SGS ETR Lab无铅化电子产品可靠度试验教材

11ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential環測及可靠度實驗室―黃三泰EnvironmentalTesting&ReliabilityLab-JockeyHuangJockeyHuangAsst.Supervisort:02-2298-3355ext.3763f:02-2299-9558e:[e-mail]無鉛化電子產品可靠度試驗ReliabilityTestsforLead-freeE&EProducts22ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential電子產品無鉛化會遇到什麼問題？迴焊溫度最適化表面處理變更：沾錫性、相容性及可靠度須行評估焊錫材料標準化、疲勞耐久及可靠度須行評估表面處理變更：沾錫性、相容性及可靠度須行評估選擇合適的電路板材料件耐熱溫度須提升33ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential電子產品無鉛化會遇到什麼問題？„隨各部件選用材料的變更，製程對材料本身及不同材料間的物理、化學特性的影響需重新評估傳統錫鉛製程無鉛製程PbComponentsSnPbSolderLeadFreeComponentsLeadFreeSolder今後3~5年間在電子產品生產過程中需解決下列問題44ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential無鉛標示„AccordingJEDECStandard-JESD97:Marking,SymbolsandLabelsforIdentificationofLead(Pb)FreeAssemblies,ComponentsandDevices.55ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential相圖─Pb-Sn合金系統66ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential相圖─Sn-Ag-Cu合金系統Source:(℃)AddedmaterialFeatureIssuesSn-Ag190～210210～220Bi(LowerT)Cu(Wettab.)Zn,In(Th.Fat.)GoodforthermalStrongpullstrengthGoodelongationHighmeltingtemperatureExpensive(ＳｎＰｂx2to3）PoorwettabilitySn-Bi190～210Ag,Cuetc.Lowermeltingtemp.ispossibleStrongpullstrengthGoodwettabilityHardandfragileDifficulttomachiningShortthermalfatiguelifeSn-Zn190～200Bi(Wettab.)In(Th.Fat.)AgCuSameprofileasPbSnsolderLowcost（ＳｎＰｂx1.5）StrongpullstrengthGoodelongationShortthermalfatiguelifePoorwettability(N2reflowisnecessary）Sn-In117(52%In)Agetc.Lowermeltingtemp.ispossibleGoodelongationExpensivePropertyofpasteiseasytochangeSmallpullstrength99ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential迴焊(Reflow)製程比較-例SnPbProfileReflow@183CPeakTemp.=205to220CSnAgCu(Pb-free)ProfileReflow@217CPeakTemp=235to245CTimeaboveliquidous:40-120sRamprate:3oC/sTimeinMinutesTemperature,DegCReflowProfileComparisons(Sample)SnPbversusPb-free1010ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential電子產品無鉛化會遇到什麼問題？„端子／焊墊沾錫能力„濕氣／迴焊敏感性（耐錫熱能力）„錫鬚形成的可能性„焊點可靠度„與傳統鉛錫合金產品比較具備相同特性與功能(產品的環測與可靠度試驗規格要求應一致甚至更好)1111ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential端子／焊墊沾錫能力1212ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential端子／焊墊沾錫能力CaseStudy-MobilPhone„Allcomponentsshouldbeevaluated.„PCB,R/CChip,ICs,Connectors.1313ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential端子／焊墊沾錫能力CaseStudy-MobilPhone„Reference:IPCA610D.„ReliabilityConcern.1414ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidentialIPCA610D1515ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential沾錫能力試驗—蒸氣老化1616ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential沾錫能力試驗—沾錫天平法J-STD-002BMethodE/F1717ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential沾錫能力評估_J-STD-002BMethodEwww.jedec.org1818ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential沾錫能力優劣示意圖1919ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidentialLeadFreeTemp.ProfileHeatingTimeTemp.（℃）Peak：260℃SolderingZonePre-heatingZone3℃～6℃/s濕氣／迴焊敏感性&耐錫熱試驗2020ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential耐錫熱試驗-浸焊(DipSoldering)„MIL-STD202G,Method210F：Axial/Radial/InsertionComponents„TestConditionB,SolderDip2121ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential耐錫熱試驗-浸焊(DipSoldering)„SS-00254-4SolderHeatResistanceTestforTMDs,Lead-freeSolderingFlowsolderingwithsolderbath[Flow]→[Leftataroomtemperature]→[Flow]Flowsolderingcondition:260℃,5secondsHandsoldering(withsolderingiron):380℃,3seconds2222ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential耐錫熱試驗-手焊(IronSoldering)„MIL-STD202G,Method210F：Axial/Radial/InsertionComponentsorHandSolderingSMD„TestConditionB,SolderIronTemp.400ºC2323ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential耐錫熱試驗-迴焊(ReflowSoldering)„MIL-STD202G,Method210F：NonMoistureSensitivitySMDComponents，ChipC/Rorothertape/bulk/tubecarriagedevices.„TestConditionK,SolderIronTemp.260ºC,10~secTemp.Rate:1°C/s-4ºC/s;timeabove217ºC/s,90s–150s1°C/s-4ºC/s;timeabove217ºC/s,90s–150s2424ReliabilityTestsforLead-freeE&EProductsEnvironmentalTesting&ReliabilityLabSGSConfidential塑膠部件無法承受製程高溫-耐錫熱試驗2525ReliabilityTestsforLead-freeE&EProductsEnvironmen