集成电路3D技术

2010/10/201STATE-OF-THE-ART3DINTEGRATIONGANHUI,STEVEN©IMEC2010OUTLINEIntroductionaboutIMECApplicationAreasDriven3DIntegration3DIntegrationTechnology©IMEC2010ConclusionsSEMI大半导体产业网▸EstablishedbystategovernmentofFlandersinBelgiumIMEC1984–2010ofFlandersinBelgium▸Non-profitorganization▸Initialinvestment:62M€▸Initialstaff:~702010▸World-leadingresearchin©IMEC2010nanoelectronics▸Revenue:275M€(incl.44M€grantfromFlandersgovernment)▸Staff:1750worldwide▸Worldwidecollaboration600companiesIMECCAMPUSFAB23,200m2CleanRoom300mmpilotlineBallRoom,Cleansub-FABFAB1,Continuousoperation:24hrs/7days©IMEC2010Total:8,000m2CleanRoom4,800m2CleanRoom1,750m2Class1200mmpilotlineContinuousoperation:24hrs/7daysSEMI大半导体产业网’smostadvancedstate-of-the-artresearchfacilitiesFullyoperationalsinceJuly2006(~500M€)©IMEC2010IMECINTHEWORLDimectheNetherlandsiffiJimecBelgiumimecTaiwanRegionimecChinaimecofficeJapanimecofficeUS©IMEC2010IMECtheNetherlands:ResearchOrganizationinEindhovenPartofHolstCentreSEMI大半导体产业网’STOTALREVENUE25030050100150200©IMEC2010019841985198619871988198919901991199219931994199519961997199819992000200120022003200420052006200720082009Totalrevenue(P&L),inmillioneuroGrantfromtheGovermentofFlanders,inmillioneuroABOUT60REGIONSUNDERONEROOF100TOTALSTAFF:1775INCL.521RESIDENTS58foreignregions;999Belgian(January2010)4879362117514442222290262030405060708090999Belgians©IMEC2010121641113311171281811244111159281292621411215411301020AlbaniaAlgeriaAustriaBrazilBulgariaCanadaChiliChinaColombiaCzechiaEgyptFinlandFranceGeorgiaGermanyGreatBritainGreeceGuatemalaHungariaIndiaIranIraqIrelandIsraelItalyIvoryCoastJapanKoreaLithuaniaMalaysiaMexicoMoldovaNepalNicaraguaNigeriaPakistanPolandPortugalRomaniaRussiaSerbia/MontenegroSingaporeSlovakiaSouthAfricaSpainSudanSwedenSwitzerlandTaiwanTheNetherlandsTunisiaTurkeyU.S.A.UkrainiaUzbekistanVenezuelaVietnamSEMI大半导体产业网©IMEC2010TotalR&Dcostvs.technologynode,relativeto0.25mm,Source:TSMCContinuousneedfornewmaterialsandnewprocessingtechniquesPARTNERINGFORCOST-EFFECTIVERESEARCHLogicICMemoryICCentralizedResearchPlatformWorld-wideCenterofExcellenceEquipmentSuppliersSoftwareMaterialSuppliersBuildcriticalmassShareR&Dcosts©IMEC2010SoftwaresuppliersRegionalGovernmentEuropeUniversitiesSEMI大半导体产业网–connectingtechnologyandsystemdesignIMECCMORESiGeMEMSSiliconphotonicsVisionsystemsPowerdevicesandmixed-signaltechnologiesGaNpowerelectronicsandLEDsHUMAN++Wearableandimplantablebodyareanetworks(withHolstCentre)LifesciencesIMECENERGYGNltid©IMEC2010PhotovoltaicsGaNpowerelectronicsandLEDsIMECSMARTSYSTEMSPower-efficientgreenradiosVisionsystemsLarge-areaelectronicsandsystems-in-foil(withHolstCentre)Wirelessautonomoustransducersolutions(withHolstCentre)STATE-OF-THE-ART3DINTEGRATIONAPPLICATIONAREASDRIVING3DINTEGRATION©IMEC2010SEMI大半导体产业网MobileconsumerMemorystackingHighPerformancecomputing©IMEC2010MicrosystemIntegrationMOBILECONSUMERELECTRONICSPowerManagementPowerManagementRFRFModemModem•2G–GSM/GPRS/EDGE•3G–CDMA2000/EV-HDOHSPA/WCDMA•4G–LTE•2G–GSM/GPRS/EDGE•3G–CDMA2000/EV-HDOHSPA/WCDMA•4G–LTEMultimedia•30MPCameraMultimedia•30MPCameraCPUCPUMemoryMemory©IMEC2010•30MPCamera•Videoencoding/decoding•2D/3Dgaming•Audio•30MPCamera•Videoencoding/decoding•2D/3Dgaming•AudioCPU•1GHz/1V•QuadcoreCPU•1GHz/1V•Quadcore•256gBNVM•8gbDRAM•256gBNVM•8gbDRAMLowpowerLowpowerLowcostLowcostSEMI大半导体产业网▸IncreasememorybandwidthGDDR3GDDR5DDR35121024204840963Dstack3Dstack12.8GB/sency(Mhz)▸Increasememorybandwidth▸MaintaininglowpowerAnalog-logicstacks▸HeterogeneoustechnologychoicesLPDDR1LPDDR2641282568321285122048LowparallelismHighparallelismIOcountIOfrequ©IMEC2010Heterogeneoustechnologychoices▸Time-to-market▸Reuse/AdaptdevicesolutionsinadjacentmarketsegmentstelematicsrouterstrackingM2MGamesmartbooksSet-topboxebookHIGHDENSITYMEMORYSTACKSHeterogeneousMemoryStackInusetoday:Wire-bondeddiestackRepartitionedMemorystack&LogicandI/Ocircuits3D-TSVisenablinghlLowspeed&lowI/O:today:Highspeedwidebandwidth&large#tiersHomogeneousMemoryStack©IMEC20103D-TSV“inside”applicationsNotsuitablefor3D-TSVdiestackingtechnologyEfficientuseofscaledmemoryandscaledlogictechnologiesWire-bondeddiestackStronglycostdriven3D-TSVisenablingtechnologySEMI大半导体产业网DiestackingdriverGDDR3GDDR5102420484096Mobile12.8GB/sGraphics512GB/sy(Mhz)Veryhighpowerprocessordevices:ThermalconstraintslimitmemoryonlogicstackingUseof3DSIInterposersubstratesLPDDR1LPDDR2MobileWideIOGDDR3DDR316XGDDR3x1Gb6412825651283212851220488192IOcountIOfrequenc©IMEC2010DRAMLogicDRAMLogicI/