBoulevardArlington,VA22201Phone[phone]Fax[phone]IPC2215SandersRoadNorthbrook,IL60062-6135Phone[phone]Fax[phone]Supersedes:IPC/JEDECJ-STD-033-April1999JEDECJEP124IPC-SM-786A-January1995IPC-SM-786-December1990ASSOCIATIONCONNECTINGELECTRONICSINDUSTRIES®August9,2002IPC/JEDECJ-STD-033AJuly2002ACKNOWLEDGEMENTMembersoftheJointIPC-JEDECMoistureClassificationTaskGrouphaveworkedtodevelopthisdocument.Wewouldliketothankthemfortheirdedicationtothiseffort.AnyStandardinvolvingacomplextechnologydrawsmaterialfromavastnumberofsources.ThematerialinthisjointstandardwasdevelopedbytheJEDECJC-14.1SubcommitteeonReliabilityTestMethodsforPackagedDevicesandtheIPCPlasticChipCarrierCrackingTaskGroup(B-10a).ThisdocumentwasapprovedbytheJEDECBoardofDirectorsunderBoardBallotJCB-02-73,August2002.iiTableofContents1FOREWORD................................................................11.1Purpose..................................................................11.2Scope....................................................................11.2.1Packages...............................................................11.3AssemblyProcesses.............................................11.3.1MassReflow..........................................................11.3.2LocalizedHeating.................................................11.3.3SocketedComponents...........................................11.3.4Point-to-PointSoldering.......................................11.4Reliability..............................................................21.5TermsandDefinitions.........................................21.5.1ActiveDesiccant...................................................21.5.2BarCodeLabel.....................................................21.5.3BulkReflow..........................................................21.5.4Carrier....................................................................21.5.5Desiccant...............................................................21.5.6FloorLife..............................................................21.5.7HumidityIndicatorCard(HIC)............................21.5.8Manufacturer’sExposureTime(MET)................21.5.9MoistureBarrierBag(MBB)...............................21.5.10Rework..................................................................21.5.11ShelfLife...............................................................21.5.12SurfaceMountDevice(SMD).............................21.5.13SolderReflow........................................................21.5.14WaterVaporTransmissionRate(WVTR)............22APPLICABLEDOCUMENTS.....................................32.1AmericanSocietyforTestingandMaterials(ASTM)...............................................33DRYPACKING.....................................................