贴体包装技术及应用

:2010-04-26;:2010-05-28:吴瑞平,男,安徽当涂人,合肥通用机械研究院高级工程师,长期从事包装机械的研发,境内外发表论文20余篇贴体包装技术及应用(合肥通用机械研究院,合肥230031):本文论述了贴体包装技术原理应用及发展,特别是在食品真空贴体包装方面的应用:贴体包装;真空贴体包装;食品真空贴体包装;应用:TB489:A:1005-1295(2010)04-0065-05do:i10.3969/.jissn.1005-1295.2010.04.015SkinPackagingTechnologyandApplicationWURuiping(HefeiGeneralMachineryResearchInstitute,Hefei230031,China)Abstract:Thispaperintroducestheoryandapplicationanddevelopmentofskinpackaging,particularlyinvacuumskinpackagingforfood.Keywords:skinpackaging;vacuumskinpackaging;vacuumskinpackagingforfood;application11.1(SkinPackaging)(VacuumSkinPackagingVSP),,,:(),,,,111.2:,10,(),,,21),,;2),;3),,;4),;5),,,:1),;652),,;3),,;4),,,360,,80,,,40,,,30,44.1,,,,,21-2-3-4-5-6-4.24.2.1()2,:(3):31)(),,;,;2),;3),,,;4),,,:(1),,3:,,,;,,,,(2),,,,,,,,,16620102841/mm0.10.150.2/s152025/s6~15(3)2,,,,,441-2-3-4-5-,,,(4),,(5),,4.2.2,::,;,5abc54.2.2.1(1)6,(2)1),,;,2),,;3),,,,4),;,61-2-3-4-5-6-7-8-67,5),,,,,7,67(3)1),,,2),3),,,,,,4),5),,,,4.2.2.2,,,,8,4.2.2.3881-2-3-4-5-6-,,,,,,,,10~1555.1,,,,(1)1),;2),;3),;4);5),(2)1),,2),:,;!//,;∀;682010284#,(3)1),:,,;!;∀,;2),,,,,5.2(1)1):,;!(Surlyn),,,;∀(SE),;#(PVC)(PE)(PET);∃ATW(NS),,;%,(SR)(ST)0.1~0.25mm,(/),;2):,,;!,,,,;∀,(2)1),,,,,::,;!:,;,;∀:,;,,,,,2),,();,,,,PSPETPVC,,,[1]B.P.F.Day.UK.Chilledfoodpackaging[Z].CampdenandChorleywoodFoodResearchAssociation,2002,Seced:135-152.[2]MultivacSeppHaggenmullerGmbHandCo.KG.Multivacfoodpackaging[J/OL].WoodheadPublishingLimited,2009.[3]KochEquipmentLLC.Brochures[J/OL].WoodheadPublishingLimited,2009.69