JESD22-A103-E

JEDECSTANDARDHighTemperatureStorageLifeJESD22-A103E(RevisionofJESD22-A103D,December2010)OCTOBER2015JEDECSOLIDSTATETECHNOLOGYASSOCIATIONNOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSIstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECattheaddressbelow,orreferto©JEDECSolidStateTechnologyAssociation20153103North10thStreetSuite240SouthArlington,VA22201-2107Thisdocumentmaybedownloadedfreeofcharge;howeverJEDECretainsthecopyrightonthismaterial.Bydownloadingthisfiletheindividualagreesnottochargefororreselltheresultingmaterial.PRICE:ContactJEDECPrintedintheU.S.A.AllrightsreservedPLEASE!DON’TVIOLATETHELAW!ThisdocumentiscopyrightedbyJEDECandmaynotbereproducedwithoutpermission.Forinformation,contact:JEDECSolidStateTechnologyAssociation3103North10thStreetSuite240SouthArlington,VA22201-2107orreferto(RevisionofA103D)TESTMETHODA103EHIGHTEMPERATURESTORAGELIFE(FromJEDECBoardBallotJCB-15-48,formulatedunderthecognizanceofJC-14.1SubcommitteeonReliabilityTestMethodsforPackagedDevices.)1ScopeThetestisapplicableforevaluation,screening,monitoring,and/orqualificationofallsolidstatedevices.Thehightemperaturestoragetestistypicallyusedtodeterminetheeffectsoftimeandtemperature,understorageconditions,forthermallyactivatedfailuremechanismsandtime-to-failuredistributionsofsolidstateelectronicdevices,includingnonvolatilememorydevices(dataretentionfailuremechanisms).ThermallyactivatedfailuremechanismsaremodeledusingtheArrheniusEquationforacceleration.Duringthetest,acceleratedstresstemperaturesareusedwithoutelectricalconditionsapplied.Thistestmaybedestructive,dependingontime,temperatureandpackaging(ifany).2Referencedocuments(informative)JEP122,FailureMechanismsandModelsforSemiconductorDevices.JESD22-A113,PreconditioningofNonhermeticSurfaceMountDevicesPriortoReliabilityTesting.JESD22-B101,ExternalVisual.JESD47,Stress-Test-DrivenQualificationofIntegratedCircuits.JESD94,ApplicationSpecificQualificationUsingKnowledgeBasedTestMethodology.J-STD-020,JointIPC/JEDECStandard,Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurface-MountDevices.JEDECStandardNo.22-A103EPage2TestMethodA103E(RevisionofA103D)3Apparatus3.1HightemperaturestoragechambersTheapparatusrequiredforthistestshallconsistofacontrolledtemperaturechambercapableofmaintainingthespecifiedtemperatureovertheentiresamplepopulationundertest.3.2ElectricaltestequipmentElectricalequipmentcapableofperformingtheappropriatemeasurementsforthedevicesbeingtested,includingwriteandverifytherequireddataretentionpattern(s)fornonvolatilememories.4Procedure4.1HightemperaturestorageconditionsThedevicesundertestshallbesubjectedtocontinuousstorageatoneofthetemperatureconditionsofTable1.Table1—HightemperaturestorageconditionsConditionA:+125(-0/+10)°CConditionB:+150(-0/+10)°CConditionC:+175(-0/+10)°CConditionD:+200(-0/+10)°CConditionE:+250(-0/+10)°CConditionF:+300(-0/+10)°CNOTECAUTIONshouldbeexercisedwhenselectinganacceleratedtestconditionsincetheacceleratedtemperatureusedmayexceedthecapabilitiesofthedeviceandmaterials,therebyinducing(overstress)failuresthatwouldnotoccurundernormaluseconditions.Asaminimumthefollowingitemsshouldbetakenintoconsideration:1)Meltingpointofmetalspresent,especiallysolder.Degradationofmetalsincludingmetallurgicalinterfaces.2)Packagedegradation.Forexample:glasstransitiontemperatureandthermalstability(inair)ofanypolymericmaterials.3)Moistureratingofpackage(perJ-STD-020).4)Temperaturelimitationsofsilicondevices.Forexample:chargelossinnonvolatilememories.5)Testconditions(temperature,time)shouldbeselectedtocovertheaccelerationofthecorrespondingfailuremechanismandtheanticipatedlifetime(op