PCB工程资料中常见的英文缩写汇总

工程图档资料中常见的英文缩写汇总08/06/2009制作：危志强2009/7/152:06:24PM1/34工程圖檔資料中常見的英文縮寫匯總¾AOI:AutomaticOpticalInspection自動光學檢測¾SMD:SurfaceMountDevices表面安裝設備¾SMB:SurfaceMountBoard表面安裝板¾SMT:SurfaceMountTechnology表面安裝技術¾MIL:MilitaryStandard美國軍用標准¾LPI:LiquidPhotoImageableSolderMask液態感光阻焊油¾SMOBC:SolderMaskOnBareCopper裸銅覆蓋阻焊工藝¾OSP:OrganicSolderabilityPreservative焊錫性有機保護劑¾PTI:ProofTrackingIndex耐電壓起痕指數¾CTI:ComparativeTrackingIndex相對漏電起痕指數¾HASL:HotAirSolderLeveling噴錫HAL:HotAirLeveling噴錫¾PCB:PrintedCircuitBoard印制電路板¾PWB:PrintedWiringBoard印制線路板¾CCL:Copper-cludlaminat覆銅箔層壓板¾FPC：Flexibleprintedboard柔性线路板简称，又称软板¾CAD:ComputerAidedDesign計算機輔助設計¾CAM:ComputerAidedManufacturing計算機輔助制造¾CAT:ComputerAidedTesting計算機輔助測試¾PTH:PlatedThroughHole鍍通孔¾IC:IntegratedCircuit集成線路¾UL:UnderWritersLaboratories美國保險商實驗室¾CNS:ChineseNationalStandards中國國家標准¾BGA:BallGridArray球柵陣列¾BUM:Build-upMultilayer積層法多層板¾CFR:CodeofFederalRegularations聯邦法規全書¾AQL:AcceptableQualityLevel允收品質水准¾LDI:LaserDirectImaging鐳射直接成像¾HDI:HighDensityInterconnection–-Build-upMultilayer高密度互連積層多層板工程图档资料中常见的英文缩写汇总08/06/2009制作：危志强2009/7/152:06:24PM2/341.依照標准(inaccordingwithrelatedstandards)：IPC:TheInstituteforInternationalandPackagingElectronicCircuit美國電路互連與安裝學NEMA:NationalElectronicManufacturingAssociation國家電子制造協會/美國電氣制造協會2.基本材料(basematerial)：naturalcolor自然色externalcopperweight外層銅厚copperclad覆銅箔prepreg預浸材料（指半固化膠片）Tgrating玻璃化溫度laminate基板cross-section切片cutout切口Metalcore金屬芯typeofboard板類(singlesided單面doublesided雙面multilayer多層)epoxyglassfiber環氧玻璃纖維flammabilityrating/class防火等級dielectricmaterial介質材料temperature溫度ResinContent膠含量GlassTransitionTemperature(由”玻璃态”转化为”橡皮态”简称为TG!)basecopper(基銅)3.偏差及公差(deviation&tolerance):registration對位(重合度)dimension(長/寬/高)尺寸大小radius&diameter半徑/直徑holesize/aperture孔徑width寬度length長度depth深度height高度thickness厚度spacing間距axis軸coordinate坐標parameter參數copperfoil銅箔boardoutline/contour板輪廓圖edgetoedge邊到邊heatsinkplane散熱層stackup疊層$疊放finish(ed)thickness完成厚度trace=track=line=pattern=conductor＝rail=circuit線路toplayer上層&bottomlayer下層layertolayerregistration層與層對位interlayer&externallayer內層&外層clearance空隙、間空、間隔&gap間隙guidehole=pilothole導引孔tangency切線、相接觸＆diagonal對角線、對頂線signalplane信號層voltageplane電源層groundplane接地層C/S＝componentside元件面S/S=solderside焊接面Primaryside主層secondaryside輔層supportingplane支撐面Film底片/菲林masterfilm主稿片artwork底稿片masterdrawing布設總圖4.工藝（process）:surfacefinishing=surfacetreatment=finish表面處理hardgold重金Entek/Flux防氧化ImmersionAg化银goldplating鍍金immersiongold沉金flashgold閃金tin/leadplating鍍鉛錫electrolessgold(plating)（無電）鍍金nickel/goldplating鍍鎳金HASL:HotAirSolderLeveling噴錫HAL:HotAirLeveling噴錫NPTH:NotPlatedThroughHole非鍍通孔（非電鍍孔）Flatpackagetype平裝型SMOBC:SolderMaskOnBareCopper裸銅覆阻焊工藝plugthroughhole塞孔Void空洞slot開槽/槽孔tentedvias掩孔/導通孔annularring孔環mountinghole安裝孔toolinghole管位孔（定位孔）wetsoldermask濕膜dryfilm/drysoldermask干膜preflux&postflux預塗助焊劑&後塗助焊劑carbonink碳油silkscreenlegend絲印字符non-conductive非導電的工程图档资料中常见的英文缩写汇总08/06/2009制作：危志强2009/7/152:06:24PM3/34Permanent耐久的Solderresist阻焊劑&soldermask阻焊油（膜）Flowsoldering流焊Reflowsoldering再流焊Wavesoldering波焊Dipsoldering浸焊Dragsoldering曳焊Floatsoldering浮焊withdrawallacquer=peelablesoldermask藍膠2.25mmwindowaroundfiducialwithoutsolderresist譯文：環繞基准點2.25mm內綠油開窗Overalldiameterofsolderresistfreearea=6.0mm譯文：6.0mm直徑內全部綠油開窗5.標識(marking):vender’sidentification(賣主身份)=manufacture’sidentification(制造商名)=companyname(公司名稱)datecode生產周期ULlogo(denotation)UL標識trademark商標typedesignation型號標志revisionletter版本字母dustbinsymbol垃圾箱標志stamp蓋印、壓印short/opentest短/斷路測試liabletoread易於辯认6．彎曲與扭曲(bowandtwistortwistandwarp)：notexceed不超過7.外形（profiling）:mechnicaloutline外形圖countersink鑽孔routebit鑼鑽頭score劃痕、刻痕、劃線scoreline分割線slot開槽/槽孔&cutouts切口panelizationdetail拼板圖cosmetic=appearance外觀keepoutarea保留區域breakawayrails沖破導線arraysize拼板尺寸punch沖床drill鑽孔route鑼板V-cut切割、分割8.清潔度（clealiness）:Finishedcircuitboardshallbefreeofdirt，oil，ioniccontaminatesorotherforeignmatterwhichcouldaffectsolderabilitycircuitperformance，liftorappearance。譯文：成品電路板應無污塵、油污、微粒污染及可能影響到阻焊性能、線路性能、翹度及外觀的異物。9.包裝（packaging）:slipsheets簿襯紙vacuumpackaging真空包裝10.其它（others）:detail(詳細)appear(出現)enlarge(擴大)confirm(確認)Provide(提供)method(方法)ignore(忽視)avoid(避免)minor(較輕)major(嚴重)critical(致命性)drawnby(制作)Model(型號)Warp-wise(經向)Weft-wise(緯向)Stencil(網版)pattern(圖形)pattern(線路圖)grade等級issueddate發行日期工程图档资料中常见的英文缩写汇总08/06/2009制作：危志强2009/7/152:06:24PM4/34corresponding(相應的)build(製作，構造)adjacent(臨近的，接近的)Indicate(指出，簡要說明)exact(精確的，準確的)accuracy(精確性，正確度)attachment(附件，附加裝置)modify(更改，修改)accordingto(依照)properly(適當地。完全地)dummypad(假盤)thermalpad(散熱盤)isolationpad(孤立盤)specification規格說明hatchingpart陰影部分productionprocess生產工藝mattfinish粗化面printedcontacts印制插頭thermalstress熱應力thermalshock熱沖擊repeatability再現性viewfromtop頂層府視圖verticalview俯視圖upwardview仰視圖sideview側視圖preparedby制作DrawingNo.圖檔編號checkedby(auditedby)審核approvedby批准acceptability可接受性reproducibility再生性traceability可追溯性Flyprobe:飞针测试solderability可焊性separationline(隔離線)clearancehole(隔離孔)dimensionedhole(注尺寸孔)holelocation(孔位)stamp/perforatedhole(郵票孔)datumreference(參考基準)fiducialmark(光學點)solderplug(焊料塞孔)Laminateparaform(壓合參數表)stackupdata(曡構圖)drillholesheet(鑽孔資料單)AspesctRatio(纵横比)Delamination:(分层)