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当前位置:首页 > 商业/管理/HR > 营销创新 > 面向瓶颈的半导体晶圆制造系统派工策略及参数优化
41820078JOURNALOFSHANGHAIJIAOTONGUNIVERSITYVol.41No.8Aug.2007:2006209230:(50475027);(20040248052);863(2006AA04Z128):(19792),,,,.(),,,,(Tel.):021234206065;E2mail:zbjiang@mail.sjtu.edu.cn.:100622467(2007)0821252206,,(,200240):,.,.,,4.:;;;:TP391.9:ATheBottleneck2OrientedDispatchingStrategyandParameterOptimizationinSemiconductorWaferFabricationSystemZHANGHuai,JIANGZhi2bin,GUOCheng2tao(Dept.ofIndustrialEng.&Management,ShanghaiJiaotongUniv.,Shanghai200240,China)Abstract:Accordingtothecharacteristicsofdynamicbottleneckinsemiconductorwaferfabricationsystem(SWFS),adynamicbottleneckreal2timedispatching(DBRD)strategywasproposed.TheDBRDmakesdecisionaccordingtothereal2timeinformation,andthedecisionparametersaredeterminedandoptimizedbyusingresponsesurfacemethodanddesirabilityfunctionapproach.ThesimulationresultsprovethattheproposedDBRDstrategyissuperiortoothertwostrategiesonthemeanandvarianceofcycletime,workinprocessandthroughput.Keywords:dispatchingstrategy;responsesurfacemethod(RSM);desirabilityfunction;semiconductorwaferfabricationsystem(SWFS)4,.,[1].2080,Uzsoy[1]:.Wein[2].,[3]..,.,,.,,,Glassey[4](StarvationAvoid2ance,SA),Wein[2](WorkloadRegulation,WR),.,Nakata[5]JUS2TICE/MORAL.,,,.,(DynamicBottleneckReal2timeDispatching,DBRD),,,.1,.,,,.:f=(x1,x2,,xp,z1,z2,,zq)=f(X,Z)(1):X=(x1,x2,,xp);Z=(z1,z2,,zq);f(X,Z),,f(X,Z).,,,.,maxE[f(X,Z)|X]s.t.XA(2),AX.(RSM),.RSM:1,2.,,,.,y=0+1x1+2x2++kxk(3)y=0+kj=1jxj+kj=1ikijxixj(4):x;y;.,,,.2,,;,,,.,,.:,;.,,.,,.,DBRD,1.,:hotlotHotlot_Flag,hotlot,True,hotlot;Um,,;M_Sta2tus,,True();(QueueLength,QL)f1f2,,f1WPHf2WPH3:QLf1WPH,;f1WPHQLf2WPH,;QLf2WPH,.DBRD:CR(),SPT(),SPNB(35218,:1Fig.1Schemaofdynamicbottleneckreal2timedispatchingalgorithm)FIFO().,4Set1Set4,.,hotlot,2Set2.,(1),..5,Hotlot_FlagM_Status.Umf1f2,,.,3,3,DBRD,.33.1DBRDDBRD,SWFS.SWFS30000,6,3;25;Determine,1.[6]2SWFS,SWFS10,72323.S()M()B()P()W()5.CTVar_CTWIPTP.1a,3,.1Tab.1Theinformationofproductsandflow/h/(-1)/(d-1)Prod.1Tech.1279317.449000300Prod.24500150Prod.3Tech.2263337.966000200Prod.44500150Prod.5Tech.3241362.06150050Prod.645001502SWFSTab.2ResourcesofthevirtualSWFSSMBPWWS111DIF13441550PHOTO5162743ETCH1247221079CVD10185270PVD1510219141CMP82020IMP57310WAT155QC24472132955027193233.2,.,Box2Wilsoncentralcompositedesign(CCD,)Box2Behnkendesign,.CCD,2k(k)nc.,[7],=[2k]14(5).,,452141.22CCD[7].22CCDFig.2GenerationofacentralcompositedesignfortwofactorsDBRDUmf1f23.k3,(5)1.682.,3:Um=85%,f1=4,f2=8.:Um=(75%,95%),f1=(3,5),f2=(7,9).CCD20.,668.DesignExpert,3.4CT.,F=5.43,P0.05.,Var_CTWIPTP3,.3Tab.3TheCentralcompositedesignandexperimentalresultsUm/%f1f2CT/hVar_CTWIP/TP/185.004.008.00480.8264.619687.51023.8295.005.007.00504.5364.020071.3978.8395.003.007.00502.1447.020418.8982.5485.004.006.32487.7395.019271.3988.8568.184.008.00493.4327.619611.3956.3685.004.009.68487.7395.019271.3988.8785.004.008.00480.8264.619687.51023.8885.004.008.00480.8264.619687.51023.89101.824.008.00519.3325.220861.3967.51075.005.007.00474.0212.819488.8967.51185.004.008.00480.8264.619687.51023.81295.003.009.00507.2379.320340.0955.01385.002.328.00502.3403.920161.3982.51485.005.688.00493.4327.619611.3956.31575.003.009.00471.6205.118948.81006.31695.005.009.00502.3403.920161.3982.51785.004.008.00480.8264.619687.51023.81875.005.009.00477.3162.619638.81027.51975.003.007.00465.8173.218923.8993.82085.004.008.00480.8264.619687.51023.84CTTab.4AnalysisofvarianceforCTFP3040.159337.795.430.0071622.211062.22622.215124.440.0050.003662.3619:CT=784.88566-9.01019Um-4.03610f1+7.76534f2-0.20437Umf1-0.076875Umf2-1.23125f1f2+0.068793Um2+3.87413f12+0.28557f22(6)Var_CT=-132.57676+6.12486Um-13.88466f1-3.37559f2(7)WIP=11993.54970-159.80480Um+1116.13032f1+2583.27846f2-22.26500Umf1-2.04750Umf2+36.72500f1f2+1.82272Um2+58.52866f12-158.90667f22(8)TP=-1483.54778+38.92805Um+14.86581f1+209.05019f2+0.36125Umf1-1.20375Umf2+55218,:9.83750f1f2-0.18418Um2-15.76615f12-8.90722f22(9)3f2=8.00CT.3CTFig.3ContourforCT3.3,Harrington[8].0-1,,,.,.,Derringer[9]:,di(Y^i)=0Y^i()LiY^i()-LiTi-LisLiY^i()Ti1.0Y^i()Ti(10),di(Y^i)=1.0Y^i()TiY^i()-UiTi-UisTiY^i()Ui0Y^i()Ui(11),di(Y^i)=0Y^i()LiY^i()-LiTi-LisLiY^i()TiY^i()-UiTi-UisTiY^i()Ui0Y^i()Ui(12):di(Y^i)i;Y^ii;Lii;Uii;Tii;stTi.s=t=1,;s1t1,;s1t1,.,D=(d1(Y1)d2(Y2)dk(Yk))1k(13),k..4,CTVar_CTWIP,TP.(10)(11)(13),5.0.792,,DBRD:Um=75.07%,f1=3.96,f2=9.00.5Tab.5TotaldesirabilitymutiplesolutionsUm/%f1f2CT/hVar_CTWIP/TP/175.073.969.00477.388241.82719291.71017.160.792275.173.969.00477.370242.44819292.11017.330.792375.093.949.00477.382242.18419287.81017.090.792475.263.979.00477.356242.94619294.11017.530.791575.223.999.00477.371242.34719300.21017.610.791675.463.989.00477.332243.93519299.21017.960.791775.544.019.00477.331244.10219306.01018.230.791875.004.069.00477.462240.04719315.31017.420.791975.383.998.94477.209243.53219318.81018.030.7901075.004.629.00479.232232.29719474.21013.910.7576521413.4DBRD,.CR+FIFO,CR,CRFIFO;NakataMatsuiJUSTICE/MORAL,,,2d,3d.,,(Lot2SpeedMatrix).3,CTVar_CTWIPTP4.6,JUSTICE/MORALCR+FIFO,DBRD,.63Tab.6PerformancecomparisonamongthreedispatchingstrategiesDBRDJUCSTICE/MORA
本文标题:面向瓶颈的半导体晶圆制造系统派工策略及参数优化
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