PCB生产过程中产生变形的原因及改善-刘海龙

-11-ShortComment&Introduction2012No.7ResearchonreducingtwistduringPCBmanufacturingprocessLIUHai-longAbstractPrintedcircuitsboardassemblyfactoriesneedmorestrictcontrolonPCBflatnessbecauseofthecomingstageofSMTandBGApackagingtechnology.TheauthorstudyonthekeyprocesssuchaslaminationandsoldermaskonPCBmanufacturingtofinduptherootcauseandmethodtoreducingtwistonPCBproducts.Keywordstwist;laminationPCBIPCPCB0.75%PCB1.5%0.5%0.3%PCBPCBPCBPCBPCBSummarization&Comment2012No.7-12-ShortComment&IntroductionPCBCTECTE1710-6FR-4TgZCTE50~7010-6Tg250~35010-6XCTEPCBCTECTEACTE1.510-5/BCTE2.510-5/1000mm1FR-490TgCTE30180LA(180~30)1.510-5m/1000mm2.25mmLB=180~302.510-5m/1000mm3.75mm2A180302.25mmB3.75mm2.25mmAB3.75mmA2.25mmB2PCBCTEPCBPCBCTECTEPCBSummarization&Comment-13-ShortComment&Introduction2012No.7PCBPCBPCB150TgTgTg225~2653s~6s280~300PCB2.0mmPCB1TgTgCTETg150TgTg22TgPCB3TgS11411404.40%MTC971404.80%S10001503.40%IT1581502.76%S1000-21702.20%EM8271703.80%9.90%1322015.28%1243931.40%Summarization&Comment2012No.7-14-ShortComment&IntroductionGTTgCTEPCBCTE42.0mmPCB150TgTg30sPCBPCB100%PCB140~150TgTgTg51#2#3#4#5#6#3.153.82.82.92.34.02.352.351.02.252.42.65PCBPCBPCB[1].[M].,2004,2.PCB//kg/min/%8mm/222.641566.673066.674552.38604.76900.008mm/10mm/131.71542.863028.574519.05604.76900.00PCISummarization&Comment