Leadframe-Product-Wirebond-design-rule-E

1ASEW/B(L/F)GroupASEW/B(L/F)GroupLeadframeLeadframeProductDESIGNRULEProductDESIGNRULERevEReviser:NiksWuDate:1/11’082ASEW/B(L/F)GroupASEW/B(L/F)GroupBondPadDesignAB(um)C(um)D(um)E(um)F(um)G(um)65um4612578520360um3572538520355um3522488020350um34724380203A:BondPadPitchC,C’:BondPadSizeB:PadToPadClearanceE,E’:BondPadOpeningD:GlassivationAreaOnPadF:BondPadPitchatCorner1~5pad’sG:BondPadEdgetoDieEdgeSpaceCC’ABDEE’GFBasicallyDesignIn-linepadBasicallyDesign(6~15pad’s)In-LineBondPadofBasicallyDesignPrototypeNote:1.Bondpadcanbesquareifnoprobingshortconcerns.2.Lastfourpitchatcornerisbiggerthanothers.3ASEW/B(L/F)GroupASEW/B(L/F)GroupIn-LineBondPadPitch(PROPOSEDPADSIZEANDPADLAYOUTFORULTRAFINEPITCH)Note:BondpadcanbesquareifnoprobingconcernsABB1CC1DEFG907474707021610810080696965652111081007568686464271001007066666262241001006561615757248510060576053562385100555260485623801005047974393237010050478343792370100(Unit:um)NormaldesignConditionProbingmarkconcern(Squashballandprobemarkcompleteseparationdesign)Probingmarkconcern(Squashballandprobemark25%overlapdesign)FFFFGGLongPadAtCorner(ForMulti-wires)MOLDGATEBasicdesignFig1CBEDREF.(Fig1)B1C11AA:In-linebondpadpitchB,B1:BondpadsizeC,C1:BondpadopeningD:GlassivationareaonpadE:In-linepadtopadspaceF:Bondpadpitchatcorner5padsG:Cornerpaddistance4ASEW/B(L/F)GroupASEW/B(L/F)GroupStaggeredBondPadPitch(PROPOSEDPADSIZEANDPADLAYOUTFORULTRAFINEPITCH)AA1BB1CC1DEFG9085747470702161081008080696965652111081007578686864642710010070766666626224100100657661615757248510060765760535623851005576526048562380100501124797439323701005098478343792370100(Unit:um)ConditionProbingmarkissue(Squashballandprobemarkcompleteseparationdesign)Probingmarkissue(Squashballandprobemark25%overlapdesign)NormaldesignAAAFFFFAFFFFAAGGMOLDGATEMOLDGATELongPadAtCorner(ForMulti-wires)BasicdesignFig1ROW1padROW2padBREF.Fig1B1C1CA1EDAA:In-linebondpadpitchA1:StaggeredpitchofROW1-ROW2padB,B1:BondpadsizeC,C1:BondpadopeningD:GlassivationareaonpadE:In-linepadtopadspaceF:Bondpadpitchatcorner5padsG:Cornerpaddistance5ASEW/B(L/F)GroupASEW/B(L/F)GroupW/BLongBondPadSizeforCornerBondGHJFGFHJGFHJ90um1801767470270266747080um1601566965240236696570um1401366662210206666265um1301266157195191615760um1201166056180176605655um1101066056165161605650um1009660561501466056DoubleBondTripleBondIn-lineBondPadPitch6ASEW/B(L/F)GroupASEW/B(L/F)GroupProposedfinepitchlongbondpaddesignforprobemarkconcern(1)SquashballandprobemarkcompleteseparationdesignACBEDB1C1C6C5AC5CBEDB1C1C6(2)Squashballandprobemark25%overlapdesign7ASEW/B(L/F)GroupASEW/B(L/F)GroupProposedlongbondpaddesignformultibondconcernB2B1C1C2ACBDoublebondTriplebondAB2C2AB2C2901641609025425080149145802292257514313975218214701361327020620265126122651911876011711360177173551071035516215850979350147143458885451331304078754011811535686535103100(Unit:um)(Unit:um)A:In-linebondpadpitchB2:Bondpadsizeofmulti-bondpadC2:Bondpadopeningofmulti-bondpad8ASEW/B(L/F)GroupASEW/B(L/F)GroupProposedbondpaddesignforbumpbondconcernB1C1ACB3C4C3A3A:In-linebondpadpitchA3:In-linebondpadpitchofbumpbondB,B1:BondpadsizeC,C1:BondpadopeningofsinglebondpadB3,B4:BondpadsizeofbumpbondC3,C4:BondpadopeningofbumpbondB1CC1A3=A+5umB3=B+5umB4=B1+5umC3=C+5umC4=C1+5umNormalbondingBumpbondingABBondingmethodIn-linebondpadpitchBondpadsizeBondpadopening9ASEW/B(L/F)GroupASEW/B(L/F)GroupW/B昀大允許銲線角度icrosoftExcel工作表DieLoopHeightBTNKAngle=10degPadpitch=50umK1/2TipDiameterβPadPitchβWireAnglecapability10ASEW/B(L/F)GroupASEW/B(L/F)GroupW/B銲線角度WireAngleRemark:Whenwireangleover45°andwirespacesmallerthan1wirediameter,itneedthroughDRSreviewSmallthan1wirediameterLargerthan1wirediameterREJECTAcceptOver45°Over45°11ASEW/B(L/F)GroupASEW/B(L/F)GroupWireSelectionRuleA1-1ForQFPpackageMAX.WIRELENGTHIN-LINEBONDPADPITCHBONDPADOPENINGWIREDIAMETER5080UM(200MIL)MWL≦5334UM(210MIL)B.P.P.≥80(UM)B.P.O.≥80(UM)33UM(1.3MIL)4826UM(190MIL)MWL≦5080UM(200MIL)B.P.P≥80(UM)B.P.O≥63(UM)30UM(1.2MIL)4572UM(180MIL)MWL≦4826UM(190MIL)B.P.P≥70(UM)B.P.O≥60(UM)28UM(1.1MIL)4064UM(160MIL)MWL≦4572UM(180MIL)B.P.P≥60(UM)B.P.O≥53(UM)25UM(1.0MIL)3556UM(140MIL)MWL≦4064UM(160MIL)B.P.P≥55(UM)B.P.O≥48(UM)23UM(0.9MIL)3048UM(120MIL)MWL≦3556UM(140MIL)B.P.P≥50(UM)B.P.O≥43(UM)20UM(0.8MIL)MWL≦3048UM(120MIL)B.P.P≥50(UM)B.P.O≥43(UM)18UM(0.7MIL)A1-2ForLQFP/TQFP/TSOP/PLCC/PDIP/SOJ/SOPpackageMAX.WIRELENGTHIN-LINEBONDPADPITCHBONDPADOPENINGWIREDIAMETER4826UM(190MIL)MWL≦5080UM(200MIL)B.P.P.≥80(UM)B.P.O.≥80(UM)33UM(1.3MIL)4572UM(180MIL)MWL≦4826UM(190MIL)B.P.P≥80(UM)B.P.O≥63(UM)30UM(1.2MIL)4318UM(170MIL)MWL≦4572UM(180MIL)B.P.P≥70(UM)B.P.O≥60(UM)28UM(1.1MIL)3810UM(150MIL)MWL≦4318UM(170MIL)B.P.P≥60(UM)B.P.O≥53(UM)25UM(1.0MIL)3302UM(130MIL)MWL≦3810UM(150MIL)B.P.P≥55(UM)B.P.O≥48(UM)23UM(0.9MIL)2540UM(100MIL)MWL≦3302UM(130MIL)B.P.P≥50(UM)B.P.O≥43(UM)20UM(0.8MIL)MWL≦2540UM(100MIL)B.P.P≥50(UM)B.P.O≥43(UM)18UM(0.7MIL)A1-3ForPUNCHQFNpackageMAX.WIRELENGTHIN-LINEBONDPADPITCHBONDPADOPENINGWIREDIAMETER4572UM(180MIL)MWL≦4826UM(190MIL)B.P.P≥90(UM)B.P.O≥63(UM)30UM(1.2MIL)4318UM(170MIL)MWL≦4572UM(180MIL)B.P.P≥80(UM)B.P.O≥60(UM)28UM