导电胶粘剂的现状与进展

X1,2,2(1.,150040;2.,150001):,Pb/Sn:;;;;:TQ436.9:TM242:A:1004-2849(2004)03-0060-04,,,,(SurfaceMountTechnology,SMT),40%,,,1992,1997NORTELNetworksPCB;2001;2004,2008[1]Pb/Sn0.65mm,200,,I/O,,[12],I/O;,,,;,(EMC)11.1(ICAsIsotropicConductiveAdhesives)(ACAsAnisotropicConductiveAdhesives)ICAs;ACAsZ,XY(150)(150300)1.2,,,,,,,,,,S.liongC.P.Wong[3]Shimp(CE)(EP)[4],,:06CHINAADHESIVESVol.13.3X:2003-12-30:(1958-),,,,;[5],AjicurePN-31PN-40AgCu,[6],[78],,,,[9],,,:,()[8];,,,(low-melting-pointalloy,LMPA),,,[10]22.12.1.1,,,,60%80%,,,[8],,[7]2.1.2,[11],,,2.1.3,:,LiLeiY[6]RciPt,:,2.2(),,,3254-2D1.010-6m,(1517)MPa;[12]1.0510-6m;E-005CS8.510-6m;[13]GSD-T,510-4m,25.7MPa;David[8](0.51)10-5m;Tanigaki[14]10-7m[15]CLD-205.810-6m,30MPa;[16]510-6m,260;E-005SS(1.51.7)10-6m;David(10-610-7)m11(25)/(g.cm-3)/(m)/Pa.s(05)/Easiman38823.20110-645B205Easiman38853.53110-667H255ThreeBond3302B2.73310-636B1623ThreeBond3301F3.04310-647H243SD-93.0310-624H-3ST-2-310-656B-34d(25)EASIMAN3830470,270,:410-8m;EASIMAN388330252448h,7.010-8m,15MPa:(1)16133-,------,;(2),,;(3),[17]800,32.3MPa,:,(500h,120);,,4,:(1),Pb/Sn,;,,,(,),,(2),(UV)UV,,(UV+)[1]JOHNHL.Modelingandanalysisof96.5Sn-3.5Aglead-freesolderjointsofwaferleverchipscalepackageonbuildupmicroviaprintedcircuitboard[J].IEEEtrans2actionsonelectronicspackagingmanufacturing,2002,25(1):51-56.[2]DAOQIANGL.ConductivitymechanismsofICAs.[J].IEEE.transactionsonelectronicspackagingmanufactur2ing,1999,22(3):223-227.[3]LIONGS,WONGCP.Analternativetoepoxyresinforapplicationinisotropicallyadhesive[C].2001Interna2tionalsymposiumonadvancedpackagingmaterials.BraseltonGA,2001,3-18.[4]SHIMPDA,WENTWORTHJH.Cyanateester-curedepoxyresinstructuralcomposites[C].37thInt.SAMPLESymp.1992,37:293-305.[5],.[J].,2001,16(5):37-41.[6]LILEIY,ZONGHEL,JOHANL.EffectofAgparticlesizeonelectrialconductiveofICAs[J].IEEEtransactionsonelectronicspackagingmanufacturing,1999,22(4):299-302.[7]PANDINIS.Thebehaviorofsilverflakesinconductiveepoxy[J].Adhesivesage,1987,(5):31-35.[8]DAVIDWM.Copper-basedconductivepolymers:Anewconceptinconductiveresins[J].JAdhesion.2000,74:301-315.[9]SUNM.Conductivityofconductivepolymerforflip-chipbondingandbgasocket[J].MicroelectronJ,2001,32:197-203.[10]DAOQINGL,CPWONG.ConductivitymechanismsofICAs[J].IEEE.transactiononelectronicspackagingmanufacturing,2000,23(3):23-26.[11]LIL,MORRISJE.Electricalconductionmodelsforisotropicallyconductiveadhesivejoints[J].IEEEtranscomponpackgmanuftechnolPartA.1997,20(1):112-116.[12],SASAKIA.(III)[J].,1998,29(4):183-187.[13],,,.[J].,1997,18(1):34-39.[14]TANIGAKI,TSUYOSHI,IZAWA,etal.Resincompo2sitions,resinmoldingsandtheirmethodsofproduction[P].US6096245,2000-08-01.[15].CLD-20[J].,1999,8(2):39-41,44.[16],PTC[J]..1992,58(3):25-26.[17],,.-[J].,1998,19(1):61-63.26CHINAADHESIVESVol.13.3PresentsituationandprogressonelectricallyconductiveadhesivesSUNLi2rong1,WANGJun2,HUANGBai2hui2(1.PetrochemistryInstituteofHeilongjiang,Harbin150040,China;2.InstituteofChemistryHarbinEngineeringUniversity,Harbin150001,China)Abstract:AsonetypeofLead2freeinterconnectmaterials,ElectricallyConductiveAdhesives(ECAs)areidealreplacementofPb/Sninterconnectmaterial.ThisarticleintroducesECAscomponents,conductivemecha2nism,presentsituation,applications,anddevelopmenttrends.Keywords:ECAs;presentsituation;progress;conductivemechanism;review,,VOC(),HAP(),,,,,:,2.925%,650%,,(1),,;,,,(2),(),,,(3),,,,,,,,,:,,,,,,,,30,,,,4,;,,,,,,;,,,(72mN/m,38mN/m),,,,,()36133