激光微细熔覆柔性加工平台CADCAM系统软件与工艺研究

华中科技大学硕士学位论文激光微细熔覆柔性加工平台CAD/CAM系统软件与工艺研究姓名：曹宇申请学位级别：硕士专业：物理电子学指导教师：曾晓雁20060822ICAD/CAMWindowsGDICADProtelPCBASCIIAutoCADDXFCAD/CAM100K~1MHz;;;;;IIAbstractLaserflexiblefabricationtechnology,whichcombinestheadvantagesofbothlaserandflexiblefabricationtechnologytogether,hasbeensuccessfullyappliedtoindustriessuchasmicroelectronicsICmanufacturing.Lasermicro-claddingtechnology,asaflexibleprocessingtechnology,iswildlyfocusedandsupposedtohavemanyfutureapplicationsinfastfabricatingthickfilmcircuitboardinthepastyears,ofwhichdesigningprofessionalmicroprocessingplatformCAD/CAMsoftwarewiththeintelligencepropertybyourselvesisveryimportantforitsengineeringapplications.Inthisdissertation,followingresearchworkhasbeendoneaboutthelasermicrocladdingtechnique:Firstly,anovelkeytechnologyfordeveloping2D(two-dimension)CADgraphicsoftwarebasedontheMicrosoftWindowsGraphicDeviceInterface(GDI)ispresented,includingtheobjectorientedsystemmodeling,basicgraphicdatastructuredesign,2Dvectorgraphsdisplayandtransform,andinteractivegraphicprocessingtechniques.Secondly,thestoredatastructureoftheProtelPCBlayoutASCIIfileandAutoCADDXFfilehavebeenfullyanalyzed,andread/writeinterfacesforbothtypesoffileshavebeendesigned,whichcaneffectivelyextendtheprofessionalthickfilmcircuitdesignabilityforourCAD/CAMsoftware.Thirdly,thestructuresaboutlayoutandroutinginthethickfilmintegratedcircuitboardhasbeendiscussedindetail,onthebasisofwhichthedesignandcomputationalformulaforthickfilmpassiveelectronicelementswerestudiedsystematically,andsomesignificantresultswereobtained.Finally,themulti-layersdirectwriteprocessingfunctionofthesoftwarewereverifiedbydirectfabricationofthethickfilmflatcapacitorwithlasermicro-claddingtechnique.Theexperimentalresultsdemonstratedthathetechnologicalkeyoffabricatingthickfilmflatcapacitoristhepreparationofthedielectricfilmwithcertainthickness.Theelectricalperformanceofthethickfilmflatcapacitorshowsthatithavegoodinsulationcharacteristic,lowdissipationfactorandrelativelyhighqualityfactorinthemediumfrequencyfrom100KHzto1MHz.Lasermicrocladdingtechniquehasprovideanovelmethodtofabricatethecapacitorswithhighqualityandexcellentperformances.Keywords:Lasermicro-claddingtechnique;Thickfilmintegratedcircuit;Software;Computeraideddesignandmanufacturing(CAD/CAM);Fileinterface;Thinkfilmcapacitor._____11[1][2][3]CAD/CAM1.1FlexibleManufacturingFM2060[2]FixedAutomationFMS80FMSFMC[4][5][6][7][8][9][10][11]2(1)(2)(3)LaserDirectWriteAdditivemethodSubtractivemethod(4)CIMS1.2ComputerAidedDesignComputerAidedManufacturingCADCAMCAD/CAM[12]1980CAD/CAM[13]1.2.1CAD/CAM196324I.E.SutherlandSKETCHPADSKETCHPADCADCAD11[14][15]31-1CAD2050CADCAD2060CADIBMGMDAC1CAD2070CADCADCVIntergraphCalmaAppliconIBMCDC2080IBMPC/XTAT32CAD2090CECAD/CAE/CAPP/CAMVisualRealityArtificialIntelligence1-1CADCAD/CAMCADCAMCADCAMCAD/CAE/CAPP/CAMCIMS[12]CAD/CAMAutoDeskAutoCADPro/EngineerUnigraphicsIIIMAGI-DEASCADAMCATIA[12][15-18]CAD/CAMCAD/CAMEDAElectronicDesignAutomation4CadenceEDAMentorEDASynopsysEDA[19]ZeniEDA[20]IC[6]CAD/CAMPCBICCAD/CAMPCBCADProtelDXPOrCADPADsCAMCAM350[21]CAD/CAM2001863CAD/CAM[22]MicroPenMEMSCAD/CAM1.2.2CAD/CAMCAD/CAMCAD/CAM[23-25]CAD/CAMCAMCAD/CAMCAD/CAMCAD/CAMCAD/CAM[15-17]51)CADCADCADCAD/CAM2)2D3D3)4)5)CAD/CAM()CAD/CAM6)CAMCAMCADCAMCAPPCAMCAM1.3SemiconductorIntegratedCircuit,SICICHybridIntegratedCircuitHICPrintedCircuitBoardPCBHIC30Å25000Å25000Å100m[26]90[26][27]6[28-30]FMS[28-51]OhmcraftMicroPen[35-36][28]MicroPen[36]CAD/CAMMicroJetx-yCAD/CAM[8][22[28]MicroPenx-yCAD/CAM20100mm/s20[52][22][52-53]PCBPCB1007PCBPCB50%PCBPCBPCBPCB30010%10%PCB10EDACAM[54]MicroPenMicroPenCAD/CAMCAD/CAM81.41.4.1863CAD/CAM[22]CAD/CAMCAD/CAMMicroPen1.4.2CAD/CAMMicroPenCADProtelPCBAutoCADDXFCAD/CAMCAD/CAMCADProtelPCBAutoCADDXFCAD/CAM1.4.3CADDirectXOpenGLCADVisualC++MFCGraphicDevicesInterfaceGDI9WindowsCAD/CAM1-1CAD/CAMLaserCAMCADCADPCBDXFCADCAMMPC02WindowsGDI32+VisualStudio.NETMFC7.1Windows2000+VisualStudio.NET2003VC++7.01-21-1CAD/CAM10CADCAD/CAM1-2112CAD2.1layout1layerCAD/CAM2-1CAD2-1122)EDAProtelPCBAutoCADDXFProtelEDA2.280[55]CAD/CAM2-2CADCAMCADCAM/132-2CAD/CAM2.3CADDXFPCB142-2MFCCObjectCObject2-3classCUnit:publicCObject{public://DECLARE_SERIAL(CUnit)//CStringID;//IDintm_PenWidth;//CPointm_RndBoxLeftDown,m_RndBoxRightUp;//intm_UnitType;//BOOLm_bFill;//CObject15intm_Layer;//BOOLm_HaveFind;//CPointm_FoundPoint;//intm_DrawStatus;//public://virtualvoidDrawUnit(CDC*pDC){};//voidSetBrushOrg(CDC*pDC,CBrush*brush);//virtualvoidShowSelectPoint(CDC*pDC);//virtualvoidShowMovingLine(CDC*pDC,CPointpt1,CPointpt2);//virtualintIsOnMarginPoint(CPointpoint);//virtualBOOLIsInRgn(CPointpoint);//virtualvoidSerialize(CArchive&ar);//CUnit();//virtual~CUnit();//CUnitoperator=(CUnit&unit);//virtualvoidInitial();//};CADMFC2-12-1MFCArrayListMapMapListArrayCTypePtrListCObListCUnit*,CUnit*typedefCTypedPtrListCObList,CUnit*CFigureObjList;162.42.4.1WindowsVCGDIWindows82-22-2WindowsXYmmMM_TEXTMM_LOMETRIC0.1mm0.1MM_HIMETRIC0.01mm0.01MM_LOENGLISH0.254mm0.254MM_HIENGLISH0.0254mm0.0254MM_TWIPS0.0176mm0.0176MM_ISOTROPICx=yMM_ANISOTROPICx