大毅LED散热基板的验收规范表LED-3528系列

ApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page1/6LEDHeatDissipationSubstrateApprovalSpecificationSheetforTA-I001SeriesTA-ITechnologyPartNumber:LHA01APTAI001SeriesCustomerApproval:ValidDateReleaseDateVersionAug22,2012Aug22,2012TAI001SeriesApprovedbyCheckedbyProducedbyN0.26,LANE470,NAN-SHANRd.,SEC.2,LU-CHUHSIANG,TAOYUAN,TAIWAN,R.O.C.TEL：[phone]FAX：[phone]ApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page2/61.Specification：1.1SubstrateDimensionasshowninTable1.1.2Perpanelupto364pieces.Table1:ThespecofPanelandSingleUnitItemSpecPanelLength109.2±0.1Width54.6±0.1Thicknessofsubstrate0.38±0.04Thetotalthickness0.51±0.025SingleUnitLength3.5±0.02Width2.8±0.02Unit:mm1.3SpecificationofPanel:Unit:mmApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page3/62.ElectricalContinuityTest:2.1Testpoint:Asshowninbelowdiagram.2.2Method:UseflyingprobeattachseparatelytoIO1/IO2offrontsideandWB1/WB2ofbackside,resultshallasshownasTable1andallviaholesplugged.ElectrodesofIO1/WB1andIO2/WB2shallbeisolatedfromeachother.FrontSide–BondpadAreaBackSide–Non-CriticalArea2.3Tableofelectricalfunction:MeasurementareaIO1-WB1IO2-WB2WB1-WB2IO1-IO2Functionofelectrical○○╳╳○:Closed,╳:OpenedWB1IO1IO2WB2ApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page4/63.CriteriaofVisualInspection:3.1Visualinspection3.2Testitemsareshownasbelowtable.3.3Tool:CCDOM15X3.4Paneldefectivecontrol:Acceptifdefective/=10%3.5Definitionoftestareas:No.ItemExamineareaSpecificationSchematicdiagram1a)Depressionb)SilverPointc)Protrusiond)ForeignMaterialse)Contaminantsf)Crackg)Peeling(Electroless&ElectroPlating)SingleunitoffrontandbacksideNGif/=0.8mmFrontSideBackSide2PatternInspectionPatternoffrontandbacksideThefinishpatternshallperoriginaldrawing(above95%).3PlatingLayer/PhotoresistGapedgeofbondpadareaNometal/photoresistinindicatedarea.4OverPlating/PartialPlatingPanelFillingholesratio99%5OverPlatingToolingholeNometalinsideofthetoolinghole.ApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page5/64.Coatingthicknesstestspecification:4.1Usingtools：Substratethickness:MicrometerCuthickness:3axismicroscopeFinalfinishthickness:X-raythicknessmeter4.2Measurementposition:Substratethickness:Position1Cuthickness:Position2Finalfinishthickness:Position34.3Inspectspec:(Treetimesaverageofmeasurement)Substratethickness:0.38±0.04mmCuthickness:65±10umFinalfinishthickness:TAI001A:Ag:0.5(0.4~1.2)um(electroless)TAI001B:Ni:5(2~8)umAu:0.075(0.05~0.15)um(electroless)TAI001C:Ni:5(2~8)umAu:0.3(0.2~0.8)um(electroless)TAI001D:Ni:5(2~8)umPd:0.1um(0.05~0.25)Au:0.1(0.05~0.25)um(electroless)TAI001E:Ni:5(2~10)umAg:3(1.5~7)um(electroplate)TAI001F:Ni:5(2~8)umAu:0.3(0.2~0.8)um(electroplate)123ApprovalSpecificationSheetforTA-IDoc.NoTAI001SeriesIssueddate2012/08/22Page6/65.ReliabilitytestNo.ItemParameterSpecification1Adhesiontest1.Temp.:RT2.Tool:3M-6003.Time:adhesive30seconds4.Angle:180°Theexteriormustbenoseparate2Solderability1.Temp.：245±5℃2.Time：5±1sec3.solderbathcomposition：(Ag/Sn/Cu=3/96.5/0.5%)Coverage＞90%3Reflow1.Temp.：280℃2.Times：3cyclesTheexteriormustbenoseparate,crackandwarpageMaintaintheelectricalfunction.6.Notices(1)Wheninspection,packagingandhandling:Mustwearglovesandmaskswheninspectproducts.MustwearlatexglovesbeforeunpackingproductsMustavoidvibration,shockandstressetc.whencarryproducts.(2)Storageconditions:Storeunder25℃±5℃、50%±10RHwhensealed.Theexpirationdateislessthan3monthswhensealed.Storeunder25℃±5℃、50%±10RHwhenunsealed.Pleasestoreunsealedpackageinairtightcontainersandusedupwithin3days.(3)Beforewirebonding：Pleasecleanandpreheatbeforewirebonding.