Reflow-Profile-Management

ReflowProfileManagementWave-SolderingProcessPurpose目的UsetheOven-Temperature-testmachinetomeasuretheworkingconditionandtemperature-setupoftheSMTReflowOven。利用炉温测试仪器,检测SMT回流炉的工作状态及温度设定。Scope范围1、ApplicableProduction适用产品ThedocumentisapplicabletoallMODELproducedbyMO3-SMTinWong’sWelcoTechnology(Shenzhen)LtdinChina。本文件适用于王氏华高(中国)有限公司MO3-SMT生产的所有MODEL。2、ApplicableEquipment适用设备ThedocumentisapplicabletoallReflowOveninSMTinWong’sWelcoTechnology(Shenzhen)LtdinChina。本文件适用于王氏华高(中国)有限公司SMT所有的回流炉。ReferentDocuments参考文件SolderPaste,SPECofRedGluesupplier,specialrequestformaterial,specialrequestfromcustomers。锡浆,红胶供应商SPEC、物料特别要求，客户特别要求。Definition定义AccordingtousedsolderpastsandtheRedGlueSPECofsuppliersandthespecialrequestofthematerialandcustomers,adjustthesettingofthetemperatureoftheoventoachievethebestsolderingeffect。根据所使用锡浆及红胶供应商的SPEC,以及物料和客户的特别要求,调整炉温设定,达到最佳焊接效果。Responsibility责任Fortheengineeringtechnicianisresponsibleforadjustingthetemperatureintemperatureareaandthespeedofoperationrefertocommontemperaturesettingtoachievethebestsolderingsolidification。由工程部技术员负责参照一般设定温度,对温区温度和运转速度进行相应调整,达到最佳焊接固化效果。Procedure程序1、PleasedecidetheSolderPasteTemperatureProfileaccordingtothefollowingone。锡浆温度曲线的确定,参考下列相应PROFILE：Iftherearespecialrequestsfromcustomersoractualproduction,theprofilecanbechangedonthebaseoftheengineer’sinstruction。如客户或实际生产有特殊要求,可根椐工程师指导作相应修订。1.1.SolderPaste锡浆ALPHA：WS609Thebiggestspeedoftemperatureincreasingordecreasing:1~3℃/Sec温度上升或下降最大速度：1~3℃/SecTheminimum/maximumstickingtimewhenthetemperatureis120℃to160℃A:50~80Sec在120℃~160℃之间最小/最大停留时间:A:50~80SecWhenthetemperatureisabove183℃B:30~60Sec在183℃以上时间:B30~60SecWhenthetemperatureisabove210℃C:0-30Sec在210℃以上时间:C0~30SecMeltingtemperature210~230℃SMD在回流时温度：210~230℃Procedure程序ACB183Rflowtemperatureprofile1.2、SolderPaste(锡浆)KOKI：CA-95-620A、Thespeedoftemperatureincreasinganddecreasing1.5~3℃/Sec温度上升或下降速度：1.5~3℃/SecB、Thestickingtimewhenthetemperatureisbetween120℃and160℃:40~90Sec在120℃~160℃之间停留时间：40~90SecC、Meltingtemperature:210~225℃Time:0～25Sec回流温度：210~225℃时间：0～25SecProcedure程序1.3TAMURA：SQ-20-25FC①Thespeedoftemperatureincreasing:1-3℃/S升温速度：1-3℃/秒②Thetimeforthetemperatureof120to160℃A:50~80Sec120~160℃时间:A50~80Sec③210~235℃,BodyPart(部)：C0-30Sec④Whenthetemperatureisabove183℃:LeadPart:B30-60Sec183℃以上:Lead部:B30-60Sec⑤LeadPart:Thehighesttemperatureabove205℃Lead部：最高温度大于205℃Procedure程序ACBProcedure程序1.4SENJU:M705-221BM5-32-11(LeadFree无铅)A．Thespeedoftemperatureincreasing:1-5℃/s升温速度：1-5℃/秒B．Thetimeforthetemperatureof120to180℃A:50~150Sec120~180℃时间：A50~150SecC．230℃~260℃,BodyPart(部):C0-40SecD.Whenthetemperatureisabove220℃:LeadPart:B:Above20Sec220℃以上：Lead部：B20Sec以上E.LeadPart:Thehighesttemperatureabove230℃Lead部：最高温度大于230℃Procedure程序1.5LOCTITE：MP2181.Thespeedoftemperatureincreasing:1-3℃/s升温速度：1-3℃/秒2.Thetimeforthetemperatureof100to183℃A:90~180Sec100~183℃时间：A90~180Sec3.210~235℃，BodyPart(部):C0-30Sec4.Whenthetemperatureisabove183℃:LeadPart:B:30-90Sec183℃以上：Lead部：B30-90Sec5.LeadPart:Thehighesttemperatureabove205℃Lead部：最高温度大于205℃Procedure程序ACBProcedure程序ThedecisionoftheSolderPasteReflowProfileofallkindsoftheModels:AccordingtodifferenttemperatureofdifferentModelsinthedifferenttemperatureareaandinthestandardsofaboveprocesswindows,achievethebestsoldereffect.ThetemperaturevaluesrefertotheprocessesinthedocumentsofPQAPofeveryModel:ReflowSolder-8125各种Model的锡浆回流曲线的确定:针对不同的Model在Reflow各温区设定不同的。温度值,在以上工艺窗口标准内,达到最佳焊接效果。温度值参照各个Model的PQAP(生产品质保证计划控制计划表)文件中的工序:回流焊接－8125。Procedure程序ThestandardofRedGlueSolidificationTemperatureProfile红胶固化温度曲线标准PleasedecidetheRedGlueTemperatureProfileaccordingtothefollowingone红胶温度曲线的确定,参考下列相应PROFILE：Iftherearespecialrequestsfromcustomersoractualproduction,theprofilecanbechangedonthebaseoftheengineer’sinstruction如客户或实际生产有特殊要求,可根据工程师指导作相应修订。Procedure程序RedGlue(红胶):SOMAKOTE:IR-100Whenthetemperatureisabove150℃A:20-60Sec在150℃以上时间A：20-60SecA150℃A130℃RedGlue(红胶)：SOMAKOTE：120HWhenthetemperatureisabove130℃B:90-150Sec在130℃以上时间B：90-150SecA115℃RedGlue(红胶):SOMAKOTE:IR-130Whenthetemperatureisabove115℃C:60Sec在115℃以上时间C：60SecThedecisionoftheRedGlueProfileofallkindsoftheModels:AccordingtodifferenttemperatureofdifferentModelsinthedifferenttemperatureareaandinthestandardsofaboveprocesswindows,achievethebestsoldereffect.ThetemperaturevaluesrefertotheprocessesinthedocumentsofPQAPofeveryModel:RedGluesolidify-8160所有各种Model的红胶固化曲线的确定:针对不同的Model,在Reflow的各温区设定不同的温度值,在以上工艺窗口标准内,达到最佳的固化效果。温度值参照各个Model的PQAP(生产品质保证计划控制计划表)文件中的工序:红胶固化－8160AllkindofReflowProfilecontent所有ReflowProfile应包含的内容：1）FileName文件名2）ModelName产品型号3）Date、Time日期、时间4）ReflowNo机器编号5)Thedifferenttemperaturevaluesindifferentareas.各温区设定的温度值6)BeltSpeed运输带速度7)thePositionoftest-point测试点位置8)Tester测试人Theconstitutesofthenameofthefilesofthetemperatureprofiles温度曲线文件名的构成Thestandardsforthenameofthefilesofthetemperatureprofiles所有Profile的文件名构成方式如下：XXXXXXMachineNO(机器编号).ModelName.Date日期ThetemperatureprofilesofallModelsshouldbenamedasaboveandsaved所有Model的温度曲线均按上述方式命名并SaveThepreservationofallProfile所有的Profile的保存ThetemperatureprofileofallModelshouldbeclassifiedaccordingtodifferentcustom