HUAWEI 3G模块 EM770W Product Specification V2_0

ProductSpecificationHUAWEIEM770WHSPAPCEmbeddedModuleV100R001Issue02Date2009-06-20HUAWEITECHNOLOGIESCO.,LTD.HuaweiConfidentialHuaweiTechnologiesCo.,Ltd.providescustomerswithcomprehensivetechnicalsupportandservice.Pleasefeelfreetocontactourlocalofficeorcompanyheadquarters.HuaweiTechnologiesCo.,Ltd.Address:HuaweiIndustrialBaseBantian,LonggangShenzhen518129People'sRepublicofChinaWebsite:@huawei.comCopyright©HuaweiTechnologiesCo.,Ltd.2008.Allrightsreserved.NopartofthisdocumentmaybereproducedortransmittedinanyformorbyanymeanswithoutpriorwrittenconsentofHuaweiTechnologiesCo.,Ltd.TrademarksandPermissionsandotherHuaweitrademarksaretrademarksofHuaweiTechnologiesCo.,Ltd.Allothertrademarksandtradenamesmentionedinthisdocumentarethepropertyoftheirrespectiveholders.NoticeTheinformationinthisdocumentissubjecttochangewithoutnotice.Everyefforthasbeenmadeinthepreparationofthisdocumenttoensureaccuracyofthecontents,butallstatements,information,andrecommendationsinthisdocumentdonotconstitutethewarrantyofanykind,expressorimplied.HuaweiConfidentialModuleEmbeddedPCHSPAEM770WHUAWEIV100R001ProductSpecificationIssue2(2009-06-20)ConfidenceinCommercialPage3of80AboutThisDocumentSummaryThisdocumentprovidesinformationaboutthemajorfunctions,supportedservices,systemarchitecture,andtechnicalreferencesofHUAWEIEM770WHSPAPCEmbeddedModule.Thefollowingtableliststhecontentsofthisdocument.ChapterDetails1OverviewDescribesthebasicfunctions,keyfeatures,andhardwareandsoftwareoverviewoftheproduct.2MechanicalSpecificationsDescribesthemechanicalspecificationsoftheproduct.3ElectricalSpecificationsDescribestheelectricalspecificationsoftheproduct.4RFSpecificationsDescribestheRFspecificationsoftheproduct.5SoftwareandToolsDescribesthesoftwareandtoolsoftheproduct.6TechnicalReferenceDescribesthetechnicalreferencesoftheproduct.AcronymsandAbbreviationsListstheacronymsandabbreviationsmentionedinthisdocument.SafetyInformationListsthesafetyinformationofusingtheproduct.ReferenceSchematicListstheReferenceSchematicofusingtheproduct.HuaweiConfidentialModuleEmbeddedPCHSPAEM770WHUAWEIV100R001ProductSpecificationIssue2(2009-06-20)ConfidenceinCommercialPage4of80HistoryIssueDetailsDateAuthorApprovedBy01Creation2008-09-15TanXiao'anXieConglong02Modified2009-06-20FredLuoXieBingfengHuaweiConfidentialModuleEmbeddedPCHSPAEM770WHUAWEIV100R001ProductSpecificationIssue2(2009-06-20)ConfidenceinCommercialPage5of80Contents1Overview.........................................................................................................................71.1Introduction.................................................................................................................................71.2KeyFeatures...............................................................................................................................81.3HardwareOverview.....................................................................................................................91.3.1HardwareLogicBlockDiagram...........................................................................................91.3.2ExternalHardwareInterfaces............................................................................................101.4SoftwareOverview....................................................................................................................122MechanicalSpecifications...........................................................................................142.1Dimensionsandinterfaces.........................................................................................................142.1.1DimensionsandinterfacesoftheEM770W.......................................................................142.1.2DimensionsoftheMiniPCIExpressConnector.................................................................152.1.3DimensionsoftheAntennaConnector...............................................................................162.2Reliability...................................................................................................................................182.3Temperature..............................................................................................................................183ElectricalSpecifications..............................................................................................193.1MiniPCIExpressPinDefinition.................................................................................................193.2PinDescriptions........................................................................................................................223.2.1DigitalSignalDCCharacteristics.......................................................................................223.2.2PowerSourcesandGrounds............................................................................................233.2.3USBSignals...................................................................................................................