COG-制程原理及流程

:COG1-2:COG1-3:COG1-4:COGDefectMode:2-1:LCM2-2:COG:3-1:COG15min3-2:COG10min3-3:COGDefectMode5min¾COG:ChipOnGlass¾Purpose:BondingDriver-ICwithCell¾KeyComponents:ƒCellƒACFƒDriverIC(LSI)COGProcess(Cell)Outputside(Cell)Inputside(FPC/PCB)Inputside(FPC/PCB)MECICMECICDriverIC¾ACF:AnisotropicConductiveFilm()¾:ƒÆƒÆ¾:ƒƒACFIntroduction(5/RT)50um50umSeparatorthickness81um81umConductivethickness152um152umAdhesivethickness31um31umParticlesize150/100MPa/10s190/100MPa/10sMainbondparameter80/1MPa/3s80/1MPa/3sAttachparameter10E9ormore10E8ormoreInsulationresistance5.0orless5.0orlessConnectionresistance44,00012,500pcs/mm244,00012,500pcs/mm2ConductiveParticles50m100mLength1.50.1mm1.50.1mmWidth233um233umThicknessAC-8623AC-8601TypeACFIntroduction(beforebonding)Bump(beforebonding)Bump(ACFcleaned)Bump(ACFcleaned)ConductiveParticleConductiveParticleBump(afterbonding)Bump(afterbonding)ACFIntroduction()AC-8623()ToolMuraToolMuraACFIntroduction¾Cell¾Loader/Tray/Cassette¾¾Cell¾Loader/Tray/Cassette¾UVCleanUVCleanACFAttachACFAttachICPrebondICPrebondICMainBondICMainBondCellUnloaderCellUnloaderVisualInspectionVisualInspectionCellLoaderCellLoaderWetCleanWetCleanCOGProcessFlowchart¾Cell¾Ø/()¾Ø¾Cell¾Ø/()¾ØWetCleanWetCleanCOGProcessFlowchart¾Cell¾UVunit¾Ø¾900mJ/cm21600mJ/cm2ƒ30度¾Cell¾UVunit¾Ø¾900mJ/cm21600mJ/cm2ƒ30度UVCleanUVCleanCOGProcessFlowchart¾ACFCell¾ACFattachunit¾¾ACFCell¾ACFattachunit¾CellLoaderCellLoaderWetCleanWetCleanUVCleanUVCleanICPrebondICPrebondICMainBondICMainBondCellUnloaderCellUnloaderVisualInspectionVisualInspection3s3s1MPa1MPa805805AC-8623AC-8601ACFAttachACFAttachACFAttachACFAttachCOGProcessFlowchart¾ICPrebondunit¾ICACF/Cell¾¾ICPrebondunit¾ICACF/Cell¾CellLoaderCellLoaderWetCleanWetCleanUVCleanUVCleanACFAttachACFAttachICMainBondICMainBondCellUnloaderCellUnloaderVisualInspectionVisualInspection0.3s0.3s25MPa25MPa805805AC-8623AC-8601ICPrebondICPrebondICPrebondICPrebondCOGProcessFlowchart¾ƒICACF/CellƒACF,ACF¾ICPrebondunit¾¾ƒICACF/CellƒACF,ACF¾ICPrebondunit¾CellLoaderCellLoaderWetCleanWetCleanUVCleanUVCleanACFAttachACFAttachICPrebondICPrebondCellUnloaderCellUnloaderVisualInspectionVisualInspection10s10s125Mpa100Mpa125Mpa100Mpa15051905AC-8623AC-8601ICMainBondICMainBondICMainBondICMainBondCOGProcessFlowchartƒCellƒUnloader/Tray/ConveyƒƒCellƒUnloader/Tray/ConveyƒCellLoaderCellLoaderWetCleanWetCleanUVCleanUVCleanACFAttachACFAttachICPrebondICPrebondCellUnloaderCellUnloaderVisualInspectionVisualInspectionICMainBondICMainBondICMainBondICMainBondCOGProcessFlowchartƒICƒƒƒICƒƒCellLoaderCellLoaderWetCleanWetCleanUVCleanUVCleanACFAttachACFAttachICPrebondICPrebondCellUnloaderCellUnloaderVisualInspectionVisualInspectionICMainBondICMainBondICMainBondICMainBondCOGProcessFlowchart¾¾ACF¾IC¾IC度COGProcessCriteria¾TFT/CFƒCellKittingƒ路ÆCellKitting¾ƒ不刺¾ICƒIC不COGCriteria()¾ACFUpper/LowerLimit¾度100um¾ACFUpper/LowerLimit¾度100umCOGCriteria(ACF)(ACF)¾ACFAULALL¾100um¾ACFAULALL¾100umCOGCriteria(ACF)(um)ModelB141XN03B141XG03B104SN01B084SN01B141XN03B141XG03B104SN01A()1284135615801284132412762535B9079139129049121090928C590556568608892750904D(导)3056305632693088338434404468SourceGateCOGCriteria(ACF)¾5¾Bump¾IC¾5¾Bump¾ICCOGCriteria():75umA:50umB:12.5umC:20um¾ØBump¾bump¾¾ØBump¾bump¾B141XG03Source(In)Gate(In)Gate(In)L14514566W757588P