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?1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(,221008):UASB,UASB,,:UASB;;;:X703:A:1004-695X(2003)03-0065-03StudyonCultivatingGranularSludgeinUASBReactorTUBao2hua,WANGJian2fang,ZHANGYan2qiu(CollegeofEnvironmentandSpatialInformatins,CUMT,Xuzhou,Jiangsu221008,China)Abstract:Inthepaper,itisanalyzedthecharacterofGranularSludgeinUASBReactor.ItisfurtherexplainedtheshapeprocessofgranularsludgebytheexperimentforcultivatinggranularsludgeinUASBwithbeerproductionwastewater.Theinfluencefactorsofgranularsludgecultivationisalsodiscussed.Keywords:UASBreactor;Granularsludge;Beerwastewater;Alkalinity1UASB,,,,,,,,,,,012014mm,,,,0.21.5mm,0.8mm,,CHN40%50%7%10%,PSNiFeZnCo,FeZnNi()31110.390.201mgg8.8%55%[1],VSSSS0.9:2003-02-26;:2003-04-08:(1970),,,,,,,,35mh,,,,,,[2]2UASBUASB20L,16L,,(VSSSS)0.7,8gL,COD14003500mg/L,(CODNP)2005126UASB5616320039?1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(mg?L-1)145025401350210015502350COD/%85.192.784.291.385.594.1/[kg?(m3?d)-1]1.43.73.74.54.69.2(VSS)/[kg?(kg?d)-1]0.170.420.470.520.570.62/[(m3?(m3?d)-1]0.51.11.11.21.53.6,,,,,,,:(130d),,,114kg(m3?d),,25hCOD85%,0.1kg(m3?d),317kg(m3?d),(),0.10.2mm,1.1m3(m3?d),(VSS)0142kg(kg?d)(3150d),,,4.5kg(m3?d),,,t(HRT)1011.5h,112m3(m3?d)(5175d),4.5kg(m3?d),,,9.2kg(m3?d),316m3(m3?d),33.1,,Letting,,,,,(VSS)6kgm33.2,,,2kg(m3?d),[3],,,,,,,,,,,,,,3.3,pH6.87.2,,pH,McCarty(CaCO3)20005000mgL,CaCO31000mgL,pH,UASB,CaCO3750mgL3.4UASBCNP,(CNP)1305l;(CNP)10005l3305l;,MgKSNiFeZnCoAbring(1993)66163.UASB20039?1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[][1],.UASB[M].:,2000[2],.[M].:,2000[3],,,.[J].,1999,19(4):20(50),4,,,,21[][1]LEEGoldberg.TheAdventofGreenComputerDesign[J].Com2puter,1998(9):16-19[2]WINMERBSeaver.DesignConsiderationsforRemanufacturability,RecyclabilityandReusabilityofUserInterfaceModules[J].IEEE,1994.241-245[3]DIRKBoghe.ElectronicScrap:AGrowingResource[J].PreciousMetals,2001(7):21-24[4]ARENSMANRuss.ReadyforRecycling[J].ElectronicBusiness,1997,26(12):108-115[5]ONORATODanielle.JapaneseRecyclingLawTakesEffect[J].WasteAge,2001,32(6):25-26[6]JURGENErtel.CurrentTechnologiesfortheValorisationofPCBsandElectronicWaste[J].IEEE,1994.279-282[7]NOURREDDINEMenad,BOBjorkman,SHUNLIZhang,etal.ThermodynamicConditionsfortheFormationofDioxinDuringtheRecyclingofNonFerrousMetalsfromElectricandElectronicScrap[J].EPDCongress,1998.657-673[8]LEGARTHJensBrobech,ALTINGLeo,BALDOGianLuca.Sustain2abilityIssuesinCircuitBoardRecycling[J].IEEE,1995.126-131[9]REIMERB,SODHIMS,KNIGHTWA.OptimizingElectronicsEnd-of-lifeDisposalCosts[J].IEEE,2000.342-347[10]JOHNCBullock.EnvironmentallySoundManagementofElectronicScrapandtheBaselConventiononControlofTransboundaryMove2mentsofHazardousWastesandTheirDisposal[J].IEEE,1995.192-197[11]WINTERDe,COURTNEYK.FromHeretoEternity:RecyclingHi-techJunk[J].WasteAge,2001,32(3):186-190[12]WINKAMichael,CAPPENTERJoeeph.NewJerseyDepartmentofEnvironmentalProtectionUnionCountyDemanufacturingProgram[J].IEEE,1998.328-330[13]RecyclingElectronics[J].Environment,2000,42(8):6-7[14]ZHANGShunli,FORSSBERGEric,MENADNourredine,etal.MetalsRecyclingfromElectronicScrapbyAirTableSeparation-TheoryandApplication[A].TheTMSAnnualMeeting[C].EPDCongress1998,SanAntonio,USA:1998.16-19[15]ZHANGShunli.MechanicalRecyclingofElectronicsScrap[J].WasteManagementandResearch,1998(16):119-128[16]ZHANGShunli,ForssbergEric,ArvidsonBo,etal.AluminumRecoveryfromElectronicScrapbyHigh-ForceEddyCurrentSepara2tion[J].Resources,ConservationandRecycling,1998(23):225-241[17]KROWINKELJM,DALMIJNWL.ProcessingofTelevisionsbyMechanicalSeparationTechniques[D].4thInternationalSymposiumonRecyclingofMetalsandEngineeredMaterials,2000.47-59[18]FROHLICHG,KRAMERU.ConfigurationofaDismantlingandProcessingPlantfortheRecyclingofElectricalEquipmentandElec2tronicScrap[J].ProceedingoftheXXIMPC,Sep21-26,1997.253-260[19]STENNETTAD,WHALLEYDC.NovelReworkTechniquesforElectronicAssemblies[J].IEEE,1998.196-201[20]HARALDZebedin,KONRADDaichendt,PETERKopacek.ANewStrategyforaFlexibleSemi2automaticDisassemblingCellofPrintedCircuitBoards[J].IEEE,2001.1742-1746[21]EIICHIHirasawa.ARecyclingPlantforHomeElectricAppliances[J].MitsubishiElectricAdvance,1999(9):7-11[22]EDGrenchus,ROBERTKeene,CHARLESNobs.DemanufacturingofInformationTechnologyEquipment[J].IEEE,1997.157-160[23]RENEEStDENIS,STEVESkurnac.InformationTechnologyProductRecyclinganOemrecyclerCollaboration[J].IEEE,1998.144-146[24]KOZLOWSKIJ,MAZURCKT,CZYZYKH.TheRecoveringMet2alsandAlloysfromtheElectronicScrap[J].Metall,2000,54(11):645-649[25]ZHANGShunli,ERICForssberg.IntelligentLiberationandClassifica2tionElectronicScrap[J].PowderTechnology,1999(105):295-301[26]YAKOYAMAS,IJIM.RecyclingofThermosettingPlasticWastefromElectronicComponentsProductionProcess[J].IEEE,1995.132-13776163.UASB20039
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