芯片IC封装形式图片介绍大全

ICICBGABallGridArrayEBGA680LTQFP100LSC-705LSIPSingleInlinePackageSOPSmallOutlinePackageSOJ32LJSOJSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO-18TO-220TO-247TO-264TO3TO52TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayZIPZig-ZagInlinePackageuBGAMicroBallGridArrayZIPZig-ZagInlinePackageBQFP132C-BendLeadCERQUADCeramicQuadFlatPackCeramicCaseGullWingLeadsTO263/TO268LBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT223SOT223SOT23SOT23/SOT323SOT26/SOT363SOT343SOT523SOT89SOT89LAMINATETCSP20LChipScalePackageTO252SODIMMSmallOutlineDualIn-lineMemoryModuleSIMM30SingleIn-lineMemoryModuleSocket603FosterSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUPCI64bit3.3VPeripheralComponentInterconnectSIMM72SingleIn-lineMemoryModuleSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUPCMCIASIMM72SingleIn-lineMemoryModuleIC1BGA(ballgridarray)LSI(PAC)200LSIQFP()1.5mm360BGA31mm0.5mm304QFP40mmBGAQFPMotorolaBGA()1.5mm225LSI500BGABGAMotorolaOMPACGPAC(OMPACGPAC)2BQFP(quadflatpackagewithbumper)QFP()ASIC0.635mm84196(QFP)3PGA(buttjointpingridarray)PGA(PGA)4C(ceramic)CDIPDIP5CerdipECLRAMDSP()CerdipEPROMEPROM2.54mm842DIPG(G)6CerquadQFPDSPLSICerquadEPROMQFP1.52WQFP351.27mm0.8mm0.65mm0.5mm0.4mm323687CLCC(ceramicleadedchipcarrier)EPROMEPROMQFJQFJG(QFJ)8COB(chiponboard)COBTAB9DFP(dualflatpackage)SOP(SOP)10DIC(dualin-lineceramicpackage)DIP()(DIP).11DIL(dualin-line)DIP(DIP)12DIP(dualin-linepackage)DIPICLSI2.54mm66415.2mm7.52mm10.16mmskinnyDIPslimDIP(DIP)DIPDIPcerdip(cerdip)13DSO(dualsmallout-lint)SOP(SOP)14DICP(dualtapecarrierpackage)TCP()TAB()LSI0.5mmLSIEIAJ()DICPDTP15DIP(dualtapecarrierpackage)DTCP(DTCP)16FP(flatpackage)QFPSOP(QFPSOP)17flip-chipLSILSILSI18FQFP(finepitchquadflatpackage)QFP0.65mmQFP(QFP)19CPAC(globetoppadarraycarrier)MotorolaBGA(BGA)20CQFP(quadfiatpackagewithguardring)QFPLSI(L)Motorola0.5mm20821H-(withheatsink)HSOPSOP22pingridarray(surfacemounttype)PGAPGA3.4mmPGA1.5mm2.0mmPGA1.27mmPGA(250528)LSI23JLCC(J-leadedchipcarrier)JCLCCQFJ(CLCCQFJ)24LCC(Leadlesschipcarrier)ICQFNQFNC(QFN)25LGA(landgridarray)227(1.27mm)447(2.54mm)LGALSILGAQFPLSI26LOC(leadonchip)LSI1mm27LQFP(lowprofilequadflatpackage)QFP1.4mmQFPQFP28LQUADQFP78LSIW3208(0.5mm)160(0.65mm)LSI19931029MCM(multi-chipmodule)MCMLMCMCMCMDMCMLMCMC()ICMCMLMCMD()SiAl30MFP(miniflatpackage)SOPSSOP(SOPSSOP)31MQFP(metricquadflatpackage)JEDEC()QFP0.65mm3.8mm2.0mmQFP(QFP)32MQUAD(metalquad)OlinQFP2.5W2.8W199333MSP(minisquarepackage)QFI(QFI)MSPQFI34OPMAC(overmoldedpadarraycarrier)MotorolaBGA(BGA)35P(plastic)PDIPDIP36PAC(padarraycarrier)BGA(BGA)37PCLP(printedcircuitboardleadlesspackage)QFN(LCC)(QFN)0.55mm0.4mm38PFPF(plasticflatpackage)QFP(QFP)LSI39PGA(pingridarray)PGALSI2.54mm6444764256PGA1.27mmPGA(PGA)(PGA)40piggybackDIPQFPQFNEPROM41PLCC(plasticleadedchipcarrier)64kDRAM256kDRAMLSIDLD()1.27mm1884JQFPPLCCLCC(QFN)J(LCCPCLPPLCC)1988JQFJQFN(QFJQFN)42PLCC(plasticteadlesschipcarrier)(plasticleadedchipcurrier)QFJQFN(LCC)(QFJQFN)LSIPLCCPLCC43QFH(quadflathighpackage)QFPQFP(QFP)44QFI(quadflatI-leadedpackgac)IIMSP(MSP)QFPICMotorolaPLLIC1.27mm186845QFJ(quadflatJ-leadedpackage)JJ1.27mmQFJPLCC(PLCC)DRAMASSPOTP1884QFJCLCCJLCC(CLCC)EPROMEPROM328446QFN(quadflatnon-leadedpackage)LCCQFNQFPQFPQFP14100LCCQFN1.27mmQFN1.27mm0.65mm0.5mmLCCPCLCPLCC47QFP(quadflatpackage)(L)QFPQFPLSILSIVTRLSI1.0mm0.8mm0.65mm0.5mm0.4mm0.3mm0.65mm3040.65mmQFPQFP(FP)QFPQFP(2.0mm3.6mm)LQFP(1.4mm)TQFP(1.0mm)LSI0.5mmQFPQFPSQFPVQFP0.65mm0.4mmQFPSQFPQFP0.65mmQFPBQFP(BQFP)GQFP(GQFP)TPQFP(TPQFP)LSIQFP0.4mm348QFP(Gerqad)48QFP(FP)(QFPfinepitch)QFP0.55mm0.4mm0.3mm0.65mmQFP(QFP)49QIC(quadin-lineceramicpackage)QFP(QFPCerquad)50QIP(quadin-lineplasticpackage)QFP(QFP)51QTCP(quadtapecarrierpackage)TCPTAB(TABTCP)52QTP(quadtapecarrierpackage)19934QTCP(TCP)53QUIL(quadin-line)QUIP(QUIP)54QUIP(quadin-linepackage)1.27mm2.5mmDIP6455SDIP(shrinkdualin-linepackage)DIPDIP(1.778mm)DIP(2.54mm)1490SHDIP56SHDIP(shrinkdualin-linepackage)SDIP57SIL(singlein-line)SIP(SIP)SIL58SIMM(singlein-linememorymodule)SIMM2.54mm301.27mm72SOJ14DRAMSIMM3040DRAMSIMM59SIP(singlein-linepackage)2.54mm223ZIPSIP60SKDIP(skinnydualin-linepackage)DIP7.62mm2.54mmDIPDIP(DIP)61SLDIP(slimdualin-linepackage)DIP10.16mm2.54mmDIPDIP62SMD(surfacemountdevices)SOPSMD(SOP)63SO(smallout-line)SOP(SOP)64SOI(smallout-lineI-leadedpackage)II1.27mmSOPIC(IC)2665SOIC(smallout-lineintegratedcircuit)SOP(SOP)66SOJ(SmallOut-LineJ-LeadedPackage)JJDRAMSRAMLSIDRAMSOJDRAMSIMM1.27mm2040(SIMM)67SQL(SmallOut-LineL-leadedpackage)JEDEC()SOP(SOP)68SONF(SmallOut-LineNon-Fin)SOPSOPICNF(non-fin)(SOP)69SOF(smallOut-Linepackage)(L)SOLDFPSOPLSIASSP1040SOP1.27mm8441.27mmSOPSSOP1.27mmSOPTSOP(SSOPTSOP)SOP70SOW(SmallOutlinePackage(Wide-Jype))SOP