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印刷電路板(PCB)(Printedcircuitboard)什么是印刷線路板2IACConfidential■印刷電路板(Printedcircuitboard),簡稱PCB.■線路板的功能:固定各種電子元器件,同時把各個電子元器件用該線路板所敷設的銅皮進行電氣連接。并且絕緣性能良好。■線路板的原理,是在基板上用熱壓工藝貼上一層很薄的銅箔,用印刷法把電路(線路)印在銅箔上,再用用印刷法把电路印在铜箔上,再用腐蝕法(化學溶劑)將不需要的銅箔蝕刻掉,留下的銅箔便構成電路(線路),經過鉆孔,表面處理(涂鍍層),電路板便制成了。■印刷線路板的最大特點是裝配的元件緊湊,美觀,體積小,適合工廠的大規模生產。也適合各種電子小制作。印刷線路板的類型3IACConfidential■PCB的类型,按疊構分:單面板、雙面板,多層板。■表面處理方式:a.噴錫(HASL-HotAirSolderLeveling),錫鉛合金。保護銅面并提供后續制程良好的焊接基地。因應環保要求已出現無鉛噴錫。b.镀金。多用于金手指部位(連接器的插接)。優越的導電性和抗氧化性。c.化學鎳金。穩定的接觸電導性。金鎳比:2~5um:100~150umd.護銅劑OSP(OrganicSolderabilityPreservatives)),防氧化膜涂劑,優于其他表面處理的可焊性。e.選化.先局部鍍金或化金,其余部位做OSP.多層印刷電路板的製程IACConfidential5多次埋孔MultipleBlindedVia流程圖PCBMfg.FLOWCHART顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業務(SALESDEPARTMENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)MLB全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)除膠渣(DESMER)通孔電鍍(E-LESSCU)DOUBLESIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)雷射鑽孔(LASERABLATION)BlindedVia埋孔鑽孔(IVHDRILLING)埋孔電鍍(IVHPLATING)埋孔多層板內層流程(INNERLAYERPRODUCT)IACConfidential6TypicalPCBManufacturingProcess1.內層基板(THINCORE)2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)LaminateCopperFoilIACConfidential7典型多層板製作流程-MLB4.內層線路製作(顯影)(Develop)3.內層線路製作(曝光)(Expose)A/WIACConfidential8典型多層板製作流程-MLB5.內層線路製作(蝕刻)(Etch)6.內層線路製作(去膜)(StripResist)IACConfidential9典型多層板製作流程-MLB7.疊板(Lay-up)8.壓合(Lamination)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6IACConfidential109.鑽孔(Drilling)10.電鍍(Desmear&CopperDeposition)典型多層板製作流程-MLBIACConfidential11典型多層板製作流程-MLB11.外層線路壓膜(OutlayerDryFilmLamination)12.外層線路曝光(Expose)IACConfidential12典型多層板製作流程-MLB13.外層線路曝光後(AfterExposed)14.外層線路顯影(Develop)IACConfidential13典型多層板製作流程-MLB13.外層線路曝光後(AfterExposed)14.外層線路顯影(Develop)IACConfidential14典型多層板製作流程-MLB15.外層線路製作(蝕刻)(Etch)16.外層線路製作(去膜)(StripResist)IACConfidential15典型多層板製作流程-MLB18.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)17.防焊(綠漆)製作(SolderMask)IACConfidential161.下料裁板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.內層板壓乾膜(DryFilmResistCoat)IACConfidential173.曝光(Expose)4.曝光後(AfterExpose)Artwork(底片)Artwork(底片)PhotoResistIACConfidential185.內層板顯影(Develop)PhotoResist6.酸性蝕刻(Power/Ground/Signal)(Etch)PhotoResistIACConfidential198.黑化(OxideCoating)7.去乾膜(StripResist)IACConfidential209.疊板(Lay-up)Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)IACConfidential2110.壓合(Lamination)墊木板鋁板11.鑽孔(P.T.H.或盲孔Via)(Drill&Deburr)IACConfidential2212.鍍通孔及一次電鍍(Desmear&CopperDeposition)13.外層壓膜(D/FPhotoResistCoat)PhotoResistIACConfidential2314.外層曝光(Expose)15.曝光後(AfterExpose)uv光源IACConfidential2416.外層顯影(Develop)17.線路蝕刻(酸性蝕刻)(Etch)IACConfidential2518.去乾膜(StripResist)19.噴塗(液狀綠漆)(SolderMaskCoat)IACConfidential2620.防焊曝光(Expose)21.綠漆顯影(Develop)S/MA/WIACConfidential2722.印文字(Legend)23.噴錫(浸金……)(HAL,Immersiongold……)R105WWEI94V-0WWEI94V-0R105印刷電路板的檢驗PCB的檢驗IACConfidential29PCB檢驗大項:慣孔電鍍蝕刻金手指線路PCB外觀PCB的檢驗IACConfidential30慣孔慣孔中不可有膠渣或銅屑慣孔中不可斷裂或空洞慣孔中蝕回深度須在0.3~3英絲之間PCB的檢驗IACConfidential31電鍍附著力檢驗:3M(610)膠帶經過熱正憾後鍍層不可有浮離現象具有良好可焊性PCB的檢驗IACConfidential32蝕刻側蝕不可超過銅層厚度鍍層不可有懸溢(OVERHANG)PCB的檢驗IACConfidential33金手指鍍金表面平滑均勻,不可有損傷,雜質層長度等於或高於裁切線鍍金輿線路交接處有細小黑線,但不可露銅PCB的檢驗IACConfidential34線路線路缺口/針孔/裂痕不得超過線路寬度25%刮痕不可露銅不可有多出或缺少電路所有不良總和不可超過線路寬度25%PCB的檢驗IACConfidential35線路線路寬度均勻:+20%/-25%線路須附著良好,不可翹起或脫落線路表面須平整,明亮,邊緣平滑線路間隔須在0.254mm以上PCB的檢驗IACConfidential36PCB外觀板上不可有裂痕邊緣須光滑,不可有破損尺寸除特別規定,誤差不得大於+/-0.5mm端子處必須有倒角PCB的檢驗IACConfidential37PCB外觀板上不可任何穢物:水印,油漬,手印,或鉛筆記號等板子彎度或扭度A(每寸可彎之寸數)板子厚度(寸)最大彎度(A)小於0.06250.0150.0625~0.09370.010.0937~0.1250.0070.1250.006APCB濕敏等級及壽命定義IPC濕敏壽命定義(IPC/JEDECJ-STD-020C)PCB種類MSL落地壽命(拆封~置件完成)時間環境要求1物限期≦30℃/85%RH21年≦30℃/60%RH2a4周≦30℃/60%RH化金/OSP/選化3168小時≦30℃/60%RH化銀472小時≦30℃/60%RH548小時≦30℃/60%RH5a24小時≦30℃/60%RH6必需烘烤使用≦30℃/60%RHPCB真空+乾燥劑+濕敏卡包裝一般可保存6個月38IACConfidentialPCB濕敏等級及壽命定義IAC實際濕敏管制PCB種類MSL車間壽命車間環境拆封~置件完成AB面置件間隔化金472小時內48小時內20~30℃/40~70%RH光板拆封24小時內可真空包裝光板拆封逾72小時-125℃/4~9小時烘烤OSP/選化472小時內24小時內20~30℃/40~70%RH光板拆封24小時內可真空包裝光板拆封逾72小時報廢/請求廠商處理化銀548小時內24小時內20~30℃/40~70%RH光板拆封12小時內可真空包裝光板拆封逾48小時報廢/請求廠商處理開封的PCB在恆溫恆濕環境中,強酸性/硫化物/氯化物影響最大39IACConfidentialPCBQualityAssurancePCBTestReview41IACConfidential零件總數:155待上海RD確認:55待台北移轉:100■SPECREVIEW&TESTITEM.a.尺寸圖b.導通電阻c.耐溫管控狀況d.材質報告e.FAI報告f.安規資料g.GP報告h.機械強度i.環測■InitialTest
本文标题:PCB制程与原理
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