电子行业专业词汇术语（专业超全）

电子行业专业词汇术语GRRGaugeRepeatabilityReproducibility量测的再现性与再生性FPIFirstPieceInspection首件检查Samplingwithoutreplacement不放回抽样SQA:Source(Supplier)QualityAudit供货商品质审核1.QC:qualitycontrol质量管理2.IQC:incomingqualitycontrol进料质量管理3.OQC:outputqualitycontrol出货质量管理4.PQC:processqualitycontrol制程质量管理也称IPQC:inprocessqualitycontrol.5.AQL:acceptablequalitylevel允收标准6.CQA:customerqualityassurance客户品质保证7.MA:majordefeat主要缺点8.MI:minordefeat次要缺点9.CR:criticaldefeat关键缺点10.SMT:surfacemountingtechnology表面粘贴技术11.SMD:surfacemountingdevice表面粘贴程序SMC:surfacemountingcomponent表面粘贴组件12.ECN:engineeringchangenotice工程变更通知13.DCN:designchangenotice设计变更通知14.PCB:printedcircuitboard印刷电路板15.PCBA:printedcircuitboardassembly装配印刷电路板16.BOM:billofmaterial材料清单17.BIOS:basicallyinputandoutputsystem基本输入输出系统18.MIL-STD-105E:美国陆军标准,也称单次抽样计划.19.ISO:internationalstandardorganization国际标准化组织20.DRAM:内存条21.Polarity:电性22.Icicles:锡尖23.Non-wetting:空焊24.Shortcircuit:短路25.Missingcomponent:缺件26.Wrongcomponent:错件27.Excesscomponent:多件28.Insufficientsolder:锡少29.Excessivesolder:锡多30.Solderresidue:锡渣31.Solderball:锡球32.Tombstone:墓碑33.Sideward：侧立34.Componentdamage:零件破损35.Goldfinger:金手指36.SOP:standardoperationprocess标准操作流程37.SIP:standardinspectionprocess标准检验流程38.Thegoodandnotgoodsegregation:良品和不良品区分39.OBW:onboardwriter熸录BIOS40.Simplerandomsampling:简单随机抽样41.Histogram:直方图42.Standarddeviation:标准差43.CIP:Continuousimprovementprogram持续改善计划44.SPC:Statisticalprocesscontrol制程统制45.Sub-contractors:分包商46.SQE:Supplierqualityengineering47.Samplingsample:抽样计划48.Loader:治具49.QTS:Qualitytrackingsystem质量追查系统50.Debug:调试51.Spareparts:备用品52.Inventoryreportfor:库存表53.Manpower/Tactestimation工时预算54.Calibration:校验55.S/N:serialnumber序号56.Corrugatedpad:波纹垫57.Takeouttray:内包装盒58.Outerbox:外包装箱59.Vericode:检验码60.Sumofsquare:平方和61.Range:全距62.Conductivebag:保护袋63.Preventivemaintenance:预防性维护64.Baseunit:基体65.Fixture:制具66.Probe:探针67.Hostprobe:主探针68.Goldencard:样本卡69.Diagnosticsprogram:诊断程序70.Frame:屏面71.Lint-freegloves:静电手套72.Wristwrap:静电手环73.Targetvalue:目标值74.Relateddepartment:相关部门75.liftedsolder浮焊76.plughole孔塞77.Wrongdirection极性反78.componentdamageorbroken零件破损79.Unmeltedsolder熔锡不良80.fluxresidue松香未拭81.wronglabelorupsidedownlabel贴反82.mixedparts机种混装83.poorsoldermask绿漆不良84.oxidize零件氧化85.standoffheight浮高86.ICreverseIC反向87.supervisor课长88.Forman组长89.WI=workinstruction作业指导90.B.P.非擦除状态91.Internalnotification:内部联络单92.QP:Qualitypolicy质量政策93.QT:Qualitytarget品质目标94.Trend:推移图95.Paret柏拉图96.UCL:Uppercontrollimit管制上限97.LCL:Lowercontrollimit管制下限98.CL:Centerline中心线99.R.T.Rolledthroughoutyield直通率100.PPM:Partspermillion不良率101.DPU:Defectsperunit单位不良率102.Resistor:电阻103.Capacitor:电容104.Resistorarray:排阻105.Capacitorarray:排容106.DIODE:二极管107.SOT:三极管108.Crystal:震荡器109.Fuse:保险丝110.Bead:电感inductance111.Connector:联结器112.ADM:AdministrationDepartment行政单位113.CE:ComponentEngineering零件工程114.CSD:CustomerServiceDepartment客户服务部115.ID:IndustrialDesign工业设计116.IE:IndustrialEngineering工业工程117.IR:IndustrialRelationship工业关系118.ME:MechanicalEngineering机构工程119.MIS:ManagementInformationSystem信息部120.MM:MaterialManagement资材121.PCC:ProjectCoordination/Control专案协调控制122.PD:ProductionDepartment生产部123.PE:ProductEngineering产品工程124.PM:ProductManager产品经理125.PMC:ProductionMaterialControl生产物料管理126.PSC:ProjectSupport&Control产品协调127.MagnesiumAlloy:镁合金128.MetalShearing:裁剪129.CEM:ContractElectronicsManufacturing电子制造服务企业EMS:ElectronicsManufacturingServices130.ERP:EnterpriseResourcePlanning企业资源规划SCM+CRM+ERP+EAI=NetworkdirectTMlinksprocurement,production,Logisticsandsales采购,生产,后勤管理及市场营销的融合EAI:EnterpriseapplicationIntegration企业应用系统整合CRM:CustomerRelationshipPlanning客户服务规划SCM:Supplychainmanagement供应链管理131.OJT:Onjobtraining在职培训132.AccessTime:光盘搜寻时间133.B2CEC:Businesstoconsumerelectroniccommerce企业对消费者的电子商务B2BEC:BusinesstobusinesselectronicCommerce企业间的电子商务134.CCL:CopperCladLaminate铜箔基板135.Intranet:企业内部通讯网路136.ISP:InternetServiceProvider网络服务提供者ICP:InternetContentProvider网络内容提供者137.GSM:GlobalSystemforMobileCommunication泛欧数字式行动电话系统GPS:全球卫星定位系统138.HomePage:网络首页139.VideoClip:影像文件140.HTML:超文标记语言141.Domainname:网域名称142.IP:网络网域通讯协议地址143.Notebook:笔记型计算机144.VR:VirtualReality虚拟实境145.WAP:WirelessApplicationProtocol无线应用软件协议146.LAN:Localareanetwork局域网络广域网络147.3C:Computer,Communication,Consumerelectronic计算机,通讯,消费性电子三大产品的整合148.InformationSupplierHighway:信息高速公路149.UPS:Uninterruptedpowersystem不断电系统150.Processedmaterial:流程性材料151.Entity/Item:实体152.Qualityloop:质量环153.Qualitylosses:质量损失154.Correctiveaction:纠正措施155.Preventiveaction:预防措施156.PDCAlan/Do/Check/Action计划/实施/检查/处理157.Integratedcircuits(IC):集成电路158.Applicationprogram:应用程序159.Utilities:实用程序160.Auxiliarystorage/Secondstorage:;辅助存储器161.Siliconchip:硅片162Diskettedrive:软驱163.Displayscreen/Monitor:显示器164.Foreground:前面165.Montherboard:母板166.Mermoryboard:内存板167.Slot:插槽168.Busata-bus/address-bus/Controlbus:总线/数据总线/地址总线/控制总线169.Plotter:绘图170.MPC:Multimediapersonalcomputer多媒体171.Oscillator:振荡器172.Automatictellerterminal:自动终端(出纳)机173.Joystickport:控制端口174.VGA:VideoGraphicsArray显示卡175.Resolution:分辨率176.Register:寄存器177.ISA:IndustryStandardArchitecture