ASUS-FS-SMT-stencil-rule--(附修改历程)

1華碩電腦(股)公司FSSMT鋼板基本規範編號:日期:03.09.16版本:REV.1.0內文頁數:27頁等級:核准審核擬案2目錄一共通遵守規範1.1基本遵守條例………………………………………………………………………31.2檢附報告條例………………………………………………………………………5二.Chip類零件開孔規範2.010402Chip零件基本規範………………………………………………….………….72.020603LChip零件基本規範………………………….……………………..…………..82.030603CChip零件基本規範………………………….……………………..…………..92.040603RChip零件基本規範………………………….………………...…….….…….102.050805LChip零件基本規範……………………..……………………..………………112.060805CChip零件基本規範……………………..…………………….………………122.070805RChip零件基本規範……………………..…………………….………………132.081206CChip零件基本規範……………………..…………………….………………142.091206RChip零件基本規範…….…………………………………….………....…….152.10C164類零件基本規範………………………………………………………...…..….162.11C731類零件基本規範……………………………………………………………..….172.12C421類零件基本規範……………………………………………………………..….182.13C440類零件基本規範……………………………………………………………..….192.14C604類零件基本規範……………………………………………………………..….20三.功率晶体及電晶體類開孔規範3.01X102類零件基本規範……………………………………………………………..….213.02X402類零件基本規範……………………………………………………………..….223.03PS001類零件基本規範…………………………………………………......……..….233.04PS003類零件基本規範…………………………………………….…….………..….243.05PS015類零件基本規範…………………………………………….……..………..….253.06D501零件基本規範………………………………………………….………..………263.07三极管零件基本規範…..…………………………………………………….…..…273.08L801類零件基本規範…….………………………………………….………….…….283.09TH類零件基本規範…….……………………………………….…….………..……..29四.排阻,排容,排感類零件開孔規範4.01RB(4PIN)零件基本規範…..……………………………………………..………..….304.028PIN排容基本規範…………………..……..……………………………………..…314.038PIN排感零件基本規範…..………………………………………...……….…..….324.048PIN排阻零件基本規範…..…………………………………………...…….…..….334.0512PIN排容零件基本規範…..……………………………………….……….…..….3434.0616PIN排阻零件基本規…………………….…………………………..…….…..….354.0716PIN排阻零件基規範………………….………………………..….………..…….36五.IC類零件開孔規範5.010.5PITHQFP類零件基規範……………………………………….………..……….375.020.5PITHIC零件基規範……………………………………………………………….385.030.65PITHIC零件基規範……………………………………………….….……....….395.040.8PITHIC類零件基本規範…….…………………………………………………..405.050.8PITHIC類零件基本規範……………………………………….….….………..…415.061.25PITHIC零件基規範…………………………….……………..……………......425.071.27PITHIC零件基規範……………………………….…………………...….…....43六.CN類零件開孔規範6.010.5PITHCN零件基規範……………………………………..……….………..…....446.021.0PITHCN零件基規範…………………………………...………..……………....456.031.0PITHCN類零件基本規範…………………………….………….….………..…46七.BGA類零件開孔規範7.01BGA(IC607)零件基規範…………………….……………………..……………......477.02BGA(IC104)零件基規範…………………….……………………………...….…....487.03BGA(IC202&IC303)零件基規範……………….…………………….………..…....497.04BGA(IC102&IC103)零件基規範…………………..………………..……………....504基本遵守條例項次遵守條例適用條件/製作方式1.Fiducial的制作方式:激光燒刻鋼板厚度:0.15mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素備註鋼板Wp5項次遵守條例適用條件/製作方式1.1鋼板張力：.1.新的鋼板其張力須≧35N/cm.2.鋼板張力≦30N/cm須更換.3.量測位置於鋼板開孔的四周角落,中央位置及開孔密集處鋼板厚度:0.15mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素備註鋼板鋁框張力量測點張力計印刷面鋼片6項次鋼板需檢附報告內容如下適用條件/製作方式21.鋼板厚度2鋼板開孔位置精準度3.五點張力量測值4.開孔尺寸量測以每一種零件抽驗一顆。5.設計後GERBERFILE陽片鋼板厚度:0.15mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素備註7項次0402Chip基本規範適用條件/製作方式3PCBPADLayoutWp1=18mil,Wp2=10mil,Lp1=14mil,Lp2=4mil,Dp=22milWs1=Wp1Ws2=10milLs=Lp1+8milDs=Dp-10mil鋼板厚度:6mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)適用客戶別SONYPCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.Ws1LsDsWs2Wp2Wp1DpLp1Lp28項次0603(L)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=30mil,Lp=20mil,Dp=30milWs1=Wp+10milWs2=12milLs1=Lp+2milLs2=12milDs=Dp+4mil鋼板厚度:6mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)適用客戶別SONYPCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.DpWpLpLs1Ls2DsWs1Ws29項次0603(C)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=30mil,Lp=20mil,Dp=30milWs1=Wp+10milWs2=12milLs1=Lp+2milLs2=12milDs=Dp+4mil鋼板厚度:6mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)適用客戶別SONYPCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.DpWpLpLs1Ls2DsWs1Ws210項次0603(R)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=30mil,Lp=20mil,Dp=32milWs=Wp-2milLs=Lp+6milDs=Dp鋼板厚度:6mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)適用客戶別SONYPCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.WsLsDsWpLpDP11項次0805(L)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=46mil,Lp=22mil,Dp=44milWs1=Wp+8milWs2=16milLs1=Lp+2mil,Ls2=12milDs=Dp+4mil鋼板厚度:0.15mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)備註PCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.DpWpLpLs1Ls2DsWs1Ws212項次0805(C)Chip基本規範適用條件/製作方式2PCBPADLayoutWp=46mil,Lp=22mil,Dp=44milWs1=Wp+8milWs2=16milLs1=Lp+2mil,Ls2=12milDs=Dp+4mil鋼板厚度:0.15mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)備註PCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.DpWpLpLs1DsWs1Ws213項次0805(R)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=46mil,Lp=22mil,Dp=32milWs=Wp-2milLs=Lp+6milDs=Dp-4mil鋼板厚度:6mil錫膏錫球尺寸規格:TypeIV製作方式:LaserCut適用產品別PS2考量因素(鋼板的修改歷程)適用客戶別SONYPCBLayoutStencilApertureSolderPasteonPad1.2003/5/31:將所有Chip零件外擴4mil2.2003/6/16:部分Chip零件內縮2mil,同時所有Chip與Chip之間的間隙須保持在10mil以上.WsLsDsWpLpDP14項次1206(C)Chip基本規範適用條件/製作方式3PCBPADLayoutWp=60mil,Lp=30mil,Dp=76mi