基于MSP430单片机的温度PID算法设计

南阳理工学院本科生毕业设计(论文)学院（系）：电子与电气工程学院专业：自动化学生：黄帅豪指导教师：殷华文完成日期2014年5月南阳理工学院本科生毕业设计（论文）基于MSP430单片机的温度PID算法设计DesignofTemperaturePIDAlgorithmBasedonMSP430SingleChipMicrocomputer总计：20页表格：0个插图：13幅南阳理工学院本科毕业设计（论文）基于MSP430单片机的温度PID算法设计DesignofTemperaturePIDAlgorithmBasedonMSP430SingleChipMicrocomputer学院（系）：电子与电气工程学院专业：自动化学生姓名：黄帅豪学号：105090640035指导教师（职称）：殷华文（副教授）评阅教师：完成日期：南阳理工学院NanyangInstituteofTechnology基于MSP430单片机的温度PID算法设计I基于MSP430单片机的温度PID算法设计自动化专业黄帅豪[摘要]本设计基于MSP430F149单片机，以IAREmbeddedWorkbench软件为开发平台，在MSP430中用自编的位置式PID算法程序实现对电加热锅炉水温的控制，并在上位计算机上实现组态王软件监控。Pt100热电阻信号经放大调理后通过MSP430ADC模块送入单片机。在MATLAB中通过一元二次方程进行温度数据拟合，把拟合结果在MSP430中编程进行温度数据标度变换，上位机向MSP430发送温度设定值和PID参数，根据组态王软件监控结果对算法进行分析和改进，加入不完全微分和积分分离程序。通过实验验证和结果分析，温度控制无超调,稳态误差0.3℃。[关键词]MSP430单片机；位置式温度PID算法；温度数据拟合；不完全微分；积分分离DesignofTemperaturePIDAlgorithmBasedonMSP430SingleChipMicrocomputerAutomationSpecialtyHUANGShuai-haoAbstract:ThedesignisbasedonSCMMSP430F149,usingIAREmbeddedWorkbenchsoftwareasadevelopmentplatform,torealizethetemperaturecontrolofelectricwaterboilerwithlocationPIDalgorithmprogramcompiledinMSP430,andrealizestheKingviewsoftwareinuppercomputermonitoring.Pt100thermalresistancesignalisamplifiedbyMSP430ADCafterconditioningmoduleintothemicrocontroller.ThetemperaturedatathroughatwoquadraticequationsintheMATLAB,thefittingresultsareprogrammedinMSP430temperaturedatascaleconversion,computersetvalueandPIDparametertosendsettemperaturetoMSP430,afteranalyzedandimprovedonthealgorithmaccordingtothemonitoringresultsofKingviewsoftware,withincompletedifferentialandintegralseparationprocedure.Throughexperimentandanalysisoftheresults,thetemperaturecontrolhasnoovershoot,steady-stateerrorof0.3℃.KeyWords:MSP430singlechipmicrocomputer;positiontypetemperaturePIDalgorithm;temperaturedatafitting;incompletedifferential;integralseparation基于MSP430单片机的温度PID算法设计II目录1引言........................................................................................................................................11.1单片机温度PID算法的发展现状......................................11.2本课题的研究意义及前景............................................11.3论文组织结构......................................................12系统整体方案设计与关键技术分析....................................................................................22.1系统主要工作原理..................................................22.2系统整体设计方案..................................................32.2.1温度信号采集设计方案................................................................................32.2.2单片机程序设计方案....................................................................................33系统硬件电路的选型及设计................................................................................................53.1单片机的选型......................................................53.2开关电源模块设计..................................................63.3前向模拟通道设计..................................................73.3.1前置放大器....................................................................................................83.3.2采样保持器....................................................................................................83.4输出驱动模块设计..................................................84系统软件设计........................................................................................................................84.1软件开发平台......................................................84.2温度控制程序设计.................................................104.2.1主程序..........................................................................................................104.2.2PID算法程序...............................................................................................114.2.3ADC模数转换程序.......................................................................................134.2.4定时器设置程序..........................................................................................134.2.5异步通讯程序..............................................................................................144.2.6温度拟合程序..............................................................................................155系统调试及结果分析..........................................................................................................165.1系统整体的调试和结果............................................165.1.1MODBUS-ASCII的调试.................................................................................165.1.2上位机监控画面..........................................................................................175.2结果分析..........................................................................................................................18结束语......................................................................................................................................19基于MSP430单片机的温度PID算法设计III附录..........................................................................................................................................21致谢..........................................................................................................................................