PIP (Pin In Paste reflow) training WK1243

VandenAbeeleJan1VandenAbeeleJanOPTIONA:Pasteprintingontopside(componentside)Incaseofsinglereflowandcomponentbodydoesallowsuchprinting(read:shape/standoffdoesallowprintingbelowthecomponentwithoutriskofshortunderdevice)2VandenAbeeleJan3stencilPCBSolderpasteINPUTOUTPUTPRINTINGSolderland/padBasematerialsqueegeeSolderpasteSolderresistPininPaste(PIP)printingprocess:Step1:printingVandenAbeeleJan4ComponentleadPininPaste(PIP)printingprocess:Step2:componentplacement:topsideviewVandenAbeeleJan5PininPaste(PIP)printingprocess:Step2:componentplacementBottomsideviewComponentleadVandenAbeeleJanPininPaste(PIP)printingprocess:Step3:reflowa)Solderpastestartingtomeltb)Moltensolderis‘rising’duetocapillaryeffectReflowoven6VandenAbeeleJanPhenomenonofsolderpasteshunting(1)Situationafterpastedeposition,(2)Aftercomponentplacement,(3)AftersolderingPininPaste(PIP)printingprocess:7VandenAbeeleJan8PininPaste(PIP)printingprocess:Step3:reflow:LFpaste(highmeltingtempalloy)VandenAbeeleJan9PininPaste(PIP)printingprocess:Step3:reflowfinalresultsTopview:FluxresiduesofpasteclearlyvisibleBottomviewVandenAbeeleJanOPTIONB:Pasteprintingonbottomside(othersidethancomponentside)incaseofDoublerefloworIncasestandoff/designofcomponentsdoesn’tallowpasteprintingundercomponentbodyPastetype:Useoflowmeltingpaste-toavoiddropoffofcomponents(egBGA’sduringsecondreflowrun)-Becauseoflowtemperatureresistanceofthethroughholecomponents/connectors10VandenAbeeleJanProcessflow4AOIPTHplacement(sigt)SMDPlacement(sigt)ReflowOvenBarepcbTestingIdent.&PackagingPaste(sigt)RepairBarcodelabelRepairShipmentKittingAOICompPlacement(sigb)ReflowOvenRepairPaste(sigb)Pre-prog:Pre-prog:DividingBoardinverterUVGlueDispensingBoardinverterUVCuresigt-sideupsigb-sideupLowmeltingsolderpasteCVP-520PininPaste(PIP)printingprocess:Processflowfordoublereflow-PIPpasteonbottomsideprinting(asusedforTPVISIONSSB2K12)11VandenAbeeleJanstencilPCBSolderpasteINPUTOUTPUT(forPIP)PRINTINGSolderland/padBasematerialsqueegeeSolderpasteSolderresistPininPaste(PIP)printingprocess:Step1:printing(*)12(*)includingprintingforPIPpads,aswellasconventialSMTpadsVandenAbeeleJanPasteprinting(process5e,5x)PininPaste(PIP)printingprocess:Step1:pasteprintingPasteprinting(AlphaCVP520-SnBiAg(42/57.6/0.4)alloy)13VandenAbeeleJanPasteprinting(process5e,5x)PininPaste(PIP)printingprocess:Step1:pasteprinting14VandenAbeeleJan15PininPaste(PIP)printingprocess:Step2:fliptheprintedboard(boardinverter)VandenAbeeleJan16PininPaste(PIP)printingprocess:Step3:componentplacementtopsideviewVandenAbeeleJan17ComponentleadPininPaste(PIP)printingprocess:Step3:componentplacementBottomsideviewVandenAbeeleJanPasteprinting(process4e,4x,2be,2bx)PininPaste(PIP)printingprocess:Step3:componentplacementBottomsideview18VandenAbeeleJanPasteprinting(process4e,4x,2be,2bx)PininPaste(PIP)printingprocess:Step3:componentplacementBottomsideview19VandenAbeeleJanGluetestGluingprocess(manualdispensing)PininPaste(PIP)printingprocess:Step4a:Fixthecomponentwithglue(*)(*)tooavoiddroppedoffcomponentsduringsecondreflowrun20Gluingprocess(autodispensing)PininPaste(PIP)printingprocess:Step4a:Fixthecomponentwithglue(non-cured)gluedropsforfixationoftheconnectorsontheboards(duringflipover,beforereflowoven)VandenAbeeleJanGluetestUVcuring(manual/tablelamp)PininPaste(PIP)printingprocess:Step4b:UVcuringoftheglue22UVcuring(auto)ResultsaftercuringVandenAbeeleJanPininPaste(PIP)printingprocess:Step5:Invertboard+onsertionofsmdcomponents23VandenAbeeleJanPininPaste(PIP)printingprocess:Step6:reflow(Lowmeltingtemppaste)24VandenAbeeleJanPininPaste(PIP)printingprocess:Step6:reflowBottomsideviewReflowovenbeforeafter25VandenAbeeleJanSolderingconditionsinpictures(scart,1012)PininPaste(PIP)printingprocess:Step6:reflowBottomsideview26VandenAbeeleJanSolderingconditionsinpictures(scart,1012)PininPaste(PIP)printingprocess:Step6:reflowtopsideview27VandenAbeeleJanX-RAYpicturesX-raypicturesofPIPjointsPininPaste(PIP)printingprocess:28VandenAbeeleJanPininPaste(PIP)printingprocess:crosssectionsofsolderjoint29VandenAbeeleJanCross-sectionofoptimalPIPjointsPininPaste(PIP)printingprocess:crosssectionsofsolderjoint30VandenAbeeleJanPerfectlysolderedPIPjoints,sufficientmeniscusPininPaste(PIP)printingprocess:crosssectionsofsolderjoint31VandenAbeeleJanAssessmentcriteria/failuresAssessmenttobedoneaccordingIPC-A-610EInnextslidesonecanfindsometypicalPIPrelatedfailures32VandenAbeeleJanDepositedVolume=RequiredvolumeDepositedvolume75-100%ofRequiredvolumeDepositedvolume=50-75%ofRequiredvolumeDepositedvolume=0-50%ofRequiredvolumeAcceptableHolefilling(pendingpastefilling)3333Hiddenfailure(voids)FailureOptimalVandenAbeeleJanSolderingconditionsinpictures(USBs,1001,1002)Padwetting/meniscus/holefillingInsufficientholefilling/wettability75%holefilling:acceptableDefectclass3–solderfill75%oftheboardthickness34VandenAbeeleJanCross-sectionofbadqualityPIPjointsPadwetting/meniscus/holefilling35VandenAbeeleJangluecontaminationinconnector,resultinginpoorcontactsornon-possibilitytoinsertthefemalepartGluecontaminationofconnectors36VandenAbeele