Die-bond-process-introduction

BasicDieBondingProcess&QualityBasicDieBondingProcess&Quality芯片键合制程介绍芯片键合制程介绍TypicalDieBondingSequenceTypicalDieBondingSequenceWaferColletathomepositionDieready,VacuumapplyEjectorpinupColletlowerdowntopickpositionEjectorpinbacktohomeDieispickedupDieispickedupColletlowerdowntobondpositionDieisbondedontoL/FxxL/FEpoxydispensedonL/FPadVacuumtoholdsubstrateEpoxydispensedfromsyringeL/FindextobondpositionVacuumtoholdsubstrateMylardelaminatefromdieTypicalDieBondingSequenceTypicalDieBondingSequenceB/AlowertopicklevelandpositionEjectorrisesupandB/AliftupthediebyvacuumB/AswingstobondlevelandpositionforbondingDieAttachProcessElementsDieAttachProcessElementsDispensingMaterials:Epoxy,Substrate,Controlsystem,Toolse.g.nozzle,pin..Process:selectionofmethodolgy,parametersettingfordifferentmaterialsandqualityrequirementsPickandPlaceMaterials:Die,Mylar&frame,Ejectorpin&cap,ColletProcess:selectionoftoolsandbondingplatformBondingQualityAspects:Dieplacement,Rotation,Tilting,BondLineThickness….PropertyAblestikAblebond841-LMISR4QMIQMI509HitachiHitachi4730SumitomoSumitomoCRM-1575CFillerSilverSilverSilverSilicaViscosity8000cps@25C9000cps@25C89Pa.s@25C22Pa.s@25CThixotropicIndex5.63.55.12.8WorkLife18hours@25C48hours@25CN/A48hours@25CConductivityConductiveConductiveConductiveNon-conductiveRecommendedCureCycle1hour@175C15mins@150C60sec@200C3mins@150CDieShearStrength3500psi@25C(for80sq.mils)36kgf@25C(for300sq.mils)11.39Mpa@200C(for80sq.mils)15.7RT@200CEpoxyTypeDispensingDispensingBackgroundInformationofEpoxyBackgroundInformationofEpoxyFunctionofepoxyAdheresthedieonsubstrateCommonly-usedepoxyTypicalPropertyPasteDieAttachinPlasticPackagesAdhesivePropertiesHandlingPropertiesRheologyCureConditionAssemblyPropertiesBleedOutgassingAdhesionReliabilityPropertiesVoidsThermal/ElectricalConductivityIonicContaminationStressWhyhandlingisimportantDispensingDispensingBackgroundInformationofEpoxyBackgroundInformationofEpoxyDispensingDispensingSubstrateSubstrateCommonsubstratesusedPCBLeadframeBGACeramicConsiderationsWettingpropertiesPadtodieratioDispensingMethodologyDispensingMethodologyTime-Pressure-VacuumSystemVolumetricDispensingRotatingDiscTime-Pressure-VacuumSystemAprocessoftheapplicationofcompressedairinapresetperiodforthefluiddispensingApplyVacuumforremovingthecompressedairMaintainthepressurePreventdripping&suckbackDispensingMethodologyDispensingMethodologySyringewithepoxyVacuumPressureDispensingMethodologyDispensingMethodologyTime-Pressure-VacuumSystemDrawBacksAircompressibilityDifficultyinregulatingthedispensingconsistentlyInternalpressure(Pi)changeswithepoxylevelDifferentepoxylevelchangesairvolumeinsidethesyringeTimeforvacuumsuctionandcompressairrefillingischangingEaseofdripping&sucking-inofairbubblesVolumetricDispensingProcessPrinciplePositiveDisplacementSystem(PistonPump)ApplycompressedairPullupthepistontofeedepoxyintothechamberSwitchthevalveportPistonispushedtodispenseepoxyDispensingMethodologyDispensingMethodologyValveChamberPistonSyringeDispensingMethodologyDispensingMethodologyVolumetricDispensingAdvantagesTruepositivedisplacementdispensingNodrippingInconsistencycomesfrompistonpositionerrorandepoxycompressibilityonlyHighaccuracyDrawBacksSlowepoxyfeed-inrateComplicateddesignandlongertime&costlymaintenanceDispensingMethodologyDispensingMethodologyRotatingDiscDischoldingepoxyrotatedwithastationaryspreaderLevelofepoxythicknessindisccanbeadjustedEpoxydiscrotationStampingpinmoveinX&ZDispensingDispensingApplication&ToolsApplication&ToolsShowerHeadDispensingAprocessfordispensingtheepoxyontotheleadframewithafixeddispensingpatternaccordingtotheshowerheadsizeAdoptedtocertainrangeofdiesize(30x30~150x150mils)DispensingDispensingApplication&ToolsApplication&ToolsShowerHeadNomenclatureofshowerheadHolesHolediameterNeedlelength4-pointstamping2-pointstampingDispensingApplication&ToolsDispensingApplication&ToolsEpoxyDrumStampingAprocessfordispensingtheepoxyontotheleadframewithadispensedepoxydotaccordingtothestampingpinsizeAdoptedtosmalldieonly(7x7~20x20mils)StampingpinNomenclatureofstampingpinpintipradiuspintiplengthDispensingApplication&ToolsDispensingApplication&ToolsTiplengthTipradiusStampingpintipDispensingDispensingApplication&ToolsApplication&ToolsWritingAprocessfordispensingtheepoxyontotheleadframewithaselectabledispensingpatternaccordingtothediesizeAdoptedtowiderangeofdiesize(30x30~1000x1000mils)I.D.0.33mmI.D.0.21mmI.D.0.51mmDispensingDispensingApplication&ToolsApplication&ToolsWritingpinNomenclatureofwritingpinwritingpinlengthouterdiameterinnerdiameterCrossDouble-Y-HorizontalDouble-Y-HorizontalEffectofusageofDispensingMethodEffectofusageofDispensingMethod(Advantages&DisadvantagesofDifferentDispensingMethod)(Advantages&DisadvantagesofDifferentDispensingMethod)AdvantagesofdifferentdispensingmethodAdvantagesofdifferentdispensingmethodDisadvantagesofdifferentdispensingmethodDisadvantagesofdifferentdispensingmethodHigherDispensingspeedConsistentdispensedpatternEaseof