QFN封装技术简介

QFN封装技术简介•样品外观名称解释QFN-QuadFlatNo-Lead即四面扁平无引线封装。又称MCC-Microchipcarrier即微芯片载体封装。QFN也是CSP封装的一种类型。CSP-Chipscalepackage即芯片尺寸封装。一般定义为芯片面积占封装面积的80%应用领域•Telecommunicationproducts•Cellularphones•WirelessLAN•Portableproducts•Personaldigitalassistants•Digitalcameras•Lowtomediumleadcountpackages•Informationappliances•Lowprofile(1.00.2L/F+0.7Mold)•Lightweight•Costeffective•Smallfootprint•Betterelectricalperformance•Betterpowerdissipation结构特点封装考核标准•PackageLevelMSL•JEDEClevel330°C/60%,192hoursforPPFleadframeJDEEClevel185°C/85%,168hoursforCuleadframe•PCT121°C/100%/2atm,100hours•TCT-65°C~150°C,1000cycles•HTST150°C1000hours•HAST130°C/85%100hours封装类型与技术参数PkgsizeLeadcountPadsize(mm)Diesize(mm)Pitchsize(mm)QJA(c/w)0(m/s)1(m/s)2(m/s)3x316L12/161.80.530.270.500.5059.176.256.974.055.072.14x424L20/242.81.530.770.500.5032.240.729.938.428.136.55x532L32/283.01.730.870.500.5031.038.328.735.926.934.17x748L48/444.73.431.720.500.5023.527.120.9824.619.122.78x856L52/565.74.432.220.500.5021.524.418.921.917.120.09x964L6.75.432.720.500.5019.722.117.119.515.317.10x1068L7.76.433.220.500.5018.120.315.517.613.715.8工艺流程•Waferbackgrinding(Option)•Wafermount•Wafersaw/clean•2ndoptical(Gate)•LeadframetapingCuC194/NittoCRM-6250•Dieattach•Epoxycure•WirebondGoldwire:99.99%Au•3rdoptical(Gate)•Mold•Leadframedetaping•Postmoldcure•Topsidelasermarking•Electrodeflash(Option)•Plating(Option)Sn/PborSn/Cu•Singulation•Finalvisualinspection(Gate)•PackingTrayortube封装外形图符号解释•A1Stand-off•A2Bodythickness•eLeadpitch•OverallthicknessisthesumofA1andA2规格与尺寸PkgsizeLeadcountA1beD1E13312/160~0.050.90.54420/240~0.050.90.55528/320~0.050.90.555200~0.050.90.6566360~0.050.90.657744/480~0.050.90.577320~0.050.90.6577280~0.050.90.899640~0.050.90.599440~0.050.90.651010680~0.050.90.51212840~0.050.90.5几种工艺•1单片-传统方法。•2分离膜方式。•3预贴膜方式QFN简要工艺流程•\\Crm-file01-srv\ANST\部门文件夹\总经理室\zhangzl\我的文档\QFN\QFN流程.doc-TOWA合作方提供的设备配置建议；•\\Crm-file01-srv\ANST\部门文件夹\总经理室\zhangzl\我的文档\QFN\QFN建议方案－ANST'.doc-TOWAQFN的关键技术•引线框设计•防飞边贴膜，卸膜。•切割•产品测试QFN技术发展•WBFBP技术\\Crm-file01-srv\ANST\部门文件夹\总经理室\zhangzl\我的文档\QFN\FBP文章\104_2.jpg