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1SPC统计制程管制StatisticalProcessControl48EC设计变更/工程变更EngineerChange2USL规格上限UpperSpecificationLimit49EC电子商务ElectronicCommerce3LSL规格下限LowerSpecificationLimit50EMC电磁相容ElectricMagneticCapability4UCL管制上限Uppercontrollimit51EOQ基本经济订购量EconomicOrderQuantity5LCL管制下限Lowercontrollimit52ERP企业资源规划EnterpriseResourcePlanning6PCL前置管制中心限Per-controlCentralLimit53FMS弹性制造系统FlexibleManufactureSystem7UPCL前置管制上限UpperPer-controlLimit54FQC成品质量管理FinishorFinalQualityControl8LPCL前置管制下限LowerPer-controlLimit55IPQC制程质量管理In-ProcessQualityControl9Ca 10Cp潜在过程能力指数Capability56IQC进料质量管理IncomingQualityControl11Pp12Ppk57ISO国际标准组织InternationalOrganizationforStandardization13CIP持续改进过程模式ContinuousImprovementProcessModel58ISAR首批样品认可InitialSampleApprovalRequest14ANOVA变异数分析AnalysisofVariance59JIT实时管理JustInTime15BSC平衡计分卡BalancedScoredoard60MES制造执行系统ManufacturingExecutionSystem16信赖区间Confidenceinterval61MO制令ManufactureOrder17管制图Controlchart62MPS主生产排程MasterProductionSchedule18CTQ品质关键Criticaltoquality63MRO请修(购)单MaintenanceRepairOperation19DPMO每百万个机会的缺点数Defectspermillionopportunities64MRP物料需求规划MaterialRequirementPlanning20DPM每百万单位的缺点数Defectspermillion65MRPII制造资源计划ManufacturingResourcePlanning21DPU单位缺点数Defectsperunit166NFCF更改预估量的通知NoticeforChangingForecast22DFSS六个希格玛设计Designforsixsigma67OEM委托代工OriginalEquipmentManufacture23DOE实验设计Designofexperiment68ODM委托设计与制造OriginalDesign&Manufacture24制造设计Designofmanufactring69OPT最佳生产技术OptimizedProductionTechnology25FMEA故障型态与效应分析Failuremodeandeffectanalysis70OQC出货质量管理Out-goingQualityControl26故障率Failurerate71PDCAPDCA管理循环Plan-Do-Check-Action27GageR&R量规重复能力与重制能力Gagerepeatability&reproducibility72PO订单PurchaseOrder28直方图Histogram73QA品质保证QualityAssurance29假设检定Hypothesistesting74QC质量管理QualityControl30KM知识管理KnowledgeManagement75QCC品管圈QualityControlCircle31MRP物料需求规划Materialrequireplanning76QE品质工程QualityEngineering32常态分配Normaldistribution77RMA退货验收ReturnedMaterialApproval33QFD品质机能展开Qualityfunctiondeployment78ROP再订购点Re-OrderPoint346σ六个希格玛SixSigma79SCM供应链管理SupplyChainManagement35σ,s标准差Standarddeviation80SFC现场控制ShopFloorControl36σ2,S2变异数Variance81SO订单SalesOrder37ABC作业制成本制度Activity-BasedCosting82SOR特殊订单需求SpecialOrderRequest38BTF计划生产BuildToForecast83TOC限制理论TheoryofConstraints39BTO订单生产BuildToOrder84TPM全面生产管理TotalProductionManagement40CPM要径法CriticalPathMethod85TQC全面质量管理TotalQualityControl41CPM每一百万个使用者会有几次抱怨ComplaintperMillion86TQM全面品质管理TotalQualityManagement42CRM客户关系管理CustomerRelationshipManagement87WIP在制品WorkInProcess43CRP产能需求规划CapacityRequirementsPlanning44CS顾客满意度CustomerSatisfaction45CTO客制化生产ConfigurationToOrder46DVT设计验证DesignVerificationTesting47DSS决策支持系统DecisionSupportSystem质量管理专业英语零件材料类的专有名词Holder:固定器,L铁CPU:centralprocessingunit(中央处理器)Connecter:连接器IC:Integratedcircuit(集成电路)Case:机箱,盖子MemoryIC:MemoryIntegratedcircuit(记忆集成电路)Cover:上盖RAM:RandomAccessMemory(随机存取存储器)Base:下盖DRAM:DynamicRandomAccessMemory(动态随机存取存储器)Bazel:面板(panel)SRAM:StaicRandomAccessMemory(静态随机存储器)Bracket:支架,铁片ROM:Read-onlyMemory(只读存储器)Lable:贴纸EPROM:ElectricalProgrammableRead-onlyMemory(电可抹只读存诸器)Guide:手册EEPROM:ElectricalErasbaleProgrammableRead-onlyMemory(电可抹可编程只读存储器)Manual:手册,指南CMOS:ComplementaryMetal-Oxide-Semiconductor(互补金属氧化物半导体)Card:网卡BIOS:BasicInputOutputSystem(基本输入输出系统)Switch:交换机Transistor:电晶体Hub:集线器LED:发光二极体Router:路由器Resistor:电阻Sample:样品Variator:可变电阻Gap:间隙Capacitor:电容Sponge:海绵Capacitorarray:排容Pallet:栈板Diode:二极体Foam:保利龙Transistor:三极体Fiber:光纤Transformer:变压器(ADP)Disk:磁盘片Oscillator:频率振荡器(0sc)PROG:程序Crystal:石英振荡器Barcode:条码XTAL/OSC:振荡产生器(X)System:系统Relay:延时器SystemBarcode:系统条码Sensor:感应器M/B:motherboard:主板Beadcore:磁珠CD-ROM:光驱Filter:滤波器FAN:风扇FlatCable:排线Cable:线材Inductor:电感Audio:音效Buzzer:蜂鸣器K/B:Keyboard(键盘)Socket:插座Mouse:鼠标Slot:插槽Risercard:转接卡Fuse:熔断器Cardreader:读卡器Current:电流表Screw:螺丝Solderiron:电烙铁Thermalpad:散热垫Magnifyingglass:放大镜Heatsink:散热片Caliper:游标卡尺Rubber:橡胶垫Driver:螺丝起子Rubberfoot:脚垫Oven:烤箱Bag:袋子TFT:液晶显示器Washer:垫圈Oscilloscope:示波器Sleeve:袖套Connector:连接器Config:机构PCB:printedcircuitboard(印刷电路板)Labelhi-pot:高压标签PCBA:printedcircuitboardassembly(电路板成品)Firmwarelabel:烧录标签PP:并行接口Metalcover:金属盖子HDD:硬盘Plasticcover:塑胶盖子FDD:软盘Tapeforpacking:包装带PSU:powersupplyunit(电源供应器)Barcode:条码SPEC:规格Tray:托盘Attach:附件Collecto:集线夹IDE:集成电路设备,智能磁盘设备Quantity:数量SCSI:小型计算机系统接口Validdate:有效日期Gasket:导电泡棉MIL-STD:Military-Standard军用标准AGP:加速图形接口MFG:Manufacturing制造PCI:周边组件扩展接口MIS:Managementinformationsystem资迅管理系统LAN:局域网DCC:documentcontrolcenter文件管制中心USB:通用串形总线架构厂内作业中的专有名词Slim:小型化QT:Qualitytarget品质目标COM:串型通讯端口QP:Qualitypolicy目标方针LPT:打印口,并行口QI:Qualityimprovement品质改善Powercord:电源线CRITICALDEFECT:严重缺点(CR)I/O:输入,输出MAJORDEFECT:主要缺点(MA)Speaker:扬声器MINORDEFECT:次要缺点(MI)EPE:泡棉MAX:Maximum最大值Carton:纸箱MIN:Minimum最小值Button:按键,按钮DIA:Diameter直径Footstand:脚架DIM:Dimension尺寸部门名称的专有名词LCL:Lowercontrollimit管制下限QS:Qualitysystem品质系统UCL:Uppercontrollimit管制上限CS:CoutomerSevice客户服务EMI:电磁干扰QC:Qualitycontrol品质管理ESD:静电防护IQC:Incomingqualitycontrol进料检验EPA:静电保护区域LQC:LineQualityControl生产线品质控制ECN:工程变更IPQC:Inprocessqualitycontrol制程检验ECO:Engineeringchangeorder工程改动要求(客户)FQC:Finalqualitycontrol最终检验ECR:工程变更需求单OQC:Outgoingqualitycontrol出货检验CPI:ContinuousProcessImproveme
本文标题:质量管理英语
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