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2007/3/231璨璨圓圓光光電電股股份份有有限限公公司司FormosaFormosaEpitaxyEpitaxy(3061TT)(3061TT)WorldLeaderinWorldLeaderinInGaNInGaNSemiconductorLEDTechnologySemiconductorLEDTechnology:1999.11.4Capital:1,800,000,000NTDTotalEmployees:460employees(2007.01)MainProducts:InGaN-basedhighbrightnessBlue,Green&Near-UVLEDwafersandchipsCapacity:2007Jan.:Wafers:20Kpcs/M,Chips:200KK/M2007Dec:Wafers:35Kpcs/M,Chips:350KK/MFactory:Factory1:3,300m2(MOCVD),Factory2:12,000m2(ChipProcess)Factory3:1,500m2(ChipProcess,B/Eonly)IPO2003.04.11(3061TT)TaiwanStockMarketISOISO9001/ISO14001versionupdatedtoJuly,20062007/3/233MajorAchievements1999.11.FormosaEpitaxyIncorporation—company-incorporated2001.09.Long-termordersfromLG&Samsung(InGaNEpiwafer)2002.06.Fundingaward-TheTaiwanNextGenerationLightingProject(PhaseI),LeadingcompanyforUVLEDEpidevelopment2002.08.TheNationalEnterpriseGoldenAward2003.01.ROCOutstandingAward(EnterpriseItem)2003.01.ISO9001-2000versionTUVcertified2003.04.IPOlistedinTaiwanStockMarket(3061TT)2003.12.Fundingaward-TheTaiwanNextGenerationLightingProject(PhaseII),US$1.5MtoFOREPI2004.02.BeingawardedtheHonorofthebestsupplierofLG2004.09.The12thTechnologyAwardofMinistryofEconomicaffairs2005.09.ISO14001versioncertified2006.09.ResearchTeamAwardof“TheTaiwanNextGenerationLightingProject(PhaseII)”,2007/3/234LoadSubstrateLoadingEpitaxy磊晶UnloadPLmeasurement光輝度量測X-raymeasurement量測QuicktestEMCORE~7hrs/runAIXTRON~7to10h/runSapphirep-GaNMQW量子井n-GaNbufferlayerdigitallayers(EMCORE)(EMCORE)(AIXTRON)140steps步驟/14,000parameters參數/7sources來源(AIXTRON)EpiProcessCoreCompetence:WaferProcess2007/3/235-Photolithography黃光ICPetchingGaN乾式蝕刻TCL透明導電層andBondingpad固電極墊Alloy合金chiponwafer晶粒在磊晶上Polishing研磨Probing點測Scribing切割Sorting分類chipontape貼至膠膜上VisualInspection目檢Counting計數QC品管Oneweekofstandardcycletime一星期時間Front-endBack-endChipProcessCoreCompetence:ChipProcess2007/3/236Green:500-535nmInGaNEpi-waferandchipsTrafficsignal、fullcolordisplayBlue:440-480nmInGaNEpi-wafer&chipsIllumination,backlightunit,fullcolordisplayNear-UV:380-405nmInGaNEpi-wafer&chipsillumination、biologicalapplicationMajorcolorofLEDsLEDepi-wafers380-405nmnear-UVLEDs500-535nmGreenLEDs450-480nmBlueLEDsLEDchipsMajorcolorofLEDs■GaNLEDChipSelectionGuideWLDWLPSizeThicknessTypMax[nm]455-4752.508*084FI0808ZAZ-BLITO3.84.2B01~B12(5mA)455-4752.508*084FI0808RAZ-BLITOYes3.84.2B04~B14(5mA)455-4752.513*084FD138R-BLNi/AuYes3.64.2B06~B16445-4702.512*104FI1210ZAZ-BLITO3.54B10~B18430-4802.512*124FD120-BLNi/Au3.43.8B01~B12(5mA)430-4802.512*124FI120-BLITO3.43.8B06~B16440-4752.513*134FI1313B-BLITO3.43.5B16~B22440-4752.513*134FI1313SB-BLITOYes3.43.5B18~B24455-4752.514*144FD140RC-BLNi/AuYes3.53.8B09~B18455-4752.514*144FI140RC-BLITOYes3.53.8B12~B22445-4702.517*144FI1714B-BLITO3.33.8B16~B22445-4702.517*144FI1714SB-BLITOYes3.33.8B16~B23445-4702.517*144FI1714RB-BLITOYes3.33.8B19~B26445-4702.517*144FI1714EB-BLITOYes3.33.8B19~B26445-4702.523*104FI2310SA-BLITOYes3.33.8B17~B25445-4702.523*104FI2310A-BLITO3.33.8B17~B25445-4702.523*84FI2308SA-BLITOYes3.33.8B17~B25500-5402.513*084FD138R-GRNi/AuYes3.64.2G12~G16500-5402.512*124FD120-GRNi/Au3.43.8G08~G12500-5402.512*124FI120-GRITO3.43.8G10~G21500-5402.514*144FD140RC-GRNi/AuYes3.53.8G12~G20500-5502.517*144FI1714RB-GRITOYes3.33.8G19~G29380-4202.512*124FD120-UVNi/Au3.53.80.5~3mW390-4202.513*134FD130-UVNi/Au3.53.80.5~3mW370-4152.513*134FI1313SB-UVITOYes3.440.5~5mWBlueGreenUVCode(IF=20mA)[mil]Vf[V]@20mAFORMOSAEPITAXYINCORPORATIONColorTypicalwavelengthBingradingDimensionDeviceTCLmaterialB/SReflectorPCSsubstrateForwardVoltagePDFcreatedwithpdfFactoryProtrialversion■Bluesmallchipgrading10mcd20mcd40mcdWavelengthB01B02B03B04B05B06B07B08B09B10B11B12B13B14B15440~442.50~1010~20442.5~4450~1010~2020~30445~447.50~1010~2020~3030~40447.5~4500~1010~2020~3030~4040~50450~452.50~1010~2020~3030~4040~5050~60452.5~4550~1010~2020~3030~4040~5050~6060~70455~457.50~1010~2020~3030~4040~5050~6060~7070~80457.5~4600~1010~2020~3030~4040~5050~6060~7070~8080~90460~462.50~1010~2020~3030~4040~5050~6060~7070~8080~9090~100462.5~4650~1010~2020~3030~4040~5050~6060~7070~8080~9090~100100~110465~467.50~1010~2020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120467.5~4700~1010~2020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130470~472.50~1010~2020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140472.5~4750~1010~2020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150475~477.510~2020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150150~160477.5~48020~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150150~160160~180WavelengthB16B17B18B19B20B21B22B23B24B25B26B27B28B29B30440~442.520~3030~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150150~160160~180442.5~44530~4040~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150150~160160~180180~200445~447.540~5050~6060~7070~8080~9090~100100~110110~120120~130130~140140~150150~16
本文标题:chips 生产流程
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