SMT工艺设计规范

123SMT1,SMDPCBPCBAPCB2SJ/T106701995SJ/T106681995IPC-SM-782IPC-735133.11.PCB(PrintedCircuitBoard)2.PCBAPrintedCircuitBoardAssembly3.SMTSurfaceMountingTechnology/PCB4.SMDSurfaceMountingDevice,PCB5.SOP(SmallOut-linePackage)BODY,840pinLeadICLeadPitch0.5mm0.65mm0.8mm1.27mm6.QFPQuadFlatPackage100250PinLeadIC,LeadPitch7.BGABallGridArrayBallTypeLeadPitch8.WaveSoldering9.ReflowSolderingWaveSolderingPCB10.Mark(FIDUCIALMARK)ScreenPrinterChipMounterSMT11.ICT:In-CircuitTestSolderingPBAshort/open12.T/P:TestPointICTFunctionTestJIG,pinLAND13.PATTERN:PCB14.THERMALLAND:GROUND,VCCPATTERNLAND2233.2PCB1PCBTGPCBFR—4TG2PCBPCBOSP3.3PCB1.PCBPCBmmPCBmmLWTLWT50500.43302503.02.PCB162mm121mm330250mm330mm*247mm249mm*247mm3.4mm5mm4mm+0.1/0mmaba=10n(n=678……30)mmb10mm4.PCBR=2mm(1)R2mm5555baa3233.4PCBPCB1.PCB5mmMARK3mm2.PCB5mmPCBPCBV3.0.4mm0.8mm4.5.3mm2mm6.PCB3.5PCB1.PCBPCBCODENO2.PCB3.4.5.PCBBOM6.7.8.TBW59.0.2mm0.3mm1.5mm10.QCLABEL25mm10mmQCLABEL11.TOPBOTTOMPin3.6PCBMark423PCBMarkPCB3MarkMarkMarkMarkMark1.MarkTOPBOTTOMBOTTOM2.MarkLMark3.Mark1mm2.5mm1mm4Mark3.0mmMarkV-Cut5.Mark6.MarkPCB5mm7.BGACSP0.5mmQFPMark8.MarkLM9.BadMarkMasterBadMarkLocalBadMarkBadMark=+1(Masterbadmark)BadMark2.75mm10Mark100mm52311.Mark3.7PCB1.PCB50mm50mmPCB330mm250mm2.3.PCBV4.PCB5.PCBV-CUT36MARK6237.PCBPCBPCB3.8SMD1.Min.1.0mm0.5mmMax.20mm20mmPitch0.5mm6.5mm2.Min.1.0mm0.5mmMax.55mm55mmPitch0.3mm12.7mm0.19mm0.27mm15026mm3.ICSOPConnectorQFPBGA/CSPFC4.SMDTAPE&REELTRAYTubeTAPE&REELDIPTRAY,Tube5.ArrayChip6.06031608BOTTOMSOJPLCCPIN1.27mmSOPQFPQFP457.SMDaSOT23bSOT143cSOT89dTO252eSOP/SOJDIPDIPfQFPQFP0.3mm0.5mm0.3mm0.4mmQFPBGAgPLCChLCCC723CETiBGA/CSPI/Oj6.3mm220u470uklQm3.91.SMDPCB5mm3mm2.13.5mm823()PADPCBSMDDIP()6mm3.ICTT/PPCB5mm3mmICT4.TOP,PCB41608CHIPARRAY(),MARKINGBODY1MARK923BOTTOMSMDLANDREFLOW(TOP)WAVELANDd.CHIPSOLDERING(CHIPTRIC)e.IMCCONNECTORICLAND(IMC)CLINCHSMDT/PPATTERN110235.mm1608CHIPa.CHIPCHIPb.TR-CHIP1123c.SOP-CHIPd.SOP-TRe.SOP-SOPfDIPIC-CHIPDIPICCHIPg-CHIP-TOPSide1223-BOTTOMSideh-CHIP-TOPSide-BOTTOMSideiCHIP-BOTTOMSide1323jCHIP-ThroughHole/ViaHolekQFPThroughHole/ViaHole1423VIA,.SOLDERPasteSOLDERPaste,VIALAND,MICROSHORTLANDVIAHOLELAND,VIALANDVIAHOLEMASKINGlQFPPLCCBGA-QFPPLCCBGA3.0mm3.10aCHIPChipSolderingbSOPDIPICR-ArrayICSoldering1523cV-CuttingdeCHIPSKIP()CHIP1623f3.11PATTERN1PATTERNaPATTERNPATTERNAB17232THERMALLANDGROUND,VCCPATTERNLAND+,-LANDaPATTERN,REFLOW,PATTERN,,,bICLAND,1PINPATTERN,PIN,,,SHORTc,,PATTERN3LANDPATTERNaLANDPATTERN,18233.12ICT1TESTPOINTa.TESTPOINT0.7mmb.PCB0.9mm0.9mmT/PcTESTLANDd.2TESTPOINTT/PaPATTERN1TESTPOINTLANDTHROUGHHOLELANDTHROUGHHOLET/P2.0mmCHIP60mils(1.5mm)2.0mmbT/P5mmcT/PBOTTOMSIDEPOINTTOPSIDE1923ICT/PaICLEADT/PLANDT/PCONNECTORLEAD()TESTPINTESTPINT/P3.131.BOTPCB2.BGABOTIC3.PCB4.3mm5.+8mm6.7.PCB15mm8.PCB3.141.2.3.45302023a2.5mmb3.0mm65A708050805080508050.3mm3.151.PCBPCB3.3-4.2mm2.PCBPCB3.SMT4.5.3.16PCBA1PCBAPCBPCBA621232PCBICQFPBGA3PCBBOTTOMPCBA=/A0.075g/mm2A0.300g/mm2JA0.200g/mm2A0.100g/mm2BOTTOM41.0mm1.0mmpitch2.0mm1.0mm0.6mm~1.0mm2223512mm6a300mmPCBPCBPCBbcd.pitch0.65mmQFPSOPBGA10mmSMT2mme.10mmf.10mm5mmg.PCB2323h.1/4W7SOP8PCBAPCB8mm9.3mm4PCB