基板封装标准术语

基板封装标准术语1目的Purpose定义并规范基板封装各类技术术语、商务用语，使事业部全体员工使用共同技术语言，方便沟通,提高效率。Thisspecificationdefinestheterminologyoftechnology/business.ThesestandardsaretobeusedascommonlanguageinLaminatePackagingBizUnittoensuregoodcommunicationandobtaingoodefficiency.2范围Scope2.1基板封装技术用语technologyglossary2.1.1基板封装工序代码processcode2.1.2基板封装各类技术、封装名称technology、packagename2.1.3基板封装相关制程名称、设备、仪器仪表、材料Relatedprocessname、equipment、instrument、material2.1.4基板封装制程各类缺陷alldefectsbyprocess2.2基板封装商务用语businessglossary2.2.1商务价格词汇businesspriceglossary2.2.2商务信用证词汇latterofcreditglossary2.2.3商务单证类词汇billglossary2.2.4商务货运类词汇deliveryglossary2.2.5商务会计类词汇invoiceglossary2.2.6商务证明书类词汇Certificateglossary2.2.7商务其它类词汇Otherbusinessglossary3定义Definition基板：用有机材料和铜膜通过层压等方法制成的复合材料。Plasticsubstrateisakindofcompoundmateriallaminatedwithorganicmaterialandcopperfoil.基板封装：用单层或多层基板作为承载和电性连接的材料的封装形式。Laminatepackagingmeansusingsingle-layerormulti-layersubstrateasthechipcarrierandtheelectricalfunctionalconduction.4职责Responsibilitiesa)产品工程、制造工程、制造设备、业务部门负责起草和修订文件。Research&development、process、equipment、salesdepartmentareresponsibilityforestablishandrevisedocument.b)基板封装事业部全体员工按文件规定规划动作。AccordingtodocumentrequirementtodobyLaminatepackagingbizunitpersonnel.5内容Content5.1基板封装工步代码LaminatepackagingprocessstepcodeProcessstepcodeShortenedform中文IncomingQualityControl(1stOpticalQCgate)IQC进料检验WaferTapingW/T晶圆贴膜WaferGrindingW/G磨片WaferDetapingW/D晶圆揭膜GrindingUVexposeGUV磨片照紫外线WaferThicknessMeasureWTM晶圆厚度测量WaferMountingW/M划片贴片WaferSawW/S划片WaferCleaningW/C晶圆清洗SawingUVexposeSUV划片照紫外线PostSawingInspectionPSI划片后目检PSIQCGate(2ndopticalQCgate）PSG划片关卡SolderPastePrintingSPP锡膏印刷SMTSMT组装贴片SMTReflowSMR贴片回流SMTCleaningSMC贴片清洗SMTVisualinspectionSMV贴片外观检SMTQCGateSMG组装贴片关卡SMTReworkS/R贴片返工SubstrateBakingSBB基板烘烤DieBondingD/B装片EpoxyCureE/C装片胶烘烤PlasmacleaningbeforeW/BPWB球焊等离子清洗WireBondingW/B球焊PostBondingInspectionPBI球焊后外观检PBIQCGate(3rdOpticalQCgate)PBG球焊关卡PlasmacleaningbeforeMoldingP/M包封等离子清洗MoldingM/D包封LaserMarkingL/M激光打印InkMarkingI/M油墨打印PostInkCurePIC打印后烘烤PostMoldingCurePMC后固化WaterJetW/J水刀切割W/JCleaningWJC水刀切割清洗PackageMountingP/M塑封体贴膜Singlation/Pick&PlaceS/P切割/取放SinglationBakeSGB切割烘烤SinglationUVexposeS/U切割照紫外线O/STestOST开短路测试FinalTestF/T成品测试F/TQCGateFTG成品测试关卡VisualmechanicV/M外观检V/MQCGate(4thOpticalQCgate)VMG外观关卡PackingP/K包装OutgoingQCgateOQC出货关卡检ShippingS/P出货5.2基板封装各类技术、封装名称technology、packagenameProductofname说明（Explain）备注（Remark）Microsecuredigitalmemorycard微小可靠手指记忆卡简称“MSD”卡Minisecuredigitalmemorycard迷你可靠手指记忆卡简称“NSD”卡Securedigitalmemorycard可靠手指记忆卡简称“SD”卡Subscriberidentitymodel客户识别模块简称“SIM”卡Ballgridarraypackage球型栅状陈列封装简称“BGA”封装Landgridarraypackage矩型栅状陈列封装简称“LGA”Module模块简称“MOD”Systeminpackage系统级封装简称“SiP”Chipscalepackage芯片级封装简称“CSP”Chiponboard板上芯片封装简称“COB”Three-dimensionalpackage三维封装简称“3D”封装Stackdie芯片堆叠Resistance电阻简称“R”Capacitance电容简称“C”Inductance电感简称“L”Printedcircuitboard印刷线路板简称“PCB”Substrate基板Surfacemounttechnology表面贴装工艺简称“SMT”Wirebondingarea打线区域Surfacemounttechnologyarea表面贴装区域简称“SMT”区域Goldfingerarea金手指区域简称“G/F”区域Effectivebondingarea有效打线区域Bondingpad打线压区Innerlayer内层Outerlayer外层Soldermask防焊漆Throughhole通孔Viahole盲孔Linetoplanespace直线到面的间距Planetoplanespace面到面的间距Strip条Unit颗a)基板封装相关制程、设备、仪器仪表、材料等名词Relatedprocessname、equipment、instrument、material制程名词Processterms设备/仪器名词Equipment&instrumentterms材料名词Materialterms中文INENGLISH中文INENGLISH中文INENGLISH晶圆进料检验WaferIQC高倍显微镜Highmagnitudemicroscope晶圆Wafer晶圆储存Waferstorage晶圆贴膜Wafertaping磨片贴膜机WafertapingM/C磨片膜Grindingtape晶舟盒Wafercarrier磨片Waferbackgrinding磨片机Grinder磨片磨轮Grindingwheel晶圆测厚仪Thicknessmicrometer二氧化碳发泡机CO2M/C贴膜filmD/Afilmmounting叠片贴膜机Filmmounter叠片膜B-stagefilm晶圆揭膜Waferdecaping揭膜机WaferdetapingM/C揭膜Decapingtape晶圆贴片Wafermounting划片贴膜机Wafermounter划片膜/蓝膜Waferdicingtape/bluetape划片膜/UV膜Waferdicingtape/UVtape晶圆提篮Waferringcassette片环Ring条形码读取机BarcodeReader条形码Barcode划片Dicingsaw划片机DicingsawM/C硬刀Hubblade晶圆清洗Wafercleaning去离子水DIwater划片后目检PSI(postsawinginspection)划片关卡2ndOpticalQCgate照UVUVirradiationUV机UVM/C基板进料检验SubstrateIQC千分尺Micrometer基板Substrate放大镜Magnifier切割机Diamondcutter抛光机Grinder/polisher显微镜Microscope排片机Substrateexchanger基板上载板Substrateonboat载板MV-boat基板烘烤Substratebaking基板烘烤烘箱SubstrateBakingOven装片等离子清洗Prediebondingplasmacleaning装片等离子清洗机PreDieBondingPlasmaCleaner装片胶进料检验DiebondingepoxyIQC银胶Silverepoxy不导胶Non-conductiveepoxy异方性导电胶(膜)Anisotropicconductivepaste(film)装片Diebonding装片机Diebonder晶粒Die点胶头DispensingTool料盒Magazine吸嘴Rubbertip片环提篮Ringcassette超声波清洗机Ultrasoniccleaner前站推车Assemblyacart银胶搅拌器Epoxyoscillator顶针Ejectionpin装片胶烘烤Epoxycuring装片胶烘烤烘箱EpoxyCuringOven推晶Diesheartest推晶机Diesheartester推晶刀Diesheartool球焊等离子清洗Prewirebondingplasmacleaning球焊等离子清洗机Plasmacleaner氮气柜N2box金丝进料检验GoldwireIQC金丝GoldWire球焊Wirebonding球焊机Wirebonder布线图WireBondingDiagram低倍显微镜Lowmagnitudemicroscope压板Clamp劈刀Capillary加热块Heatblock金丝拉力Wirepulltest拉力测试机Wirepulltester钩针Wirepullhook金球推力Ballsheartest金球推力测试机Ballsheartester推球刀Goldballsheartool球焊后目检PBI(postbondinginspection)球焊检验机PBIinspectionM/C球焊关卡检3rdopticalQCgate覆晶胶进料检验DiecoatingpasteIQC覆晶胶Diecoatingpaste晶粒覆胶Diecoating晶粒覆胶机DiecoatingM/C晶粒覆胶后烘烤Diecoatingpostcure覆晶胶烘烤烘箱Coatingcuringoven包封基板烘烤Preencapsul