PCB-production-process-Single-sided-board

RESPECTdeservesintelligencePCBproductionprocessintroductionCopyrightDiehlControlsCo.,LtdPCBProductionProcessIntroductionPCBproductionprocessintroduction1PCBcategoryPCBCategorySingle-SidedboardDouble-Sidedboard-STH(SilverThroughHole)board-CTH(CarbonThroughHole)board-PTH(PlatingThroughHole)boardMultilayerboard-4L/6L/8L/10L/12LHDI(HighDensityInterconnector)boardPCBproductionprocessintroduction2Single-sidedboardSingle-sidedboardPCBproductionprocessintroduction3Single-sidedboardDefinitionCircuitryisexistingonlyinoneside.SoldersideComponentsidePCBproductionprocessintroduction4Single-sidedboardNormalprocess1.CCLcutting2.PatternPrinting4.SolderMaskPrinting3.Etching&InkStripping5.LegendPrinting(C)6.LegendPrinting(S)7.InsulationLayerPrinting8.CarbonPrinting9.InsulationLayerPrinting11.P/GDrilling10.HASL12.Punching13.V-cut14.Rinsing15.Holesinspection16Open/ShortInspection18.Bow/TwistInspection19.VisualInspection17.OSP20.PackagingPCBproductionprocessintroduction5Single-sidedboard1.CCL(CopperCladLaminate)cuttingProcessFunction:CCLisverybig,thisprocessistocutCCLtoworkingpanelsProcess1.1,1.2,1.3aredonebyseparatemachine.Rawmaterialinput:LaminateCCL(CopperCladLaminate)type:ResinbasedCCLMetalbasedCCL*Seedetaileddescriptioninnextslide.CCLWorkingpanel1.1CCLcutting1.2Edgegrinding1.3ChamferingAftercuttingAfteredgegrindingandchamferingEdgegrindingmachineChamferingmachinePCBproductionprocessintroduction6Single-sidedboardCCL(CopperCladLaminate)introductionMainResinbasedCCL:FR-1,FR2PrepregismadeofPhenolicResin,CellulosePaperCEM-1PrepregismadeofWovenGlassFabric,CellulosePaperCEM-3PrepregismadeofWovenGlassFabric,GlassFeltFR-4PrepregismadeofWovenGlassFabric,EpoxyResinMainMetalbasedCCL:AluminiumbasedCCLmadeofEpoxyResin,CellulosePaperorWovenGlassFabric,AluminiumCopperFoil(onesideortwosides)PrepregPCBproductionprocessintroduction7Single-sidedboard2.PatternPrintingProcessFunction:TransferthecircuitryontheCCL.2.2RemovecontaminationandoxideonCCLsurface.2.3MakeCCLsurfacecoarsetoeasilyabsorbinkinprintingprocess2.4Afterbrushing,CCLneedstobewashedanddried.2.5Drytheboardbyheating2.6Turnovertheboardtomaketheprintingsideontop,atthesametimecooltheboardnaturally2.7Fixtheboardpositionforprinting2.8Usescreenprintingtechnologytoprintinkontheboard2.9Afterprinting,useUVlighttodrytheink.2.1Loadingboard2.2Rinsingbywater2.3SurfaceBrushing2.4Blowing2.5Curing2.6Turnovertheboard2.7Positionfix2.8Patternprinting2.9CuringbyUVlightPCBproductionprocessintroduction8Single-sidedboard3.Etching&InkStrippingProcessFunction:Removeunwantedcopperwhichisnotprotectedbyink,andthenremovetheinkonthecircuitry.3.2Etchthecopperwherenotcoveredbyink3.3Afteretching,inkleftonthecopperneedstobestripped.3.2Etching3.3InkStrippingBeforeetchingcopperAfteretchingcopperAftercleaninginkCopperInkPrepreg3.4RinsingbyAcid3.1LoadingboardPCBproductionprocessintroduction9Single-sidedboard4.S/M(SolderMask)PrintingProcessFunction:MakeamaskonPCBsurfacetoprotectPCBfromcontaminationandfromoxidizing.4.2&4.3RemovecontaminationandoxideonPCBsurface.4.4MakePCBsurfacecoarsetoeasilyabsorbinkinprintingprocess4.5Afterbrushing,PCBneedstobewashedanddried.4.6Drytheboardbyheating4.7Turnovertheboardtomaketheprintingsideontop,atthesametimecooltheboardnaturally4.8Usescreenprintingtechnologytoprintinkontheboard4.9Afterprinting,useUVlighttodrytheink.*S/Mprintingwillnotcoversolderingpad.4.2RinsingbyAcid4.3RinsingbyWater4.4SurfaceBrushing4.5Blowing4.6Curing4.7Turnovertheboard4.8SolderMaskPrinting4.9CuringbyUV4.1LoadingboardPCBproductionprocessintroduction10Single-sidedboard5.LegendPrinting(Componentside)ProcessFunction:PrintlegendonPCBcomponentside.5.2Usecoldairtoblowtheboard5.3Drytheboardbyheating5.4Turnovertheboardtomaketheprintingsideontop,atthesametimecooltheboardnaturally5.5Fixtheboardpositionforprinting5.6Usescreenprintingtechnologytoprintinkontheboard5.7Afterprinting,useUVlighttodrytheink.5.1Loadingboard5.2Blowing5.3Curing5.4Turnovertheboard5.5Positionfix5.6Legendprinting5.7CuringbyUVlightPCBproductionprocessintroduction11Single-sidedboard6.Legendprinting(Solderside)ProcessFunction:PrintlegendonPCBsolderside.6.2Usecoldairtoblowtheboard6.3Drytheboardbyheating6.4Turnovertheboardtomaketheprintingsideontop,atthesametimecooltheboardnaturally6.5Fixtheboardpositionforprinting6.6Usescreenprintingtechnologytoprintinkontheboard6.7Afterprinting,useUVlighttodrytheink.6.1Loadingboard6.2Blowing6.3Curing6.4Turnovertheboard6.5Positionfix6.6Legendprinting6.7CuringbyUVPCBproductionprocessintroduction12Single-sidedboard7.Insulationlayerprinting(ApplicableforsomePCBs)Processfunction:Preventshortcircuitbetweencarbonandcoppercircuit.7.2&7.3RemovecontaminationandoxideonPCBsurface.7.4MakePCBsurfacecoarsetoeasilyabsorbinkinprintingprocess7.5Afterbrushing,PCBneedstobewashedanddried.7.6Drytheboardbyheating7.7Turnovertheboardtomaketheprintingsideontop,atthesametimecooltheboardnaturally7.8Usescreenprintingtechnologytoprintinkontheboard7.9Afterprinting,useUVlighttodrytheink.7.2RinsingbyAcid7.3RinsingbyWater7.4SoftSurfaceBrushing7.5Blowing7.6Curing7