UASB反应器中颗粒污泥的培养涂保华

UASB,,(中国矿业大学环测学院,江苏徐州　221008)　:UASB,UASB,,。:UASB;;;:X703　　　:A　　　:1004-695X(2003)03-0065-03StudyonCultivatingGranularSludgeinUASBReactorTUBao-hua,WANGJian-fang,ZHANGYan-qiu(CollegeofEnvironmentandSpatialInformatins,CUMT,Xuzhou,Jiangsu221008,China)Abstract:Inthepaper,itisanalyzedthecharacterofGranularSludgeinUASBReactor.ItisfurtherexplainedtheshapeprocessofgranularsludgebytheexperimentforcultivatinggranularsludgeinUASBwithbeerproductionwastewater.Theinfluencefactorsofgranularsludgecultivationisalsodiscussed.Keywords:UASBreactor;Granularsludge;Beerwastewater;Alkalinity1　UASB,,,,。,,。,。,,、、。,,0.2～0.4mm,,,,0.2～1.5mm,0.8mm。、。,、,。C、H、N40%～50%、7%、10%,P、S、Ni、Fe、Zn、Co,Fe、ZnNi()3.11、0.390.201mgg。8.8%～55%[1],。VSSSS0.9。:2003-02-26;:2003-04-08:(1970—),,,,,。,,,35mh。。,,,,,,[2]。2　UASB。UASB20L,16L,,ρ(VSSSS)0.7,8gL。,COD1400～3500mg/L,ρ(COD∶N∶P)200∶5∶1。26℃。UASB6516　320039,、。1。1　　/d1～3031～5051～75/h25～13.411.5～10.09.5～5.4COD/(mg·L-1)1450～25401350～21001550～2350COD/%85.1～92.784.2～91.385.5～94.1/[kg·(m3·d)-1]1.4～3.73.7～4.54.6～9.2(VSS)/[kg·(kg·d)-1]0.17～0.420.47～0.520.57～0.62/[(m3·(m3·d)-1]0.5～1.11.1～1.21.5～3.6,,,,,,,。:(1～30d),。,,1.4kg(m3·d),,25h。COD85%,0.1kg(m3·d),。3.7kg(m3·d),(),0.1～0.2mm,。1.1m3(m3·d),(VSS)0.42kg(kg·d)。(31～50d),,,4.5kg(m3·d),,,。t(HRT)10～11.5h,1.2m3(m3·d)。(51～75d),4.5kg(m3·d),,,。9.2kg(m3·d),3.6m3(m3·d),。3　3.1　接种污泥的影响,。,、、、。Letting,,。。,,,(VSS)6kgm3。3.2　负荷的影响,,,2kg(m3·d)。,[3],,。,,。,,,,,。,,,。,,。3.3　碱度的影响,pH6.8～7.2,,pH,。McCarty(CaCO3)2000～5000mgL,CaCO31000mgL,pH。,UASB,CaCO3750mgL。3.4　营养物质的影响UASB、、。C、N、P。,ρ(C∶N∶P)130∶5∶l;ρ(C∶N∶P)1000∶5∶l～330∶5∶l;,。Mg、K、S、Ni、Fe、Zn、Co。Abring(1993)6616　3.UASB20039K+Mg2+。Mg2+。Mg2+12mgL0,,,Mg2+12mgL7202400mgL,。,。,,,。,,。[][1]　,.UASB[M].:,2000[2]　,.[M].:,2000[3]　,　,,.[J].,1999,19(4):20(上接第50页),。4　　,,。,,21。[][1]　LEEGoldberg.TheAdventof“Green”ComputerDesign[J].Com-puter,1998(9):16-19[2]　WINMERBSeaver.DesignConsiderationsforRemanufacturability,RecyclabilityandReusabilityofUserInterfaceModules[J].IEEE,1994.241-245[3]　DIRKBoghe.ElectronicScrap:AGrowingResource[J].PreciousMetals,2001(7):21-24[4]　ARENSMANRuss.ReadyforRecycling[J].ElectronicBusiness,1997,26(12):108-115[5]　ONORATODanielle.JapaneseRecyclingLawTakesEffect[J].WasteAge,2001,32(6):25-26[6]　JURGENErtel.CurrentTechnologiesfortheValorisationofPCB′sandElectronicWaste[J].IEEE,1994.279-282[7]　NOURREDDINEMenad,BOBjorkman,SHUNLIZhang,etal.ThermodynamicConditionsfortheFormationofDioxinDuringtheRecyclingofNonFerrousMetalsfromElectricandElectronicScrap[J].EPDCongress,1998.657-673[8]　LEGARTHJensBrobech,ALTINGLeo,BALDOGianLuca.Sustain-abilityIssuesinCircuitBoardRecycling[J].IEEE,1995.126-131[9]　REIMERB,SODHIMS,KNIGHTWA.OptimizingElectronicsEnd-of-lifeDisposalCosts[J].IEEE,2000.342-347[10]　JOHNCBullock.EnvironmentallySoundManagementofElectronicScrapandtheBaselConventiononControlofTransboundaryMove-mentsofHazardousWastesandTheirDisposal[J].IEEE,1995.192-197[11]　WINTERDe,COURTNEYK.FromHeretoEternity:RecyclingHi-techJunk[J].WasteAge,2001,32(3):186-190[12]　WINKAMichael,CAPPENTERJoeeph.NewJerseyDepartmentofEnvironmentalProtectionUnionCountyDemanufacturingProgram[J].IEEE,1998.328-330[13]　RecyclingElectronics[J].Environment,2000,42(8):6-7[14]　ZHANGShunli,FORSSBERGEric,MENADNourredine,etal.MetalsRecyclingfromElectronicScrapbyAirTableSeparation-TheoryandApplication[A].TheTMSAnnualMeeting[C].EPDCongress1998,SanAntonio,USA:1998.16-19[15]　ZHANGShunli.MechanicalRecyclingofElectronicsScrap[J].WasteManagementandResearch,1998(16):119-128[16]　ZHANGShunli,ForssbergEric,ArvidsonBo,etal.AluminumRecoveryfromElectronicScrapbyHigh-ForceEddyCurrentSepara-tion[J].Resources,ConservationandRecycling,1998(23):225-241[17]　KROWINKELJM,DALMIJNWL.ProcessingofTelevisionsbyMechanicalSeparationTechniques[D].4thInternationalSymposiumonRecyclingofMetalsandEngineeredMaterials,2000.47-59[18]　FROHLICHG,KRAMERU.ConfigurationofaDismantlingandProcessingPlantfortheRecyclingofElectricalEquipmentandElec-tronicScrap[J].ProceedingoftheXXIMPC,Sep21-26,1997.253-260[19]　STENNETTAD,WHALLEYDC.NovelReworkTechniquesforElectronicAssemblies[J].IEEE,1998.196-201[20]　HARALDZebedin,KONRADDaichendt,PETERKopacek.ANewStrategyforaFlexibleSemi-automaticDisassemblingCellofPrintedCircuitBoards[J].IEEE,2001.1742-1746[21]　EIICHIHirasawa.ARecyclingPlantforHomeElectricAppliances[J].MitsubishiElectricAdvance,1999(9):7-11[22]　EDGrenchus,ROBERTKeene,CHARLESNobs.DemanufacturingofInformationTechnologyEquipment[J].IEEE,1997.157-160[23]　RENEEStDENIS,STEVESkurnac.InformationTechnologyProductRecyclinganOemrecyclerCollaboration[J].IEEE,1998.144-146[24]　KOZLOWSKIJ,MAZURCKT,CZYZYKH.TheRecoveringMet-alsandAlloysfromtheElectronicScrap[J].Metall,2000,54(11):645-649[25]　ZHANGShunli,ERICForssberg.IntelligentLiberationandClassifica-tionElectronicScrap[J].PowderTechnology,1999(105):295-301[26]　YAKOYAMAS,IJIM.RecyclingofThermosettingPlasticWastefromElectronicComponentsProductionProcess[J].IEEE,1995.132-1376716　3.UASB20039