PCB生产流程-1

ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP0QDC!Nbovgbduvsjoh!Qspdftt!Gmpxٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯ))UFOUJOH*UFOUJOH*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1TypicalPCBManufacturingProcess1.փᐋഗࣨ(THINCORE)2.փᐋᒵሁ፹܂(ᚘᓂ)(DryFilmResistCoat)Fudi!Qipupsftjtu!)E0G*LaminateCopperFoilQBSU!2ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP2ࠢীڍᐋࣨ፹܂ੌ࿓-MLB4.փᐋᒵሁ፹܂(᧩ᐙ)(Develop)3.փᐋᒵሁ፹܂(ᡜ٠)(Expose)B0Xٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP3ࠢীڍᐋࣨ፹܂ੌ࿓-MLB5.փᐋᒵሁ፹܂(፱ࠥ)(Etch)6.փᐋᒵሁ፹܂(װᓂ)(StripResist)ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP4ࠢীڍᐋࣨ፹܂ੌ࿓-MLB7.ᦤࣨ(Lay-up)8.ᚘٽ(Lamination)MBZFS!3MBZFS!4MBZFS!5MBZFS!6MBZFS!2MBZFS!7ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP59.ᨵ֞(Drilling)10.ሽᝳ(Desmear&CopperDeposition)ࠢীڍᐋࣨ፹܂ੌ࿓-MLBٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP6ࠢীڍᐋࣨ፹܂ੌ࿓-MLB11.؆ᐋᒵሁᚘᓂ(OutlayerDryFilmLamination)12.؆ᐋᒵሁᡜ٠(Expose)ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP7ࠢীڍᐋࣨ፹܂ੌ࿓-MLB13.؆ᐋᒵሁᡜ٠৵(AfterExposed)14.؆ᐋᒵሁ᧩ᐙ(Develop)ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP8ࠢীڍᐋࣨ፹܂ੌ࿓-MLB15.؆ᐋᒵሁ፹܂(፱ࠥ)(Etch)16.؆ᐋᒵሁ፹܂(װᓂ)(StripResist)ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP9ࠢীڍᐋࣨ፹܂ੌ࿓-MLB18.௦८(Ᏼᙔ……)፹܂(ElectrolessNi/Au,HAL……)17.߻෬(ጸዪ)፹܂(SolderMask)ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP102/Հறဪࣨ)Qbofm!Tj{f*˖ˢˣˣ˘˥ʳ˙ˢ˜˟˘̃̂̋̌ʳ˚˿˴̆̆ˣ˻̂̇̂ʳ˥˸̆˼̆̇3/փᐋࣨᚘ೓ᓂ)Esz!Gjmn!Sftjtu!Dpbu*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP114/ᡜ٠)Fyqptf*5/ᡜ٠৵)Bgufs!Fyqptf*˔̅̇̊̂̅˾ʻࢍׂʼ˔̅̇̊̂̅˾ʻࢍׂʼˣ˻̂̇̂ʳ˥˸̆˼̆̇ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP126/փᐋࣨ᧩ᐙ)Efwfmpq*ˣ˻̂̇̂ʳ˥˸̆˼̆̇7/Ꭸࢤ፱ࠥ)Qpxfs0Hspvoe0Tjhobm*)Fudi*ˣ˻̂̇̂ʳ˥˸̆˼̆̇ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP139/႕֏)Pyjef!Dpbujoh*8/װ೓ᓂ)Tusjq!Sftjtu*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP14:/ᦤࣨ)Mbz.vq*Mbzfs!2Mbzfs!3Mbzfs!4Mbzfs!5Dpqqfs!GpjmDpqqfs!GpjmJoofs!MbzfsQsfqsfh)ᓄׂ*Qsfqsfh)ᓄׂ*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1521/ᚘٽ)Mbnjobujpo*ቾֵࣨᔱࣨ22/ᨵ֞)Q/U/I/ࢨळ֞Wjb*)Esjmm!'!Efcvss*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1623/ᝳຏ֞֗ԫڻሽᝳ)Eftnfbs'!Dpqqfs!Efqptjujpo*24/؆ᐋᚘᓂ)E0G!Qipup!Sftjtu!Dpbu*PhotoResistٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1725/؆ᐋᡜ٠)Fyqptf*26/ᡜ٠৵)Bgufs!Fyqptf*vw٠ᄭٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1827/؆ᐋ᧩ᐙ)Efwfmpq*28/ᒵሁ፱ࠥ)Ꭸࢤ፱ࠥ*!)Fudi*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP1929/װ೓ᓂ)Tusjq!Sftjtu*2:/ᏴჁ)෈णጸዪ*!)Tpmefs!Nbtl!Dpbu*ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP2031/߻෬ᡜ٠)Fyqptf*32/ጸዪ᧩ᐙ)Efwfmpq*T0N!B0Xٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP2133/ٱ֮ڗ)Mfhfoe*34/Ᏼᙔ)௦८……*!)IBM-Jnnfstjpo!hpme……*R105WWEI94V-0WWEI94V-0R105ٱࠧሽሁࣨੌ࿓տฯٱࠧሽሁࣨੌ࿓տฯP22SHEARINGSHEARINGD/FPHOTOIMAGE(INNERLAYER)D/FPHOTOIMAGE(INNERLAYER)LAMINATIONLAMINATIONCNCDRILLCNCDRILLPTHPTHPANELPLATINGPANELPLATINGD/FPHOTOIMAGE(OUTERLAYER)D/FPHOTOIMAGE(OUTERLAYER)ETCHETCHLIQUIDSOLDERMASKLIQUIDSOLDERMASKHAL(SURFACETREATMENT)HAL(SURFACETREATMENT)NCROUTINGNCROUTINGELECTRICALTESTELECTRICALTESTO.Q.C.O.Q.C.QBSU!3