芯片尺寸封装工艺技术

:2001209228;:2001212213:100423365(2002)0420291203,,,,(,400060):(CSP)CSP,:;;;:TN43:AASummaryoftheProcessTechnologyforChipScalePackageTANGJiang2nan,ZENGDa2fu,LIUJian2hua,ZHUZhi2cheng,ZHAOJing(SichuanInstituteofSolid2StateCircuits,Chongqing400060,P1R1China)Abstract:Chipscalepackage(CSP)isanewmicroelectronicpackagingtechnologyrapidlydevelopedinrecentyears1FourtypesofCSPdevicesaredescribedandfabricationtechnologiesforeachofthemareanalyzedinthepa2per1Keywords:Chipscalepackage;Packaging;Thinfilm;MicroelectronicsEEACC:0170J11992CSP,50CSPCSP,J2STD2012,112,BGACSP:,,;CSP,;CSP,;SMTMCM,;CSP,BGA,,,,KGD,CSP,(DSP)(ASIC),CSP,,CSP,CSPCSP;,CSP;CSP2CSPCSPIC,;,,IC,,CSP:IC,,(),,32420028MicroelectronicsVol132,4Aug12002CSP,IC,()IC,11CSP,CSP,22CSP:1)CSPPITAB,(TAB)(FC)(WB):,A.TABö,,TABö;:,;;,,B.,,;,,,:;;2)CSP,CSPCSP(FC)(WB)A.,,;,:,;,,SMTB.,IC,:,,3),CSPA1TABö,ICRohm,B1CSPIC,J,4)CSP,,,A.,IöOB.,,,8CSP,IC,;,,;,,CSP292:20023CSPCSP,,33,,CSP;,,CSP,,;TABöö;KGD;4CSPAmkorCSP(FleXBGA),(BGA),132412018mm110mm1127mm256,(TQFP)40%70%FleXBGA0125nH,0113pF,5m8CSP12mm15mm16mm27mm,JEDECMO2195FlipChipTechnologiesCSPUl2traCSP,,IöOCSPUltraCSPIöO,JEDECCSP,40C125C500UltraCSP0150mm0165mm0175mm0185mm5CSP,CSPMCMCSP,,KGD,MCM,CSPSMT,,CSP,,PCB0175mmCSP,PCB(0150175mm),,,CSPCSPIöO,115mm014mm,,CSPLSI,CSPIöO,IöOCSPMCM,CSPMCM:[1],1[J]1,2000;(6):30:41824211[2]CrumS1Trendsinadvancedcomponenttechnologies[J]1ElectronicPackaging&Production,1998;38(1):482531[3]1[J]1,1998;(11):102111:(1975),(),,2000,MCM4:293