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Shin-EtsusiliconeforLEDsSalesandMarketingDepartmentⅣSiliconeDivisionShin-EtsuChemicalCo.,Ltd.June,2014Shin-EtsuSiliconeforLEDsSTLOC-2014-001Shin-EtsuChemicalCo.,Ltd.Confidential〔1〕固晶胶/Die-BondPaste・银胶/SilverPaste・导热材料/ThermalconductiveMaterials・透明绝缘材料/InsulatorandTransparentMaterials〔2〕封装胶/Encapsulant・低透氧性材料/GasBarrierMaterials・照明用途材料/ForGeneralLighting・UVChip&WLP用途材料/ForUVChip&WaferLevelPackage〔3〕支架材料/PKG-Materials・围坝胶/DamMaterials・反光杯成型材料/MoldMaterialsforL/F・镀银层保护灌封材料/ProtectionCoatingforAgPlatingShin-EtsuChemicalCo.,Ltd.ConfidentialContentsShin-EtsuSiliconeforLEDsSTLOC-2014-001MOVPEEpiWaferChipPackageModuleSystem晶片成长前半工程后半工程最终制品实装工程RTVRubber&SiliconeGreaseOSR-500,G-777,KE-1867,KE4962forThermallyconductiveKE-4970,KE-4971,KE-4956,KE-1283forMoistureproofKE-109E,KE-1283forPottingKET-132H,KE-1292,KE-1867,KE-1897forPottingtoPowerSupply(Bulb,LEDDriver)Shin-EtsuChemicalCo.,Ltd.ConfidentialSIMSeriesforGridIntegrationPatternedSapphireSubstrate(PSS)增加出光量EfficiencyImprovementofLightOut-putSIPR-9684forElectroplatingonChipBondingPadformingKER-2400forWaferBondingRedChip(GaAs)SCR,KER,ASPSeriesasEncapsulant,Lens,Die-BondPaste,DamKCRSeriesasReflectorMoldforLeadframeShin-EtsuSiliconeforLEDsSTLOC-2014-001LampTypePLCCTypeMAPType(DFL)Shin-EtsuChemicalCo.,Ltd.ConfidentialCeramicMCCOBWaferLevelPKGOrganicModifiedSiPhenylSiliconeUltraThermalstabilityMethylSiliconeresinSide-ViewLowPowerTV-BLUMidPowerLightingHighPowerWaferLevelHighPowerShin-EtsuSiliconeforLEDsSTLOC-2014-001Shin-EtsuChemicalCo.,Ltd.ConfidentialPPA/PCT-SMDMAP-SMDCOB(Ceramic)WLPNextGeneration(150~180℃)KCR-M3000KER-2020-DAM(KCR-M3000)KER-2910S-Barrier-02KER-2910S-Barrier-02KER-2300KER-2460KER-3200-T5/T7KER-3200-T5/T7〔FlipChip〕HighPowerKCR-H2800KER-2020-DAM(KCR-M3000)KER-2600S-Barrier-01KER-2700S-Barrier-01KER-2300KER-2460KER-3200-T5/T7KER-3200-T5/T7〔FlipChip〕MiddlePowerPCTKCR-H2800KER-2000-DAMASP-2010ASP-2018SFASP-2010ASP-2018SFKER-6020KER-6541KER-3000-M2KER-3000-M2KER-3000-M2LowPower6T&9TSCR-1018KER-6540SFSCR-3400-S5Shin-EtsuSiliconeforLEDsSTLOC-2014-001Shin-EtsuChemicalCo.,Ltd.Confidential6150C10,000cc1,000ccSCR-1011D70/1.52SCR-1016D70/1.52ASP-2010D54/1.58KER-2500A70/1.41KER-2400D31/1.41KER-6150A50/1.44KER-6020A20/1.44SCR-1012D75/1.52ASP-2018SFA60/1.57FER-7061A60/1.38FER-7082A80/1.39O2GasPermeabilityat23ºCcc/m2・dayKER-6000A22/1.51ProductsNameHardness/R.I.MethylMethylPhenylLowR.I.PhenylASP(NewPhenyl)SCRFER-7110A40/1.36NewMethyl180CKER-2910A20/1.41KER-6540SFA40/1.48CoatingAgentS-Barrier-01S-Barrier-02OurTarget130C100CShin-EtsuSiliconeforLEDsSTLOC-2014-001Shin-EtsuChemicalCo.,Ltd.Confidential1.391.411.441.501.531.57RefractiveIndexHardnessD70A70A50A20GelSCR-1016SCR-1012KER-2600KER-2500KER-2300KER-6020KER-6000KER-6200X-32-2528KER-6075MethylSiliconePhenylSiliconeModifiedSilicone(SCR)KER-6150KER-2400KER-2700AdvancedPhenyl(ASP)D30LowR.I.(FER)Methyl-PhenylSiliconeKER-6540SFKER-2910FER-7082FER-7061FER-7110ASP-2010ASP-2018SFVarietyofRefractiveIndextocorrelationforbetterlightintensityShin-EtsuSiliconeforLEDsSTLOC-2014-001Application1stGeneration2ndGeneration3rdGeneration4thGenerationHighPowerLEDMiddlePowerLEDLowPowerLEDElectricalConductiveMEMSWireProtectPhotocaplurShin-EtsuChemicalCo.,Ltd.ConfidentialX-32-2551KER-3200-T1KER-3100-U2SMP-2800KER-6020FKER-2000-DAMKER-6230FKER-3600-D2FER-3800-D1FER-7200-F7KER-3200-T5KER-3200-T7X-32-2551LSMP-2800LSMP-2820SMP-2840KER-4022-D2KER-6075F標準品KER-3000-M2SCR-3400-S5・MiddleDieShear・HighDieShear・LowStress・LowR.I.・HighTC1W・LowThermalResistance・Lowstress・AgPasteforZenerDiode・ThermalConductive0.6WUnderDevelopmentX-32-2898KER-4004-C5KER-4004-C4・高透明(Ag)・高透明(TiO2)UnderDevelopmentUnderDevelopment・ThermalStabilityUnderDevelopmentShin-EtsuSiliconeforLEDsSTLOC-2014-001Shin-EtsuChemicalCo.,Ltd.Confidential〔1〕固晶胶/Die-BondPaste・银胶/SilverPaste・导热材料/ThermalconductiveMaterials・透明绝缘材料/InsulatorandTransparentMaterials〔2〕封装胶/Encapsulant・低透氧性材料/GasBarrierMaterials・照明用途材料/ForGeneralLighting・UVChip&WLP用途材料/ForUVChip&WaferLevelPackage〔3〕支架材料/PKG-Materials・围坝胶/DamMaterials・反光杯成型材料/MoldMaterialsforL/F・镀银层保护灌封材料/ProtectionCoatingforAgPlatingShin-EtsuSiliconeforLEDsSTLOC-2014-001本资料总的数据为实测数据,并非规格值。Shin-EtsuChemicalCo.,Ltd.Confidential固化前物性/Beforecure単位/UnitSMP-2840外观/Appearance灰色/Gray粘度/ViscosityPa・s@25℃30不挥发成分/Non-volatilematterWt%(体积比)86(50)溶剂/SolventPolyethyleneglycoldimethylether固化前密度/Densitybeforecureg/m3@25℃3.4保存条件/Storagecondition-40℃~0℃标准固化条件/Curecondition150℃×3hrsor180℃×1h固化后物性/Aftercure単位/UnitValue固化后密度/Densityaftercureg/m3@25℃5.6玻璃转移点/Tg℃185线膨胀系数/CTEppm38导电性/SpecificresistanceΩcm5.8×10-5导热率/ThermalconductivityW/mK1热阻/Thermalresistance(BLT)mm2℃/W8(7μm)固晶强度/DieshearMPa21.3齐纳管用途导电银胶/SilverPasteforZenerDiode:SMP-2840・加热固化型/HeatcureType(组成/Components:Polyimide-Silicone+AgFiller+Solvent)・无引起硅胶触媒中毒的成分/ThisproductdoesnotcontaincureinhibitorofadditionalcuretypeSiliconeEncapsulantShin-EtsuSiliconeforLEDsSTLOC-2014-001SMP-2840在静止放置过程中银填充物会发生沉淀,因此请务必在使用前先进行充分搅拌。由于含有溶剂,会发生银填充物沉淀情况,所以无法使用针筒包装。Shin-EtsuChemicalCo.,Ltd.Confidential使用前请先进行回温大概瓶盖(银填充物有沉淀)准备搅拌工具先缓慢搅拌把内壁银胶刮落干净把底部银
本文标题:信越2014年LED资料
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