苹果产品制程管控文件---PCBA Processes check list

PCBALineQualificationSpecificationI.GeneralchecklistforAllPCBAProcessesA.WorkingProcedureA.1Processmanagementflowandqualitycontrolplanareavailableforeachproduct.(e.g.,qualitycontrolflowchart,processflowchart)A.2Workinstructions/SOPforallPCBAprocessesareestablished.(SolderPasteprinting,componentsplacement,AOI,reflowprocess,Visualinspection,Packing…,etc)A.3Theworkinstruction/SOPmustspecify:a.)Productname&partNo..b.)Machinesetupparameters.c.)Machineprogramnameandrevision.d.)Fixtures/tool.(e.g.,stencilname,supportpins,supportblock)e.)Materialsdescription&PartNo..(e.g.,solderpastetype,PCBp/n,materialsloadingsheetdocumentnumber)f.)Processcontrolspecificationsandcheckingfrequency.(ESD,reflowprofile..etc)’g.)Componentspolarity,location(loadingsheetandplacement)h.)PCBinputdirectionforautomaticequipmentstation.A.4APPPCBACriticalProcess(APPCPP)isfollowedandcriticalparameterisspecifiedinWI/SOP.A.5Theworkinginstruction/SOPrevisioniscontrolledandapprovedbyauthorizedpersonnelpriortoissue.A.6Thechangesareidentifiedinthedocument.A.7Amasterlistofthesechangesisexisting.B.EquipmentControlB.1Theequipmentsusedformeasuring/inspectionarecalibrated.B.2PreventiveMaintenanceofmanufacturingequipmentisbuiltbasedondaily,weekly,Monthly,yearlyanddocumented.B.3Theconditionofequipment,program,andfixtureisverifiedbeforestartofproduction.B.4Actionistakenwhenconditionofequipment,program,orfixtureisnogood.B.5Thetools/fixturesnameorNo.isproperlyidentified.C.OperatorC.1Theoperators/inspectorsareproperlytrainedandhavesufficientknowledgetoperformtheoperation/inspection.C.2Theoperators/inspectorsarefollowingtheworkinginstructionsstrictly.C.3Theoperators/inspectorshandlingmethodareappropriate,i.e.,toavoiddamageormixing.D.ElectrostaticDischarge(ESD)/ElectricalOverstress(EOS)ControlD.1DocumentofESD/EOScontrolisexistingandmustconformtoMIL-STD-1686,IPCA-610.D.2Theoperators/inspectorsareproperlytrainedandhavesufficientknowledgetoperformtheoperation/inspection.D.3Theoperators/inspectorsarefollowingtheworkinginstructionsstrictly.D.4Theoperators/inspectorshandlingmethodareappropriate,i.e.,toavoiddamageormixing.D.5EveryonearewearingESDgloves/fingercoverwhenhandlingPCBA/IC.D.6EveryoneareproperlygroundedwhenhandlingPCBA/IC.D.7Theoperators/inspectorschecktheESDstrapbeforestartworkandtherecordsareavailable.OncepershiftD.8TheworkstationESDissafewithstaticdissipativeorantistaticworksurface.D.9FloorandtablematsarecheckedtoensuremeetESDrequirement.Onceperday.D.10Path-to-groundarecheckedtoensuremeetESDrequirement.OncepermonthE.MaterialsHandling&IdentificationE.1Documentofmaterialhandlingisexisting.E.2AllESDsensitivematerialsarestoredinanti-staticcontainer/package.E.3Asystemisestablishedtocontrolunpackedcriticalparts(BGA,QFP)andbakingprocessisspecified.E.4Forboardstestedinpanel,thefailedboardisproperlyidentified.E.5ThePCBAsareproperlystoredtoavoidmixingordamage.E.6Asystemtoidentifyproductsthatpassedtestandfailedtest(e.g.,markingonboard/case)E.7Forproductthatfailedtest,thenon-conformanceproductisidentified,recorded,andsegregated.E.8Boxesormagzinesareusedfordefectivegoodsclearlymarked.E.9GlovesorfingercotsarerequestedwhenhandlingPCB/PCBAtoavoidcontactskinsurface.E.10Electronicassemblies(PCBA)mustonlybestackedinspeciallydesignedracks,madeofapprovedESDmaterial,topreventphysicalorESD/EOSdamageaswellascontactcontamination.E.11DocumentforPCBsandmoisturesensitivecomponentsstorageandusingguidelineisexisting.Bakingconditionsisidentifiedaswell.F:StatisticalProcessControlF.1ThereisaSPCplanthatcontainedadescriptionoftheSPCsystem,responsibilities,andstepsrequiredtoimplementF.2SPCataspecific/criticaloperation.F.3TheSPCtrainingplanisdocumented.F.4AlltherelevantemployeesaretrainedaccordingtotheSPCtrainingplan.F.5ThereisaSPCtrainingprogram.F.6TheSPCtrainingrecordforeachemployeesismaintained.F.7Areupperandlowerlimitsusedoncontrolcharts?F.8Areout-of-controlconditionsnotedoncontrolcharts,withcausesinvestigated,andactionsprovided?F.9Thecausesforout-of-controlconditionsareinvestigatedandnoted.F.10Theactionsforout-of-controlconditionsareprovided.G.EnvironmentControlG.1Temperatureandhumidityaremonitoredonaregularbasis.(once/shiftmin.)G.2Actionaretakenwhentemperatureorhumiditygoesoutofcontrol.G.3Eating,drinking,oruseoftobaccoproductsshallbeprohibitedinallworkareastokeepgoodworkingenvironmentarea.II.SMTProcessControlChecklist1.PCBLoading1.1Theworkinginstructionsisestablishedtotheoperatoratthestation.1.2AsystemtocontrolPCBhandling,storageconditionisavailable.1.3PCBpartnumberandrevision,supplierisspecifiedontheworkingInstruction.1.4PCBinputdirectionisspecifiedintheworkingInstruction.1.5GloveisrequiredwhenhandlingPCB.2.SolderPastePrinting2.1Theworkinginstructionsisestablishedtotheoperatoratthestation.2.2Asystemtocontrolsolderpastestorageenvironmentisavailable.2.3Actionmustbetakenwhensolderpasteenvironmentoutofcontrolrangeanddocumented2.4AsystemtocontrolsolderpasteFIFOisestablished2.5Asystemtocontrolsolderpastestagingisestablished.(solderpastecontainershouldindicatedwithdateandtimeremovefromfridge,d