IC-FAB-厂务系统简介

ICFAB廠務系統簡介H:\OK000\PUBOK000\PUBLIC\訓練課程教材\SCLIU\FAB-3廠務系統介紹.pptICFAB/廠務供應系統酸/鹼化學藥品供應站有機溶劑供應站清潔用真空廢氣處理AcidScrubberSolventVOC空調設施UPWDI回收軟水裝置自來水儲存槽(20000m3)設備冷卻水供應系統208V/480V電力供應站特殊氣體供應站CDA廢水中和處理站HF處理站有機溶劑收集槽維修區/製造支援區潔淨室(IC製造設備)CIM+晶片自動傳送潔淨室(IC製造設備)液態氮液氧液氬氦氣氫氣補充空氣熱水︵蒸氣︶廢氣冰水ROpcw酸/鹼H2SO4回收有機溶劑IPA再生系統廢溶劑光阻劑酸鹼廢水廢HF260\scliu\fac\FACTTSYS1.PPT,@2000\05\02.清洗用水接地系統大地科管局廢水/污水處理站合格環保處理公司供應商氣体供應商氮氣供應商台灣電力公司變電站新竹自水公司(上坪溪)(竹東大圳)(寶山水庫)(永和山水庫)園區儲水池園區加壓站合格環保廢棄物處理公司濃縮污泥供應商供應商溪溫水衛生排水設備用真空柴油儲槽供應商TFMS/TFPSFuel天然瓦斯LPG/柴油FireDetection&Protection飲用水DI22.8KV/4.16KV電力供應站161KV/22.8KV電力供應站EG+DUPS:ECSection:HCSection:PUSection:OPSection:RMSection磷酸回收FACMonitor&ControlPOUMonitor&Control外氣外氣外氣外氣外氣水蒸汽環保環保地下水空保土保水保供應商酸鹼廢水酸鹼廢水DI再生廢水HF再生系統FABUtility說明(一)廠房:FAB:3F,(微震規格≦125u”/s)5F,(微震限制≦500u“/s),EQ地震保護必須加強.CleanRoom:Class-100T/SMIF,MUA有水洗功能對酸鹼離子有少許去除功能,但對濕度控制能力較佳。ProcessGas:由Module決定材料品質,管路傳送系統可達pptlevel,管線/管件為ElectropolishedS.S.Chemicals:由Module決定材料品質,管路傳送系統可達pptlevel,管線管件為PVDF.BulkGas:PN2,PO2,PH2,PAr,PHe,purifier.(≦1ppb)UPW:RS≧18.25M,impurity可達1ppb水準.fab-3\fab3utility說明1.pptMAU:MakeupAirUnit,S.S.:StainlessSteel,UPW:UltraPureWater.FABUtility說明(二)環境偵測:1.消防,毒氣和一般FAB相同,但增加C/R地板漏液偵測功能.2.並採用符合NFPA(美國國家防火拹會)標準之WetSprinkle.Exhaust:1.為避免大型管線堵塞,請Module機台能裝適當之LocalScrubber,做好對前置處理,以增加系統管線之壽命.2.不採用塑料管線,Fab採用不鏽鋼管加+Teflonliner抗化學反應特性佳,且對防火風險能力大幅提昇.Drain:為達環評水資源回收≧85%目標,特增設回收水再生處理系統,但需Module配合增加分流控制的軟硬體.PCW:採密閉循環系統,水質控制較佳,hookup管線採用焊接方式,漏水問題會比Fab-2少.和EQ銜接部分仍用高壓軟管,要特別注意管線保護且拆裝時要特別注意.其他:未和晶片直接接觸之廠務系統,如CityWater,CDA,PV,NG,LPG,廢水處理,廢氣處理,…等系統能力與品質大致和FAB-2相同.fab-3\fab3utility說明1.pptC/R:CleanRoom,CDA:CleanDryAir,PV:ProcessVacuum.NG:NatureGas,LPG:LiquefiedPetroleumGas1.Buildingcondition:1-1.Floorload/ceilingheight/vibrationisolation:PerformanceCriteriaofUtilitySupplySystem(MXICFAB-3UtilitySupplyCondition&LimitationforProcessTool)LocationFloornameFloorloadingCeilingheightVibrationRequiredVibrationGoalFAB1FUtilityfab1,000㎏/m22FLevel1sub-fab1,000㎏/m21000μ/s3FLevel1C/R1,750㎏/m23.6m250μ/s125μ/s4FLevel2sub-fab1,000㎏/m25FLevel2C/R1,750㎏/m23.6m1000μ/s500μ/s5FCL+/-4.8m250μ/s6FUppertruss750㎏/m27FOffice400㎏/m22.7mRoof200㎏/m2MUApenthouse750㎏/m2Roofofpenthouse200㎏/m2SupportingBuilding（SB）1FWarehouse1,000㎏/m22FRawmaterialstorage1,000㎏/m23FCleansupportroom1,000㎏/m23.6m1000μ/s4FProductionsupplyroom750㎏/m2LocationFloornameFloorloadingCeilingheightVibrationRequiredVibrationGoal5FCleansupportroom1,000㎏/m23.6m1000μ/s6F750㎏/m27F400㎏/m2PenthouseMechanicalroom400㎏/m2Roof200㎏/m21-2.RaisedFloor:A.Loadcapacity:1,500㎏/m2B.Concentrationload:70~80㎏/㎝21-3.Doorsizeforprocesstoolmove-inroute:W×H:2.8m×3.4m1-4.Goodselevator:1-4-1.Forprocesstooltransportation:A.Loadcapacity:8tonsB.H×W×D:3.4m×3.0m×5.0mC.Doorsize（W×H）:2.8m×3.4m1-4-2.OnlyforW/Hmaterialtransportation:A.Loadcapacity:5tonsB.H×W×D:3.4m×3.0m×5.0mC.Doorsize（W×H）:2.8m×3.4m2.Electricalpowersupplycondition:2-1.Voltage&Loading:480V:60Hz±0.5Hz,3phase4wire（R,S,T,G）208V:60Hz±0.5Hz,3phase4wire（R,S,T,G）208V:60Hz±0.5Hz,3phase5wire（R,S,T,N,G）120V:60Hz±0.5Hz,1phase3wire（L,N,G）※Iftoolloadingof208Visgreaterthan400A,wesuggesttouse480Vpowersource.※ProcesstoolshouldfollowIEEEstandard466-electricalpowervoltagerequirement.Asattachment-1.2-2.Type:NormalPower:withoutsupplywhenpoweroutageEmergencyPower:cansustainpowerfailuremorethan10minutesDynamicUPS:continuouslysupplyeventhoughtpoweroutage3.EMI：＜10mGdc&＜1mGac,andmaximum0.2mGvariationover5minutesnearsensitiveequipment.4.ESD：4-1.Raisedfloorandconcretefloor=10E6~5×10E8Ω/□4-2.Cleanroomwall=10E6~5×10E8Ω/□4-3.Voltage:＜100Vlevel4-4.Photoarea:dischargetime:+1000Vto+100Vunderemitter＜40sec.5.Grounding:≦1Ω6.Noise:≦60NC7.Illumination:750~800luxforC/R；butphotoarea500~600luxwithyellowlightLocationFloornameCleanessTemperatureRelativehumidityFab3FLevel1C/RClass100T@0.3μm22.5±1℃43±3﹪Fab5FLevel2C/RClass100T@0.3μm22.5±1℃43±3﹪SB3FCleansupportroomClass100T@0.3μm22.5±1℃43±5﹪SB5FCleansupportroomClass100T@0.3μm22.5±1℃43±5﹪Fab5FCMPslurryareaClass100T@0.3μm22.5±1℃43±3﹪Fab1FHPMareaClass100,000@0.5μm22.5±2℃50±10﹪※8.Cleanness/Temperature/Relativehumidity:※Pressurizationhierarchy:Fab＞AdjacentsupportingC/R15Pa＞Adjacentnon-C/R15Pa9.Exhaust:9-1.ExhaustpressureatPOU≦-30mmAq9-2.Exhausttype:GEX:Generalexhaustforheatemissionandnon-hazardousgaseousmaterialemission.SCX:Scrubberexhaustforacidgaseousmaterialemission.ACX:Basescrubberexhaustforgaseousalkalinematerialemission.SOX:Solventscrubberexhaustforgaseousvolatilitymaterialemission.※Allofemissionwithharmfulnessshouldbepre-treatedbylocalscrubber,unlessitcouldbedissolvedinwatercompletely.※Theseexhaustsystemshaven'tcapabilityofparticulatetreatment,ifprocesstool'semissionwithparticulate,thenitshouldownitselflocalscrubbertotreatthis.※Ifthesolventpossesscorrosiveness(suchasEKC),thatshouldbepointedoutespecially.10.Drain:10-1.『HF-SDrain』:thewastewatercontainfluorineion,[F-]＞200mg/l10-2.『HF-WDrain』:thewastewatercontainfluorineion,[F-]＜200mg/l10-3.『IPAWaste』:thewasteliquidcontainIPAandconcentration[IPA]＞80%10-4.『SolventWaste』:thewasteliquidcontainsolventandconcentration[Solvent]＞80%10-5.『DA（WasteDrain）』: