PCB板厂一般能做到工艺

雙面板多層板12L4~10L21/20Z,1/10Z1/20Z,1/10Z,1/30Z,2/20Z30.4~1.6MM0.4~2.5MM4TG135,TG140,TG150,TG170TG135,TG140,TG150,TG17051M(min),100M(max)1M(min),100M(max)615V(min),300V(max)15V(min),300V(max)7400mm*400mm400mm*400mm83.5mil/3.5mil3.5mil/3.5mil9800U''800U''內層5mil5mil外層5mil5mil110.2mm0.2mmPTH+_3mil+_3milNPTH+_3mil+_3mil13+_3mil+_3milRouting+_0.2mm+_0.2mmPunching+_0.15mm+_0.15mm154mil(min)4mil(min)16178mil8mil180.70%0.70%1920+_3mil+_3mil21+_2mil+_2mil22+_5°+_5°232430U''30U''檢驗標准：采用MIL-STD-105EAQL:MAJ=0.4,MIN=1.0制程能力參數概況序號項目
層數銅箔厚度基板厚度阻然特性絕緣電阻測試電壓成品板面積最小線寬﹑線距孔壁銅厚10最小焊環最小孔徑12孔徑公差孔位公差14外形公差綠油橋絲印偏差板邊與線路最小間距翹曲度V-CUT板材厚度范圍最大完成金厚(金手指)圖形對位精度各層通孔對准准度V-CUT對位精度V-CUT角度偏差