MC33886

MOTOROLASEMICONDUCTORTECHNICALDATA©Motorola,Inc.2004Documentordernumber:MC33886/DRev6.0,03/200433886SimplifiedApplicationDiagramMotor33886MCU5.0VV+CCPIN1IN2D1D2FSOUT1OUT2PGNDOUTOUTOUTOUTAGNDINV+5.0AH-BridgeThe33886isamonolithicH-BridgeidealforfractionalhorsepowerDC-motorandbi-directionalthrustsolenoidcontrol.TheICincorporatesinternalcontrollogic,chargepump,gatedrive,andlowRDS(ON)MOSFEToutputcircuitry.The33886isabletocontrolcontinuousinductiveDCloadcurrentsupto5.0A.Outputloadscanbepulsewidthmodulated(PWM-ed)atfrequenciesupto10kHz.AFaultStatusoutputreportsundervoltage,shortcircuit,andovertemperatureconditions.Twoindependentinputscontrolthetwohalf-bridgetotem-poleoutputs.TwodisableinputsforcetheH-Bridgeoutputstotri-state(exhibithighimpedance).The33886isparametricallyspecifiedoveratemperaturerangeof-40°C≤TA≤125°C,5.0V≤V+≤28V.TheICcanalsobeoperatedupto40Vwithderatingofthespecifications.TheICisavailableinasurfacemountpowerpackagewithexposedpadforheatsinking.Features•SimilartotheMC33186DH1withEnhancedFeatures•5.0Vto40VContinuousOperation•120mΩRDS(ON)H-BridgeMOSFETs•TTL/CMOSCompatibleInputs•PWMFrequenciesupto10kHz•ActiveCurrentLimitingviaInternalConstantOFF-TimePWM(withTemperature-DependentThresholdReduction)•OutputShortCircuitProtection•UndervoltageShutdown•FaultStatusReporting•Pb-FreePackagingDesignatedbySuffixCodeVW5.0AH-BRIDGEORDERINGINFORMATIONDeviceTemperatureRange(TA)PackageMC33886DH/R2-40°Cto125°C20HSOPMC33886VW/R2DHSUFFIXVW(Pb-FREE)SUFFIXCASE979C-0220-TERMINALHSOP33886SimplifiedApplicationDiagram33886FreescaleSemiconductor,IFreescaleSemiconductor,Inc.ForMoreInformationOnThisProduct,Goto:(each)25uA80µA25µACurrentLimit,ShortCircuitSenseCircuitChargePump5.0VRegulatorGateDriveOver-temperatureUndervoltageV+CCPFreescaleSemiconductor,IFreescaleSemiconductor,Inc.ForMoreInformationOnThisProduct,Goto:(i.e.,IN1logicHigh=OUT1logicHigh).4,5,16V+PositivePowerSupplyPositivesupplyconnections.6,7OUT1H-BridgeOutput1Output1ofH-Bridge.8,20DNCDoNotConnectEitherdonotconnect(leavefloating)orconnecttheseterminalstogroundintheapplication.Theyaretestmodeterminalsusedinmanufacturingonly.9–12PGNDPowerGroundDevicehigh-currentpowerground.13D2Disable2ActiveLowinputusedtosimultaneouslytri-statedisablebothH-Bridgeoutputs.WhenD2islogicLow,bothoutputsaretri-stated.14,15OUT2H-BridgeOutput2Output2ofH-Bridge.17CCPChargePumpCapacitorExternalreservoircapacitorconnectionforinternalchargepumpcapacitor.18D1Disable1ActiveHighinputusedtosimultaneouslytri-statedisablebothH-Bridgeoutputs.WhenD1islogicHigh,bothoutputsaretri-stated.19IN2LogicInputControl2TruelogicinputcontrolofOUT2(i.e.,IN2logicHigh=OUT2logicHigh).DNCAGNDIN2D1CCPV+OUT2OUT2D2PGNDPGNDFSV+OUT1OUT1DNCPGNDPGNDIN1V+1234567891020191615141312111817FreescaleSemiconductor,IFreescaleSemiconductor,Inc.ForMoreInformationOnThisProduct,Goto:(Note1)VIN-0.1to7.0VFSStatusOutput(Note2)VFS7.0VContinuousCurrent(Note3)IOUT5.0AESDVoltageforDHPackageHumanBodyModel(Note4)MachineModel(Note5)VESD1VESD2±2000(Note6)±200VESDVoltageforVWPackageHumanBodyModel(Note4)MachineModel(Note5)VESD1VESD2±2000±200VStorageTemperatureTSTG-65to150°CAmbientOperatingTemperature(Note7)TA-40to125°COperatingJunctionTemperatureTJ-40to150°CTerminalSolderingTemperature(Note8)DHSuffixVW(Pb-FreeSuffix)TSOLDER220260°CApproximateJunction-to-BoardThermalResistance(andPackageDissipation=6.0W)(Note9)RθJB~5.0°C/WNotes1.ExceedingtheinputvoltageonIN1,IN2,D1,orD2maycauseamalfunctionorpermanentdamagetothedevice.2.Exceedingthepull-upresistorvoltageontheopendrainFSterminalmaycausepermanentdamagetothedevice.3.Continuouscurrentcapabilitysolongasjunctiontemperatureis≤150°C.4.ESD1testingisperformedinaccordancewiththeHumanBodyModel(CZAP=100pF,RZAP=1500Ω).5.ESD2testingisperformedinaccordancewiththeMachineModel(CZAP=200pF,RZAP=0Ω).6.AllterminalsarecapableofHumanBodyModelESDvoltagesof±2000VwithtwoexceptionspertainingonlytotheDHsuffixpackage:(1)D2toPGNDiscapableof±1500Vand(2)OUT1toAGNDiscapableof±1000V.7.Thelimitingfactorisjunctiontemperature,takingintoaccountthepowerdissipation,thermalresistance,andheatsinking.8.Terminalsolderingtemperaturelimitisfor10secondsmaximumduration.Notdesignedforimmersionsoldering.Exceedingtheselimitsmaycausemalfunctionorpermanentdamagetothedevice.9.Exposedheatsinkpadplusthepowera