FPC-专业词汇-中英文对照

FPC名词中英对照1.目的通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2.适用范围规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词3.定义无类别一：FPC不良项目名词工程类别不良名称中文英文导线VisualInspectionofConductors导线Conductors开路Open短路Short缺口Nicks针孔Pinholes额外铜刺ExtraneousCopperBetweenConductors毛刺Spurs结瘤Nodules蚀刻凹痕EtchedConcave导线分层ConductorDelamination裂纹Cracks导线划痕ScratchesonConductor凹坑Dents变色Discoloration基底薄膜VisualInspectionofBaseFilm凹坑Dents划痕ScratchesonBaseFilm覆盖层和覆盖涂层VisualInspectionofCoverlayandCovercoat凹坑DentsonCoverlayandCovercoat划痕ScratchesonCoverlayandCovercoat空洞Void偏位CoverlayMisalign毛刺CoverlayBurrs外来物ForeignMatters导电性异物ConductiveForeignMatters非电性异物Non-conductiveForeignMatters起泡和分层BlisteringandDelamination覆盖层粘结剂挤出Squeeze-outofAdhesiveofCoverlay覆盖涂层渗出Ooze-outofCovercoat覆盖涂层跳漏SkippingofConvercoat电镀金属或焊锡的表面条件SurfaceConditionofPlatedMentalandSolder镀金GoldPlating镀金层缺陷GoldPlatingDefects镀锡TinPlating电镀金属或焊料的渗透PenetrationofPlatedMetalorSolder变暗（变黑）DarkenedAppearance(BlackeningDiscoloration)镀铜孔内镀层空洞PlatingVoidsinPlated-thoughHole镀金粗糙RoughGold镀金白雾GoldDiscoloration镀金变色GoldDiscoloration镀金层龟裂GoldCrack镀金针孔GoldPinhole电镀露铜PlatedExposeWetting剥离PlatedPeeledOff电镀渗入PlatedWicking漏镀NoPlating表面伤痕PlatingScratch电镀粗糙RoughPlated药水渗入Wicking外形和孔边缘VisualInspectionofEdgesofOutlineandHoles撕裂和缺口TearsandNicks毛刺Burrs丝状毛刺ThreadyBurrs弯曲、变形Warpage微连筋不良PoorMicro-joint外形偏移OutlineMisalign外形漏冲NoOutline反折偏位BendingLineMisalign增强板VisualImperfectionsRelatedtoStiffenerBondingFPC与增强板之间的外来物ForeignMatterBetweenFlexiblePrintedBoardandStiffenerFPC与增强板之间的空洞VoidsBetweenFlexiblePrintedBoardandStiffener裂纹Cracks缺角Chip-off划痕Scratches变形Deformation表面附着物增强板贴偏移StiffenerMisalign热固胶ThermosettingAdhesiveAffixedSubstancesontheSurface焊剂残渣FluxResidues金属粉末残渣ResidueofMetalPowders粘结剂残渣ResidueofAdhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist标记Marking尺寸检验DimensionalInspections尺寸测量MeasurementofDimensions外部尺寸ExternalDimensions厚度Thickness孔Holes元件孔ComponentHoles导通孔ViaHoles导通孔偏移ViaHoleMisalign安装孔MountingHoles导线宽度ConductorWidths导线之间的间距ClearancesBetweenConductors孔中心间距DistanceBetweenHoleCenters板边和导线之间的最小距离MinimumDistanceBetweenBoardEdgesandConductors标记错误WrongMarking字符不清晰UnclearLetter定位精度PositionalAccuracy孔的定位精度PositionalAccuracyofHoles孔与焊盘的重合性RegistrationofHoletoLand覆盖层与焊盘的重合性RegistrationofCoverlay(orCovercoat)toLand增强板与FPC的重合性RegistrationofStiffenertoFPC孔的重合性RegistrationofHoles外形的重合性RegistrationofOutlines冲外形与导线图形的重合性RegistrationofPunchedOutlinetoConductorPatterns压敏胶或热固胶与FPC和增强板的重合性RegistrationofPressureSensitiveorHeatActivatedAdhesivestoFPCandStiffener镀通孔的镀铜层厚度PlatingThicknessofCopperPanted-throughHoles其它Other短装Shortage混装MixedStowage/Packing离型纸脱落ReleasedPaperPeeledoff材料错误WrongMaterial类别二：PFC工程用语工程类别中文英文板BoardType单面板SingleSidedFlexCircuits单面双接触DoubleAccessorBack-baredFlexCircuits双面板DoubleSidedFlexCircuits软硬结合板Rigid-flexCircuits模具Die模具图纸DieDrawing量产模具MassProductionDie样品模具PrototypeDie钢模SteelDie刀模Die上模TopDie下模BottomDie线切割WireCut外形模具OutlineCut保护膜模具CoverlayDie胶纸模具PressureSensitiveAdhesiveDie补强模具StiffenerDie银浆模具SilverDie导柱Post冲头Punch分割刀模CuttingSteelRuleDie销钉Pin治具Jig(Fixture)贴合治具LaminationJig电测治具ElectricalCheckJig假贴治具TackingJig曝光治具ExposureJig丝印网框ScreenPrintingFrame孔Hole曝光定位孔GuideHoleforExposure模具定位孔GuideHoleforDie假贴定位孔GuideHoleforTacking贴合定位孔GuideHoleforAdhesive电测定位孔GuideHoleforElectricalTest丝印定位孔GuideHoleforScreenPrinting孔环LiftedLand渗锡孔StannizeHole装配孔FittingHole制程ManufactureProcedure下料MaterialPreparation钻孔Drilling镀铜CopperPlating化学铜EleEletcrolessPlatingCopper贴干膜SensitiveDryFilm丝印阻焊油墨LiquidPhotosensitiveSoldermask曝光Exposure显影Developing蚀刻Etching脱膜Stripping贴保护膜TackingCoverlay粗化Abrade层压Lamination固化(烘烤）Curing黑孔BlackHole表面处理SurfaceTreatment循环水洗CascadeRinse微蚀Micro-etch酸洗AcidCleaning水洗WaterCleaning防锈处理Anti-corrosionTreatment前处理Pre-treatment刷板Brushing干燥Dryup电镀（金、锡、镍）(Gold、Solder、Nickel)Plating闪镀(Gold)FlashPlating/StrikePlating局部电镀PatternPlate化学镍金ImmersionGold有机保焊膜OrganicSolderabilityPreservatives(OSP)丝印字符PrintingofLegend贴补强板BackBoardLamination电性能测试ElectricalInspection贴胶纸DoubleFacedAdhesiveTape打孔Punching雷射切割LaserCut自动光学检验AutomaticOpticalInspection（AOI）表面贴装SurfaceMountingTechnology（SMT）外形冲切Punching冲孔Punching外观检查FinalInspection目视检查VisualInspection（FinalInspection)线路显微镜检验（镜检）ConductorMicroscopeInspection性能测试ReliabilityTest包装Packing原材料Material铜箔CopperFoil(CU)电解铜Electro-depositedCopperFoil(ED)压延铜RolledAnnealedCopperFoil(RA)保护膜Coverlay(CVL)基材BaseMaterial挠性覆铜板FlexibleCopperCladLaminate(FCCL)无胶基材AdhesivelessFCCL粘接剂（胶）Adhesives(Ad)压克力Acrylic顶层补强TopStiffener底层补强BottomStiffener顶层银浆膜TopSilverPaste底层银浆膜BottomSilverPaste银浆油墨SliverInk顶层线路TopCircuits/Conductors底层线路BottomCircuits/Conductors半固化片BondingFilm(BOD)聚酰亚胺Polyimide(PI)聚酯PolyesterFilm(PET)钢片SheetSteel玻璃纤维布WovenGlassClothFR4补强板Fiberboard液态感光油墨LiquidPhotoimageableResistInk压敏胶PressureSensitiveAdhesive（PSA）离型膜ReleasePaper导电胶ConductingResin导电布ElectricFabric泡棉Foam导向导电胶AnisotropicConductiveFilm（ACF）导电泡棉Conductive/ElectricFoam屏蔽膜ShieldFilm(金属)薄膜开关MetalDome（DOME）连接器Connector电容Capacitance(C)电阻Resistance(R)集成电路IntegratedCircuit（IC）二极管Diode(D)静电Electro-StaticDischarge（ESD）其它Others机械方向MachineDirection（MD）垂直方向TransverseDi