封装流程的介绍

IC封装产品及制程简介产业概说电子构装(ElectronicPackaging)，也常被称为封装(Assembly)，是半导体产业中所谓的后段。它的目的在赋予集成电路组件组装的基础架构，使其能进一步与其载体(常是指印刷电路板）结合，以发挥原先设计的功能。构装技术的范围涵盖极广，它应用了物理、化学、材料、机械、电机、微电子等各领域的知识，也使用金属、陶瓷、高分子化合物等各式各样的高科技材料。在微电子产品功能与层次提升的追求中，开发构装技术的重要性不亚于IC制程中其它的微电子相关工程技术，故世界各主要电子工业国莫不戮力研究，以求得技术领先的地位。Contents1.IC封装的目的2.IC封装的形式3.IC封装应用的材料4.IC封装的基本制程与质量管理重点IC封裝的目的WhyneedtodoICpackaging防止湿气侵入以机械方式支持导线有效的将内部产生的热排出于外部提供持取加工的形体What’s“ICPackage“Package:把……包成一包ICPackage:把IC包成一包IC封裝的形式PINPTHICJ-TYPELEADSOJ、LCCGULL-WINGLEADSOP、QFPBALLBGABUMPINGF/CFundamentalLeadTypesofICPackageICPackageFamilyPTHIC：DIP──SIP、PDIP(CDIP)PGASMDIC:SOIC──SOP(TSOP-I、TSOP-II)、SOJLCC──PLCC/CLCCQFP──14×20/28×28、10×10/14×14(TQFP、MQFP、LQFP)Others──BGA、TCP、F/CSomethingaboutICPackageCategoryPTHIC：1960年代发表，至今在一些低价的电子组件上仍被广泛应用。DIP──美商快捷首先发表CDIP。由于成本技术的低廉，很快成为当时主要的封装形式；随后更衍生出PDIP、SIP等。PGA──美商IBM首先发表，仅应用于早期的高阶IC封装上，其GridArray的概念后来更进一步转换成为BGA的设计概念。SMDIC:1970年代美商德州仪器首先发表FlatPackage,是所有表面黏着组件的滥觞。由于SMD有太多优于PTH的地方，各家厂商进一步发展出各具特色的封装。至今，表面黏着仍是先进电子组件封装设计的最佳选择。QFP──业界常见的形式以14×20/28×28/10×10/14×14四种尺寸为主。LCC──Chipcarrier，区分为CLCC/PLCC及Leadless/Leaded等形式。SOIC──SmallOutlineIC；区分为SOP(TSOP-I、TSOP-II)、SOJ两种主流。TCP──TapeCarrierPackage;应用于LCDDriver。其锡铅凸块的设计后来进一步应用在F/C上。当前最先进的封装技术：BGA、F/C(晶圆级封装）構裝型態應用產品類型基本構裝形式應用實例同型構裝形式SIP(singleinlinepackage)PowertransistorPDIP(plasticIP)SRAM、ROM、EPROMEEPROM、Flash、MicrocontrollerCDIP(ceramicDIP)備註:大部分64腳以下零件是以DIP/SOP方式封裝，而大於44腳多是以LCC/QFP封裝DIP(dualin-linepackage)消費性電子PGA(pingridarray)MicroprocessorSOPLinear、Logic、DRAMSRAMTSOP、TSSOP、SSOP、Q(Quarter)SOP、M(Miniature)SOPSOIC(smalloutlineIC)記憶體SOJDRAM、SRAM、EPROM、EEPROM、FlashLCC(leaded/leadlesschipcarrier)可程式邏輯ICPLCC256KDRAM、ROM、SRAM、EPROM、EEPROM、Flash、MicrocontrollerCLCCQFP(quadflatpackage)邏輯ICASIC14*20QFP28*28QFPMicroprocessor10*10/14*14TQFP、LQFP、MetalQFP(MQUAD)M(Matrix)QFPOTHERS晶片組LCDBGATCPF/C備註：目前尚未發展通用規格品。ICPackageapplicationCategoryofICPackagePopularICpackagetypes:TSOP(ThinSmallOutlinePackage)QFP(QuadFlatPack)BGA(BallGridArray)CSP(ChipScalePackage)CategoryofICPackage--example1PBGAQFPTSOPSOP封裝應用的材料CopperLeadframeEpoxyAdhesiveTopMoldEncapsulateMoldCompoundDiePaddleDieBottomMoldGoldWireTSOPⅠTSOPⅡAlloy42LeadFrameNi42/Fe58TapeDieGoldWireEncapsulateMoldCompoundTopMoldBottomMoldTSOPGrossSectionView封裝原物料──金線與CompoundBallBond:Shape/PositionHeight:0.93milBallsize:3.04milBallaspectratio:0.30•SpecCriteria:2.6milBallsize5.2milGoldWire與BondingPad的關係AfterKOHetchingviewIntermetallicGoldWireFirstBondSectionView封裝原物料──LeadFrame與打線的關係ConventionalstructureSectionalViewICchipInnerLeadwirepaddleSignalN/CSignalSignalPowerPowerPowerPowerpaddleICchipTiebarTiebarSectionalViewSignalSignalSignalSignalBusbarBusbarwireICchipInnerLeadtapeICchiptapeSectionalViewSignalSignalSignalPowerwireICchipInnerLeadICchipSignalPowerPowerpaddleWireBonding與LeadFrame型態的演進Multi-frameLOCstructureTapeLOCstructureProcessFlowChart,Equipment&MaterialPROCESSEQUIPMENTMATERIALDIESAWDISCO651DIEATTACHHITACHICM200(LOC)HITACHILM400(LOC)WIREBONDSKWUTC-300K&S1488/8020/80281.0MILMOLDINGTOWAY-SERIESSHINETSUKMC-260NCAMARKINGGPM/E&RLASERPlatingMECOEPL-2400SSn/Pb85/15FORMING&SINGULATIONHAN-MI203FYAMADACU-951-1LEADSCAN/FVI/PACKRVSILS3900DB/5700WAFERBACKGRINDRINGSIBUYAMA-508SUNRISEJEDEC150DegCFLOWHITACHICHIMICALHM-122UHAN-MI101DEJUNKIC封裝的基本製程與管制重點ConventionalICPackagingProcessFlowIC封裝基本製造程序:以TSOP-IITapeLOC為例1.WaferProcess2.DieAttaching3.WireBonding4.Molding5.MarkingandLeadProcessTSOPProcessFlow&ControlProcessFlowMonitorItemSamplingSizeFrequencyControlWAFERIQC2NDVISUALINSPECTION2NDVIQCGATEWAFERMOUNTWAFERSAWUVIRRADIATIONlVISUALINSPECTIONlVISUALINSPECTIONlKERFWIDTHlDIWATERRESISITIVITYlCO2BUBBLERESISTIVITYlVISUALINSPECTION25DICE/5WAFERSl25DIE/2WAFERl6LINES/1WAFERl1READINGl1READING25DICE/PERWAFER(100%INSPECTION,IFREJECTBYQCGATE)PERLOTlPERLOTlMC/1X/SHIFTl2X/SHIFTl2X/SHIFTLOGLOGPERLOTLOGlVISUALINSPECTIONlVOIDlALLlALLlPERLOTlPERLOTLOGlVISUALINSPECTION45EA(LTPD=5%)PERLOTLOGlPARAMETERCHECK1READINGPERSHIFTLTCTSOPProcessFlow&Control-Cont.ProcessFlowMonitorItemSamplingSizeFrequencyControl3RDVISUALINSPECTION3RDVIGATELOCDIEBONDWIREBONDMOLDINGPMClVISUALINSPECTIONlMANUALTAPEPEELINGlVISUALINSPECTIONlWIREPULLlBALLSHEARlLOOPHEIGHTl1STRIP/1MAG.l2EAl3STRIP/1MAG.l10WIRESl10BALLSl10WIRESl1X/SHIFT/MCl1X/SHIFT/MCl1X/SHIFT/MCl1X/SHIFT/MCl1X/SHIFT/MCl1X/SHIFT/MC(ORCHANGEDEVICE/CAPILLARY)LOGlLOGlSPClLOGlLOGlVISUALINSPECTION3STRIPS/MAGAZINE(100%INSPECTION,IFREJECTBYQCGATE)PERMAGAZINELOGlVISUALINSPECTIONPERLOT20EA(AQL=0.25%)LOGlVISUALINSPECTIONlMOLDINGTEMPERATURElX-RAYMONITORl1STSHOT/CHASEl8POINT/CHASEl4SHOTlPERLOTl1X/SHIFT/MCl1X/SHIFT/MCLOGlTEMP.PROFILElOVENTEMP.l6POINTSl6POINTSl1TIME/MC/3MONTHlPERCYCLELOGTSOPProcessFlow&Control-Cont.ProcessFlowMonitorItemSamplingSizeFrequencyControlLASERMARKINGDEJUNK/TRIMLEADSCANFINALVISUALINSPECTIONFVIQCGATEPLATINGFORMING/SINGULATIONlVISUALINSPECTIONl1STRIPSDUMMYl3STRIPSl2STRIPSlPERLOTlPERLOTl4X/MC/SHIFTLOGlVISUALINSPECTIONl2TRIPSl4X/MC/SHIFTLOGlVISUALINSPECTIONlTHICKNESSlCOMPOSITIONlALLl10UNITSl10UNITSlPERLOTl4X/MC/SHIFTl4X/MC/SHIFTlLTClSPClSPClVISUALINSPECTIONlOUTLINEDI