JESD47I

JEDECSTANDARDStress-Test-DrivenQualificationofIntegratedCircuitsJESD47I(RevisionofJESD47H.01,April2011)JULY2012JEDECSOLIDSTATETECHNOLOGYASSOCIATIONNOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSIstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECattheaddressbelow,orreferto©JEDECSolidStateTechnologyAssociation20123103North10thStreetSuite240SouthArlington,VA22201-2107Thisdocumentmaybedownloadedfreeofcharge;howeverJEDECretainsthecopyrightonthismaterial.Bydownloadingthisfiletheindividualagreesnottochargefororreselltheresultingmaterial.PRICE:ContactJEDECPrintedintheU.S.A.AllrightsreservedPLEASE!DON’TVIOLATETHELAW!ThisdocumentiscopyrightedbyJEDECandmaynotbereproducedwithoutpermission.Forinformation,contact:JEDECSolidStateTechnologyAssociation3103North10thStreetSuite240SouthArlington,VA22201-2107orreferto(FromJEDECBoardBallot,JCB-12-24,formulatedunderthecognizanceoftheJC14.3SubcommitteeonSiliconDevicesReliabilityQualificationandMonitoring.)1ScopeThisstandarddescribesabaselinesetofacceptancetestsforuseinqualifyingelectroniccomponentsasnewproducts,aproductfamily,orasproductsinaprocesswhichisbeingchanged.Thesetestsarecapableofstimulatingandprecipitatingsemiconductordeviceandpackagingfailures.Theobjectiveistoprecipitatefailuresinanacceleratedmannercomparedtouseconditions.FailureRateprojectionsusuallyrequirelargersamplesizesthanarecalledoutinqualificationtesting.Forguidanceonprojectingfailurerates,refertoJESD85MethodsforCalculatingFailureRatesinUnitsofFITs.Thisqualificationstandardisaimedatagenericqualificationforarangeofuseconditions,butisnotapplicableatextremeuseconditionssuchasmilitaryapplications,automotiveunder-the-hoodapplications,oruncontrolledavionicsenvironments,nordoesitaddress2ndlevelreliabilityconsiderations,whichareaddressedinJEP150.Wherespecificuseconditionsareestablished,qualificationtestingtailoredtomeetthosespecificrequirementscanbedeveloped,usingJESD94thatwillresultinabetteroptimizationofresources.Thissetoftestsshouldnotbeusedindiscriminately.Eachqualificationprojectshouldbeexaminedfor:a)Anypotentialnewanduniquefailuremechanisms.b)Anysituationswherethesetests/conditionsmayinduceinvalidoroverstressfailures.Ifitisknownorsuspectedthatfailureseitherareduetonewmechanismsorareuniquelyinducedbytheseverityofthetestconditions,thentheapplicationofthetestconditionasstatedisnotrecommended.Alternatively,newmechanismsoruniquelyproblematicstresslevelsshouldbeaddressedbybuildinganunderstandingofthemechanismanditsbehaviorwithrespecttoacceleratedstressconditions(Ref.JESD91,“MethodforDevelopingAccelerationModelsforElectronicComponentFailureMechanisms”andJESD94,“ApplicationSpecificQualificationusingKnowledgeBasedTestMethodology”).ConsiderationofPCboardassembly-leveleffectsmayalsobenecessary.Forguidanceonthis,refertoJEP150,Stress-Test-DrivenQualificationofandFailureMechanismsAssociatedwithAssembledSolidStateSurface-MountComponents.Thisdocumentdoesnotrelievethesupplieroftheresponsibilitytoassurethataproductmeetsthecompletesetofitsrequirements.JEDECStandardNo.47IPage22ReferencedocumentsTherevisionofthereferenceddocumentsshallbethatwhichisineffectonthedateofthequalificationplan.2.1MilitaryMIL-STD-883,TestMethodsandProceduresforMicroelectronicsMIL-PRF385352.2IndustrialUL94,TestsforFlammabilityofPlasticMaterialsforPartsinDevicesandAppliances.ASTMD2863,FlammabilityofPlasticUsingtheOxygenIndexMethod.IECPublication695,FireHazardTesting.J-STD-020,JointIPC/JEDECStandard,Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurface-MountDevices.JP-001,FoundryProcessQualificationGuidelines(WaferFabricationMan