微电子学专业词汇6014330168

微电子学专业词汇Abruptjunction突变结Acceleratedtesting加速实验Acceptor受主Acceptoratom受主原子Accumulation积累、堆积Accumulatingcontact积累接触Accumulationregion积累区Accumulationlayer积累层Activeregion有源区Activecomponent有源元Activedevice有源器件Activation激活Activationenergy激活能Activeregion有源（放大）区Admittance导纳Allowedband允带Alloy-junctiondevice合金结器件Aluminum(Aluminium)铝Aluminum-oxide铝氧化物Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic(AS)砷Auger俄歇Augerprocess俄歇过程Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发Backgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballastingresistor整流电阻Ballbond球形键合Band能带Bandgap能带间隙Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度Base基极Basecontact基区接触Basestretching基区扩展效应Basetransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Basisvector基矢Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管Bloch布洛赫Blockingband阻挡能带Blockingcontact阻挡接触Body-centered体心立方Body-centredcubicstructure体立心结构Boltzmann波尔兹曼Bond键、键合Bondingelectron价电子Bondingpad键合点Bootstrapcircuit自举电路Bootstrappedemitterfollower自举射极跟随器Boron硼Borosilicateglass硼硅玻璃Boundarycondition边界条件Boundelectron束缚电子Breadboard模拟板、实验板Breakdown击穿Breakover转折Brillouin布里渊Brillouinzone布里渊区Built-in内建的Build-inelectricfield内建电场Bulk体/体内Bulkabsorption体吸收Bulkgeneration体产生Bulkrecombination体复合Burn-in老化Burnout烧毁Buriedchannel埋沟Burieddiffusionregion隐埋扩散区Can外壳Capacitance电容Capturecrosssection俘获截面Capturecarrier俘获载流子Carrier载流子、载波Carrybit进位位Carry-inbit进位输入Carry-outbit进位输出Cascade级联Case管壳Cathode阴极Center中心Ceramic陶瓷（的）Channel沟道Channelbreakdown沟道击穿Channelcurrent沟道电流Channeldoping沟道掺杂Channelshortening沟道缩短Channelwidth沟道宽度Characteristicimpedance特征阻抗Charge电荷、充电Charge-compensationeffects电荷补偿效应Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemmicaletching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish(CMP)化学机械抛光Chip芯片Chipyield芯片成品率Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器Close-packedstructure密堆积结构Close-loopgain闭环增益Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-base/collector/emitterconnection共基极/集电极/发射极连接Common-gate/drain/sourceconnection共栅/漏/源连接Common-modegain共模增益Common-modeinput共模输入Common-moderejectionratio(CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensatedimpurities补偿杂质Compensatedsemiconductor补偿半导体ComplementaryDarlingtoncircuit互补达林顿电路ComplementaryMetal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementaryerrorfunction余误差函数Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制造CompoundSemiconductor化合物半导体Conductance电导Conductionband(edge)导带(底)Conductionlevel/state导带态Conductor导体Conductivity电导率Configuration组态Conlomb库仑ConpledConfigurationDevices结构组态Constants物理常数Constantenergysurface等能面Constant-sourcediffusion恒定源扩散Contact接触Contamination治污Continuityequation连续性方程Contacthole接触孔Contactpotential接触电势Continuitycondition连续性条件Contradoping反掺杂Controlled受控的Converter转换器Conveyer传输器Copperinterconnectionsystem铜互连系统Couping耦合Covalent共阶的Crossover跨交Critical临界的Crossunder穿交Crucible坩埚Crystaldefect/face/orientation/lattice晶体缺陷/晶面/晶向/晶格Currentdensity电流密度Curvature曲率Cutoff截止Currentdrift/dirve/sharing电流漂移/驱动/共享CurrentSense电流取样Curvature弯曲Customintegratedcircuit定制集成电路Cylindrical柱面的Czochralshicrystal直立单晶Czochralskitechnique切克劳斯基技术（Cz法直拉晶体J）Danglingbonds悬挂键Darkcurrent暗电流Deadtime空载时间Debyelength德拜长度De.broglie德布洛意Decderate减速Decibel(dB)分贝Decode译码Deepacceptorlevel深受主能级Deepdonorlevel深施主能级Deepimpuritylevel深度杂质能级Deeptrap深陷阱Defeat缺陷Degeneratesemiconductor简并半导体Degeneracy简并度Degradation退化DegreeCelsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度Densityofstates态密度Depletion耗尽Depletionapproximation耗尽近似Depletioncontact耗尽接触Depletiondepth耗尽深度Depletioneffect耗尽效应Depletionlayer耗尽层DepletionMOS耗尽MOSDepletionregion耗尽区Depositedfilm淀积薄膜Depositionprocess淀积工艺Designrules设计规则Die芯片（复数dice）Diode二极管Dielectric介电的Dielectricisolation介质隔离Difference-modeinput差模输入Differentialamplifier差分放大器Differentialcapacitance微分电容Diffusedjunction扩散结Diffusion扩散Diffusioncoefficient扩散系数Diffusionconstant扩散常数Diffusivity扩散率Diffusioncapacitance/barrier/current/furnace扩散电容/势垒/电流/炉Digitalcircuit数字电路Dipoledomain偶极畴Dipolelayer偶极层Direct-coupling直接耦合Direct-gapsemiconductor直接带隙半导体Directtransition直接跃迁Discharge放电Discretecomponent分立元件Dissipation耗散Distribution分布Distributedcapacitance分布电容Distributedmodel分布模型Displacement位移Dislocation位错Domain畴Donor施主Donorexhaustion施主耗尽Dopant掺杂剂Dopedsemiconductor掺杂半导体Dopingconcentration掺杂浓度Double-diffusiveMOS(DMOS)双扩散MOS.Drift漂移Driftfield漂移电场Driftmobility迁移率Dryetching干法腐蚀Dry/wetoxidation干/湿法氧化Dose剂量Dutycycle工作周期Dual-in-linepackage（DIP）双列直插式封装Dynamics动态Dynamiccharacteristics动态属性Dynamicimpedance动态阻抗Earlyeffect厄利效应Earlyfailure早期失效Effectivemass有效质量Einsteinrelation(ship)爱因斯坦关系ElectricEraseProgrammableReadOnlyMemory(E2PROM)一次性电可擦除只读存储器Electrode电极Electrominggratim电迁移Electronaffinity电子亲和势Electronic-grade电子能Electron-beamphoto-resistex