无铅生产原则The No Lead manufacturing Initiative

TheNoLeadmanufacturingInitiativeTheNoLeadmanufacturingInitiativeDr.SrinivasT.RaoUCLAWorkshoponLead-freeSolderforElectronic,Optical,andMEMsPackagingandManufacturingSeptember5th2002ConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainAddressMfg.NeedsofOEMsandAddressMfg.NeedsofOEMsandEMSsEMSs•Monitorenvironmentallegislationandadjustactivitiesifnecessary•Recommendan‘industrystandard’lead-freealloy(reflowandwave)•DevelopcriteriaforindustrytousetoevaluatePb-freeprocesses•ShareinformationinatimelymannertopromotecommonpathtoPb-free•Develop“bestpractices”experimentalprocedurestomeasuremechanical,thermal,electricalandwettingpropertiesofPb-freesolders•Developsolderdatabasesforpropertiesandliteraturereferencesforlead-freealloysinthepublicdomain•Promotemodelingforreliabilitythroughgenerationofbestpossibledataandmodelingmethods•WorkwithcomponentandPCBsupplierstodevelopspecificationstomeethighertemperaturereflowconditionsConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainNorthAmericaElectronicsGoalNorthAmericaElectronicsGoalN.AmericanOEM’s/EMS’needtoprepareprocessestobeabletodeliverPb-freeproductsin2001withan‘eye’tototalPb-eliminationby2004.–Japandriving“Green”consumerproducts.!Timetablesseemtobeholding(2001-2003)–NEMIcompaniesreceivedseriousinquiries.–EUlegislationbanningleadinelectronicsin2004,proposalpushedoutto2007.!IndividualCountriescanshortentimeframe.NEMIengagedthetechnicalsideofPb-freerelatedtocompatibilitywithexistingassemblyinfrastructure.ConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainLegislationLegislation–Europe:WEEE/ROHS.WEEEexpectedtocometoavotein4Q2002.Stickingpointistheproducttake-backandcompanyresponsibilityofROHS.–US:newrulesregardingreportingofPb,butnolegislationonhorizonforbanningPborPb-containingsolder.–Asia:Nolegislation,butJapanesecompaniesarestillactivelyengagedineliminatingPbfromelectronics.PushbackofWEEEdate+lackofotherlegislationhastakenimmediatepressureoffdrivetoimplement.ButmanyOEMsmovingforwardformarketingreasonsConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainMajorTaskGroupObjectivesMajorTaskGroupObjectivesDemonstratecapabilitytodeliverproductsinvolumein2001withPb-freeinterconnects.FacilitateacommonPb-freesolderalloycompositionforN.Americanelectronicsassembly.WorkwithcomponentandPCBsupplierstodevelopspecificationsnecessarytomeethighertemperaturereflowconditions.DevelopcriteriathatindustrycanusetoevaluatePb-freeprocesses.Monitorenvironmentallegislationtoadjustactivitiesifnecessary.ShareourinformationinatimelymannertopromotecommonpathtoPb-free.CommonalityisanoverarchinggoalforallNEMIactivitiesConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainWorldwideWorldwidePbPb--freeActivitiesfreeActivitiesNCMS–recenthightemperaturesolderalloyprojectreportreleased,Pb-freesoldersperformedwell.Gintic(Singapore)–ConsortiumworkingonprocessandreliabilityofPb-freesolders.JEITA–Continuingworkonsoldersandtinwhiskering.Soldertec–Performedreliabilitytests,supportedSnAgCu.NowworkingonTinwhiskering.JEDEC–020revisionwithelevatedtemperaturesforMSLtestingoutforballot.IPC–Supportwithmeetings,standardsdevelopment.EPA–LifeCycleproject.ProposalforcompaniestopartneronaprojectandsplitcostwithEPA.GECI–Promotingglobalcooperationandcommonality.ConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainCooperation/CommonalityCooperation/CommonalityMaximumbenefitachievedthroughworldwideagreementandcooperation.–NEMIismemberofGECI(GlobalEnvironmentalCooperationInitiative).HDPUG,SEMI,Soldertec,MEPTEC,SAC,ITRITaiwanalsomembers.+PromotedsinglealloySnAgCu+DefinitionofPb-free(0.2%)Update/createJEDECstandards.–WorkingwithcommitteeonJ-STD-020.ConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainMajorProjectActivitiesMajorProjectActivitiesAlloy–CarolHandwerker,NIST–AlloyMaterialPropertydevelopment–Interfacew/academia,gov’tagenciesComponents/PCBs–RichParker,Delphi–EffectofHightemperaturereflow–Pb-freeterminationsSolderReliability–JohnSohn,NEMI–Transparenttestprocedure–CommondatatosharewithindustryProcessDevelopment–JasbirBath,Solectron–GenericprocessforReliabilitytestboards–ProcesscharacterizationbenchmarkTinWhisker–SwamiPrasad,ChipPACConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainSolderAlloyTeamSolderAlloyTeamMission:ToprovidetheTaskForcewithcriticaldataandanalysesneededformakingdecisionswithrespecttosolderalloys,manufacturing,andassemblyreliability.NEMIchoseSn-Ag-Cu,restofworldmovinginthatdirection.Developed“bestpractices”experimentalprocedurestomeasurethemechanical,thermal,electricalandwettingpropertiesoflead-freesolders.!DevelopingSolderReliabilityModelingGuidelinesCriticalreviewofreporteddeformationdataandmodelsConnectwithandStrengthenYourSupplyChainConnectwithandStrengthenYourSupplyChainSolderAlloyTeamAccomplishmentsSolderAlloyTeamAccomplishmentsConductedextensiveliteraturesearchincludingEuropeandFarEastDeter