电子零件的分类

ElectricComponentKnowledgeIntroductionISSD工程文朝陽2002.08.02Page:1/25目錄電子零件的分類專有名詞介紹解釋電子零件英文縮寫電子零件之包裝電子零件著裝方式的變化部分電子零件圖示集成電路(IC)Page:2/25按著裝方式分電子零件的分類PTH元件(鍍通孔著裝元件)SMT元件(表面黏著元件)印刷電路板電阻積體電咯IC焊點焊墊(a)傳統零件之焊點結構印刷電路板焊點焊墊電阻(b)SMT零件之焊點結構Page:3/25電子零件的分類按功能分電阻器(Resistor)電容器(Capacitor)電感器(Inductance)晶体振蕩器(Crystal)二极体(Diode)電晶体(Transistor)保險絲(Fuse)開關(Switch)信號燈(Led)連接器(Connector)HDRJackSocketInsulator,Cover,RetentionShield,BracketICBGAPage:5/25PTH:Pin(Plate)ThroughHole鍍通孔著裝技術SMT:SurfaceMountingTechnology表面黏著技術SMD:SurfaceMountingDevice表面黏著設備SMC:SurfaceMountingComponent表面黏著元件專有名詞介紹解釋Page:6/25電子零件英文縮寫Page:7/25電子零件英文縮寫Page:8/25電子零件之包裝電子零件之包裝通常說電子零件包裝包含兩個方面:內包裝:指單顆元件封裝外包裝:指多顆元件之包裝,起保護,裝運,快速著裝之作用SMT元件外包裝分四種方式：•散裝(Bulk)•管狀式包裝(Tube)•卷帶式包裝(TapeandReel=T&R)•矩形盤包裝(MatrixTrays):6Page:9/25電子零件之包裝SMT元件之外包裝•散裝(Bulk):包裝之成本最低,適合於無腳的元件,且此元件在制程中僅適用於手貼的方式或振動供料器(Feeder)的方式,在搬運和處理中易造成元件破損;•管狀式包裝(Tube):包裝成本比卷帶式包裝低,具有較好的防靜電的功能,適用於SOIC、PLCC等的包裝;•卷帶式包裝(T&R):卷帶式包裝是引導元件進入SMT貼片系統最有效的方式,且卷帶式的Feeder比管狀式的Feeder更可靠、貼裝更快捷;通常卷帶寬度有七種:8mm、12mm、16mm、24mm、32mm、44mm、56mm;•矩形盤包裝(MatrixTrays):矩形盤包裝是為了滿足QFP包裝的需要而發展起來的.Tray由防靜電、抗高溫的塑膠成形而成,抗高溫主要是便於QFP元件的烘烤.正因為如此,矩形盤包裝為四種方式中包裝成本最高一種方式Page:10/25電子零件之包裝SMT元件之內包裝Page:11/25電子零件之包裝SMT元件之內包裝Page:12/25電子零件著裝方式的變化錫槽SOLDERPOT1950半自動焊錫爐SEMI-AUTOSOLDERMACHINE1960全自動焊錫爐AUTOSOLDERMACHINE1970表面黏著技術SurfaceMountingTechnology1990自動插件(立式)AUTOINSERTION(VERTICAL)1980自動插件(臥式)AUTOINSERTION(HORIZONTL)1975Page:13/25部分電子零件圖示Page:14/25部分電子零件圖示Page:15/25部分電子零件圖示Page:16/25Page:17/25IntegrationCircuit(concept)MDC3105SemiconductorManufacturingProcessRepeatingProcessPage:18/25IntegrationCircuitDescriptionThechipcontainshundredsofthousandsofminuteelectroniccomponentswhicharebuiltintoitssurfaceFunctionManagingsignalonspecificspurposeBenefitsHighlyIntegrationtoreducethecircuitspaceCostsavingTypes:LogicICAnalogICPage:19/25LOGICFamiliesbyProcessBipolarTech.CMOSTech.ECLTech.SN74LSXXMC14XXXXXMC74HC/HCTXXMC74LVXXXMC74LCXXXMC74VHCXXMC10/100XXXMC10HXXXMC10ELXXXPage:20/25LOGICFamiliesFamilyFullnamePartNo.DescriptionVoltageDrivingcurrentSpeedLSLowpowerschottkySN74LSxxx5V------14xxxMetalgateCMOS(MG)MC14xxx5V------HC/HCTHigh-speedCMOSMC74HCxxxMC74HCTxxx5V------AC/ACTFACTMC74ACxxxMC74ACTxxx5V------VHC/VHCTVeryhigh-speedCMOSMC74VHCxxxMC74VHCTxxxVeryhigh-speedCMOSwithTTLcompatibility.Offers5Vinputtolerancesformixeddesignsystems.For3V-5Vsystems5V------HC1GVHC1GVHC1GTOne-gateMC74HC1GxxxMC74VHC1GxxxMC74VHC1GTxxxMinimumpackage2Vto5V8mA4nsLVXLow-voltageCMOSMC74LVXxxxOffers5Vinputtolerancethatallows5VCMOStointerfacewith3.3Vsystems3.3V4mA5nsLCXLow-voltageCMOSMC74LCXxxxOffers5V-toleranceinputsandoutputs.Idealfor3.3Vto3.5Vapplicationsrequiringbalanceddrivecapability,highspeed,andlownoise2.5V3.3V24mA5nsVCXVerylow-voltageCMOSNL74VCX16xxxHigh-speedCMOSenablesinteroperabilitybetween3.3Vand2.5Vsystems,with3.6V-tolerantinputsandoutputs1.8V2.5V3.3V24mA3nsPage:21/25MC14XXXYYYZZZ•ONPartNumber•FunctionType•Temperaturerange•14=-55TO+125DegC.CMOSMC14XXXXNumberingSystem•Identifier•B=BufferedOutput•UB=UnbufferedOutputs•PackageType•CL=Ceramic-55to+125C•CP=Plastic-55to+125•D=150milSOIC•DW=300milSOIC•DT=PlasticTSSOPPage:22/25FOCUSProductsSTANDARDLOGICondigitalbaseapplication,likeM.B.,NotebookPC,….MC74LCXXXseriesMC74LVXXXseriesMC74VHCXXseriesNL74VCXXXseriesONE-GAETLOGIConportableapplication,NotebookPC,CellularPhone,PDA,...MC74HC1GMC74VHC1GXXXMC74VHC1GTXXXPage:23/255V3.3V2.5V1.8V1.2V20002002PowerSupplyVoltageDevelopmentunderplanning74AC74VHC74LVX74LCX74VCX74xxxVoltageRoadmapPage:24/25207mm2137mm266%ofPDIP43mm231%ofSOIC19mm214%ofSOIC8.3mm26%ofSOIC4.2mm23%ofSOICPDIPSOICTSSOPSOT23-5TSSOP8SC88PDIPSOICTSSOPSOT23-5SC88Pitch(mm)2.541.270.65/0.500.850.65PackageTrendPage:25/25