KLMxGxxEMx-B031(eMMC5.0-1xnm-based-e_MMC)1.1

-1-SAMSUNGELECTRONICSRESERVESTHERIGHTTOCHANGEPRODUCTS,INFORMATIONANDSPECIFICATIONSWITHOUTNOTICE.Productsandspecificationsdiscussedhereinareforreferencepurposesonly.AllinformationdiscussedhereinisprovidedonanASISbasis,withoutwarrantiesofanykind.ThisdocumentandallinformationdiscussedhereinremainthesoleandexclusivepropertyofSamsungElectronics.Nolicenseofanypatent,copyright,maskwork,trademarkoranyotherintellectualpropertyrightisgrantedbyonepartytotheotherpartyunderthisdocument,byimplication,estoppelorother-wise.Samsungproductsarenotintendedforuseinlifesupport,criticalcare,medical,safetyequipment,orsimilarapplicationswhereproductfailurecouldresultinlossoflifeorpersonalorphysicalharm,oranymilitaryordefenseapplication,oranygovernmentalprocurementtowhichspecialtermsorprovisionsmayapply.ForupdatesoradditionalinformationaboutSamsungproducts,contactyournearestSamsungoffice.Allbrandnames,trademarksandregisteredtrademarksbelongtotheirrespectiveowners.ⓒ2013SamsungElectronicsCo.,Ltd.Allrightsreserved.Rev.1.1Oct.2013SAMSUNGCONFIDENTIALKLMxGxxEMx-B031Samsunge·MMCProductfamilye.MMC5.0Specificationcompatibilitydatasheet-2-IFTHEREISANYOTHEROPERATIONTOIMPLEMENTINADDITIONTOSPECIFICATIONINTHEDATASHEETORJEDECSTANDARD,PLEASECONTACTEACHBRANCHOFFICEORHEADQUARTERSOFSAMSUNGELECTRONICS.datasheete·MMCRev.1.1KLMxGxxEMx-B031SAMSUNGCONFIDENTIALRevisionHistoryRevisionNo.HistoryDraftDateRemarkEditor0.01.InitialissueJun.26,2013TargetS.M.Lee1.01.8GBisCustomerSample2.4GB/16GBarePreliminarySampleAug.14,2013FinalS.M.Lee1.11.4GB/16GBareCustomerSampleOct.08,2013FinalS.M.LeeTableOfContents-3-IFTHEREISANYOTHEROPERATIONTOIMPLEMENTINADDITIONTOSPECIFICATIONINTHEDATASHEETORJEDECSTANDARD,PLEASECONTACTEACHBRANCHOFFICEORHEADQUARTERSOFSAMSUNGELECTRONICS.datasheete·MMCRev.1.1KLMxGxxEMx-B031SAMSUNGCONFIDENTIAL1.0PRODUCTLIST..........................................................................................................................................................42.0KEYFEATURES.........................................................................................................................................................43.0PACKAGECONFIGURATIONS.................................................................................................................................53.1153BallPinConfiguration.......................................................................................................................................53.1.111.5mmx13mmx0.8mmPackageDimension................................................................................................63.2ProductArchitecture................................................................................................................................................74.0e.MMC5.0feature......................................................................................................................................................84.1HS400mode............................................................................................................................................................85.0TechnicalNotes..........................................................................................................................................................105.1S/WAgorithm..........................................................................................................................................................105.1.1PartitionManagement.......................................................................................................................................105.1.1.1BootAreaPartitionandRPMBAreaPartition............................................................................................105.1.1.2EnhancedPartition(Area)..........................................................................................................................105.1.2Bootoperation...................................................................................................................................................115.1.3UserDensity......................................................................................................................................................125.1.4AutoPowerSavingMode..................................................................................................................................125.1.5Performance......................................................................................................................................................136.0REGISTERVALUE.....................................................................................................................................................146.1OCRRegister..........................................................................................................................................................146.2CIDRegister...................................................................................................................