MT47H32M16HR-3_F

DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksFeatures•Vdd=+1.8V±0.1V,VddQ=+1.8V±0.1V•JEDEC-standard1.8VI/O(SSTL_18-compatible)•Differentialdatastrobe(DQS,DQS#)option•4n-bitprefetcharchitecture•Duplicateoutputstrobe(RDQS)optionforx8•DLLtoalignDQandDQStransitionswithCK•4internalbanksforconcurrentoperation•ProgrammableCASlatency(CL)•PostedCASadditivelatency(AL)•WRITElatency=READlatency-1tCK•Selectableburstlengths:4or8•Adjustabledata-outputdrivestrength•64ms,8,192-cyclerefresh•On-dietermination(ODT)•Industrialtemperature(IT)option•Automotivetemperature(AT)option•RoHScompliant•SupportsJEDECclockjitterspecificationOptions1Marking•Configuration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16•FBGApackage(Pb-free)–x16–84-ballFBGA(12mmx12.5mm)Rev.BCC–84-ballFBGA(10mmx12.5mm)Rev.DBN–84-ballFBGA(8mmx12.5mm)Rev.FHR•FBGApackage(Pb-free)–x4,x8–60-ballFBGA(12mmx10mm)Rev.BCB–60-ballFBGA(10mmx10mm)Rev.DB6–60-ballFBGA(8mmx10mm)Rev.FCF•FBGApackage(leadsolder)–x16–84-ballFBGA(12mmx12.5mm)Rev.BGC–84-ballFBGA(10mmx12.5mm)Rev.DFN–84-ballFBGA(8mmx12.5mm)Rev.FHW•FBGApackage(leadsolder)–x4,x8–60-ballFBGA(12mmx10mm)Rev.BGB–60-ballFBGA(10mmx10mm)Rev.DF6–60-ballFBGA(8mmx10mm)Rev.FJN•Timing–cycletime–2.5ns@CL=5(DDR2-800)-25E–2.5ns@CL=6(DDR2-800)-25–3.0ns@CL=4(DDR2-667)-3E–3.0ns@CL=5(DDR2-667)-3–3.75ns@CL=4(DDR2-533)-37E•Selfrefresh–StandardNone–Low-powerL•Operatingtemperature–Commercial(0°C≤TC≤85°C)None–Industrial(–40°C≤TC≤95°C;–40°C≤TA≤85°C)IT–Automotive,Revision:Donly(–40°C≤TC,TA≤105°C)AT•Revision:B/:D/:FNote:1.Notalloptionslistedcanbecombinedtodefineanofferedproduct.UsethePartCatalogSearchon:09005aef82f1e6e2Rev.N1/09EN1MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.©2004MicronTechnology,Inc.Allrightsreserved.ProductsandspecificationsdiscussedhereinaresubjecttochangebyMicronwithoutnotice.Table1:KeyTimingParametersSpeedGradeDataRate(MT/s)tRC(ns)CL=3CL=4CL=5CL=6-25E40053380080055-2540053366780055-3E400667667n/a54-3400533667n/a55-37E400533n/an/a55Table2:AddressingParameter128Megx464Megx832Megx16Configuration32Megx4x4banks16Megx8x4banks8Megx16x4banksRefreshcount8K8K8KRowaddressA[13:0](16K)A[13:0](16K)A[12:0](8K)BankaddressBA[1:0](4)BA[1:0](4)BA[1:0](4)ColumnaddressA[11,9:0](2K)A[9:0](1K)A[9:0](1K)512Mb:x4,x8,x16DDR2SDRAMFeaturesPDF:09005aef82f1e6e2Rev.N1/09EN2MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.©2004MicronTechnology,Inc.Allrightsreserved.Figure1:512MbDDR2PartNumbersExamplePartNumber:MT47H128M4B6-25E:DConfiguration256Megx4128Megx864Megx16128M464M832M16SpeedGradetCK=3.75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.5ns,CL=6tCK=2.5ns,CL=5-37E-3-3E-25-25E-ConfigurationMT47HPackageSpeedRevision:{PackagePb-free84-ball12mmx12.5mmFBGA84-ball10mmx12.5mmFBGA84-ball8mmx12.5mmFBGA60-ball12mmx10mmFBGA60-ball10mmx10mmFBGA60-ball8mmx10mmFBGALeadSolder84-ball12mmx12.5mmFBGA84-ball10mmx12.5mmFBGA84-ball8mmx12.5mmFBGA60-ball12mmx10mmFBGA60-ball10mmx10mmFBGA60-ball8mmx10mmFBGACCBNHRCBB6CFGCFNHWGBF6JNLowpowerIndustrialtemperatureAutomotivetemperatureLITATRevision:B/:D/:FNote:1.Notallspeedsandconfigurationsareavailableinallpackages.FBGAPartNumberSystemDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.ForaquickconversionofanFBGAcode,seetheFBGAPartMarkingDecoderonMicron’sWebsite::09005aef82f1e6e2Rev.N1/09EN3MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.©2004MicronTechnology,Inc.Allrightsreserved.ContentsStateDiagram..................................................................................................................................................9FunctionalDescription...................................................................................................................................10IndustrialTemperature..............................................................................................................................10AutomotiveTemperature...........................................................................................................................11GeneralNotes............................................................................................................................................11FunctionalBlockDiagrams.............................................................................................................................12BallAssignmentsandDescriptions.................................................................................................................15Packaging......................................................................................................................................................20PackageDimensions......................................................................