铜合金固溶强化的电子理论解释

18820088Vol.18No.8TheChineseJournalofNonferrousMetalsAug.20081004-0609(2008)08-1522-05123113(1.4710032.2000933.710069)(EET)Cu-CrCrCu-CrTG146.1;TG111.1;TG142.4AExplanationbasedonelectrontheoryforsolidsolutionstrengtheningincopperalloyJIAShu-guo1,LIUPing2,ZHENGMao-sheng3,RENFeng-zhang1,TIANBao-hong1,ZHOUGen-shu3(1.SchoolofMaterialsScienceandEngineering,HenanUniversityofScienceandTechnology,Luoyang471003,China;2.CollegeofMechanicalEngineering,UniversityofShanghaiforScienceandTechnology,Shanghai200093,China;3.PhysicsDepartment,NorthwestUniversity,Xi’an710069,China)Abstract:Basedontheempiricalelectrontheoryinsolidsandmolecules,thecalculationmodelsandmethodsofvalenceelectronstructureofthephaseinCu-Cralloywereestablished.Thevalenceelectronstructuresofphasewerecalculated,andthealloyingbehaviorofalloyingelementsandthesolidsolutionstrengtheningbehaviorwereexploredfromthevalenceelectronstructuresofphase.Theconceptandcalculationmethodsofsolidsolutionstrengtheningfactorswereadvanced.Theresultsshowthatthesolidsolutionstrengtheningfactorscanexpressthesolidsolutionstrengtheningofalloyingelementstomatrix,whichaccordswiththeexperiment.Keywords:Cu-Cralloy;valenceelectronstructure;electrontheory;solidsolutionstrengthening[1−3][4−9][10−12][13−15][4−8](2002AA331110,2006AA03Z528)(06-04)2007-12-192008-04-280379-642337530379-64230597E-mail:[e-mail]1881523Cu-CrCu-CrCr1()[16][7−8][17−18]CrCu-CrCrCuCu-CrCuCu-CrCu-CrCuCu-Cr121CuFig.1StructuremodelofCucell2Cu-CrFig.2StructuremodelofCu-CrcellCu-CrCucCrCrCufCrCuf2CuCrCu-CrCrCu0.3615nm[16]CuCu-Cr1212CuCu9CuCrCuCrCuCu-CrCu1013[16]12nα()Eα20088152418815251CuTable1ValenceelectronstructureofCucell(σ=9,nc=4.5504,nl=1)BondnameIαD(nα)/nmD(nα)/nm∆D(nα)/nmnαEα/(kJ·mol−1)D(nA)120.2556190.2551500.0004690.37540277.018110D(nB)60.3615000.3610310.0004690.0064540.935774D(nC)240.4427450.4422670.0004780.0002860.03381302Cu-CrTable2ValenceelectronstructureofCu-Crcell(σ:Cuc13,Cuf10,Cr9;∑nc=18.2162;∑nl=4.7945)BondnameIαD(nα)/nmD(nα)/nm∆D(nα)/nmnαEα/(kJ·mol−1)D(Cuc-Cuf)(nA)160.2556190.2556340.0000140.35804773.992800D(Cuc-Cr)(nB)80.2556190.2556340.0000140.386314122.281000D(Cuf-Cr)(nC)160.2556190.2556340.0000140.396376124.520400D(Cuf-Cuf)(nD)80.2556190.2556340.0000140.36737375.331830D(Cr-Cr)(nE)40.3615000.3615140.0000140.0073522.500250D(Cuf-Cuf)(nF)80.3615000.3615140.0000140.0063160.915776D(Cuc-Cuc)(nG)60.3615000.3615140.0000140.0059990.88345612Cr12CrCuCu-CrCuCufCrCucCuf33∑nc4.550418.2162CrCunA0.375400.39637nBnCnDCrCu-CrCuCu-CrCrxCrwCu-Cr=4xCr(1)wCu=1−4xCr(2)∑∑∑×+×=Cr-CucCr-CuCucCualloycnwnwn∑alloycnCu-Cr∑alloycn4(1)(2)GB3978643Cu-Cr∑ncCuCu4CrCu-CrCu-Cr∑alloycnCu418820088Vol.18No.8TheChineseJournalofNonferrousMetalsAug.20083Table3PhasestructurefactorsofcellCell∑ncnAnBnCnDnEnFnGCu4.55040.375400.00645Cu-Cr18.21620.396370.386310.367370.3580470.007350.006310.005994Table4SolidsolutionstrengtheningfactorsandstrengthofsolutionalloyAlloy∑alloycnσb/MPaδ/%Cu4.550417155.0Cu-0.2Cr4.683922337.5Cu-0.4Cr4.817424633.0Cu-0.6Cr4.950726530.0CrCu-CrCu∑alloycn31)Cu-Cr2)Cr3)CrREFERENCES[1],,,,,.Cu-Ni-Si[J].,1999,9(4):723−727.CAOYu-wen,MAJu-sheng,TANGXiang-yun,WANGBi-wen,WANGShi-min,LIHong.DesignofCu-Ni-Sicopperalloyforleadframe[J].TheChineseJournalofNonferrousMetal,1999,9(4):723−727.[2],,,,.[J].,2001,21(6):609−611.ZHAODong-mei,DONGQi-ming,LIUPing,JINZhi-hao,HUANGJin-liang.Exploringforoptimumchemicalcompositionofcopperalloywithhighstrengthandelectricalconductivity[J].JournalofFunctionalMaterials,2001,21(6):609−611.[3],,,.[J].,2007,32(1):12−20.XIEChun-sheng,ZHAIQi-ming,XUWen-qing,WANGJi-heng.Studyandapplicationdevelopmentofstrengtheningtheoryofcopperalloywithhighstrengthandhighconductivity[J].HeatTreatmentofMetals,2007,32(1):12−20.[4]HOLZWARTHU,STAMMH.TheprecipitationbehaviorofITER-gradeCu-Cr-Zralloyaftersimulatingthethermalcycleofhotisostaticpressing[J].JNuclMater,2000,279:31−45.[5]KENDIGKL,MIRACLEDB.StrengtheningmechanismsofanAl-Mg-Sc-Zralloy[J].ActaMater,2002,50:4165−4175.[6],,,.Cu-Ag-Cr[J].,2004,14(7):1144−1148.JIAShu-guo,LIUPing,TIANBao-hong,ZHENGMao-sheng.Strengtheningmechanisminhigh-strengthhigh-conductivityCu-Ag-Cralloy[J].TheChineseJournalofNonferrousMetal,2004,14(7):1144−1148.[7]FUJIIT,OGAWAM,ONAKAS.PreferentialprecipitationofCrparticlesondislocationsinaCu-0.32mass%Cralloy[J].JapanInstMetals,1998,62(4):301−309.[8]JIASG,ZHENGMS,LIUP,TIANBH.AgingpropertiesstudiesinaCu-Ag-Cralloy[J].MaterSciEngA,2006,419(1/2):8−11.[9],,,,.Cu-3.2Ni-0.75Si[J].,2002,12(6):1167−1170.ZHAODong-mei,DONGQi-ming,LIUPing,JINZhi-hao,HUANGJin-liang.TransformationandstrengtheningofearlystageofaginginCu-3.2Ni-0.75Sialloy[J].TheChineseJournalofNonferrousMetal,2002,12(6):1167−1170.[10]BERGEPM,KIMST,GIBSONJ,VerhoevenD.AnairmeltingtechniqueforpreparingCu-Cralloys[J].JOM,1998,50(7):422−431.[11].[J].,18815272005(9):925−925.WANGXian-tao.AnUsefulAttempttoSmeltingProcessofPhosphor-CopperMasterAlloy[J].Foundry,2005(9):925−925.[12]SATYAPVV,RAMAKRISHNAV,MISRARDK,KRISHNARP,GUPTKM.Electroslagcruciblemeltingofagehardeningcopper-chromiumalloy[J].MaterialsScienceand