数字集成电路chapter1

EE141©DigitalIntegratedCircuits2ndIntroduction1DigitalIntegratedCircuitsADesignPerspectiveIntroduction陆生礼[e-mail]141©DigitalIntegratedCircuits2ndIntroduction2MostPPTsFromWebsite©DigitalIntegratedCircuits2ndIntroduction3WhatisthisCourseallabout?Introductiontodigitalintegratedcircuits.manufacturingCMOSdevicesWireCMOSinvertersStatic/DynamicCMOSgatesSequentialcircuitsInterconnectArithmeticmemoriesEE141©DigitalIntegratedCircuits2ndIntroduction4ClassMaterialTextbook:“DigitalIntegratedCircuits–ADesignPerspective,”2ndEdition,byJ.Rabaey,A.Chandrakasan,andB.NikolicReadings:AvailableonthewebpagesIEEEpaper©DigitalIntegratedCircuits2ndIntroduction5目录历史回顾数字IC设计中的问题数字设计的质量评价EE141©DigitalIntegratedCircuits2ndIntroduction6TheFirstComputer•1834年Babbage发明•差动引擎机械计算装置（DifferenceEngine）•25,000各机械部件•成本为£17,470特点：•十进制系统•可执行加减乘除运算•基本概念与现代计算机很相似•设计复杂•成本高昂EE141©DigitalIntegratedCircuits2ndIntroduction7TheFirstVaccumTube1904年英国电气工程师弗莱明发明第一只真空二极管1906年美国科学家德·福雷斯特发明第一只具有放大作用的真空三极管电子管产生后，计算机便跨入电子纪元左下图是现在使用的电子管EE141©DigitalIntegratedCircuits2ndIntroduction8ENIAC-Thefirstelectroniccomputer(1946)基于真空电子管的计算机“埃尼阿克”•18000个电子管6000个开关10000个电容器、70000个电阻1500个继电器•长24m×高2.6m,重达30吨。•速度较机械计算高•可靠性不高•功耗极大(140KW)•真空管计算极限EE141©DigitalIntegratedCircuits2ndIntroduction9TheFirstTransistor•1947年BellLab的布拉顿和巴丁发明了第一只晶体管•1948年BellLab的肖克利发明了现代晶体管的始祖——结型晶体管EE141©DigitalIntegratedCircuits2ndIntroduction10贝尔实验室研制出世界上第一台全晶体管计算机TRADIC，装有800只晶体管，仅100瓦功率，体积3立方英尺。TRADIC-Thefirstfull-transisitorcomputer(1955)EE141©DigitalIntegratedCircuits2ndIntroduction11TheFirstIntegratedCircuits1958年TI的JackKilby制成了世界上第一块集成电路。使用半导体单晶硅制成了相移振荡器，其中的每个元器件已不需要用金属导线相连。EE141©DigitalIntegratedCircuits2ndIntroduction12TheFirstMOSDevice1957年仙童半导体公司成功地制造出金属氧化物半导体（MOS）器件1958年美国仙童电子公司赫尔尼等人发明了一整套制作微型晶体管的新工艺──“平面工艺“被移用到集成电路的制作中，使集成电路很快从实验室研制试验阶段转入工业生产阶段。EE141©DigitalIntegratedCircuits2ndIntroduction13Intel4004Micro-Processor1971年仅用NMOS2250个晶体管3x4mm2108kHz时钟速率历史CMOSPMOSNMOSCMOSEE141©DigitalIntegratedCircuits2ndIntroduction14IntelPentium(IV)microprocessorEE141©DigitalIntegratedCircuits2ndIntroduction15目录历史回顾数字IC设计中的问题数字设计的质量评价EE141©DigitalIntegratedCircuits2ndIntroduction16Moore’sLaw1965年,GordonMoore预测:单芯片的晶体管数以每18个月～24个月翻倍.EE141©DigitalIntegratedCircuits2ndIntroduction17Moore’sLaw16151413121110987654321019591960196119621963196419651966196719681969197019711972197319741975LOG2OFTHENUMBEROFCOMPONENTSPERINTEGRATEDFUNCTIONElectronics,April19,1965.EE141©DigitalIntegratedCircuits2ndIntroduction18EvolutioninComplexityEE141©DigitalIntegratedCircuits2ndIntroduction19TransistorCounts1,000,000100,00010,0001,00010100119751980198519901995200020052010808680286i386i486Pentium®Pentium®ProK1BillionTransistorsSource:IntelProjectedPentium®IIPentium®IIICourtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction20Moore’slawinMicroprocessors40048008808080858086286386486Pentium®procP60.0010.010.1110100100019701980199020002010YearTransistors(MT)2Xgrowthin1.96years!主流的单片处理器晶体管数约每2年翻倍EE141©DigitalIntegratedCircuits2ndIntroduction21DieSizeGrowth40048008808080858086286386486Pentium®procP611010019701980199020002010YearDiesize(mm)~7%growthperyear~2Xgrowthin10yearsMoore定律下，单芯片面积增长14%Courtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction22FrequencyP6Pentium®proc486386286808680858080800840040.111010010001000019701980199020002010YearFrequency(Mhz)主流处理器时钟速率每2年翻倍Doublesevery2yearsCourtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction23PowerDissipationP6Pentium®proc486386286808680858080800840040.1110100197119741978198519922000YearPower(Watts)主流处理器功耗持续增加（CMOS工艺的采用出现短暂下降）Courtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction24Powerwillbeamajorproblem5KW18KW1.5KW500W40048008808080858086286386486Pentium®proc0.111010010001000010000019711974197819851992200020042008YearPower(Watts)电力供给和消耗将受到限制Courtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction25Powerdensity40048008808080858086286386486Pentium®procP611010010001000019701980199020002010YearPowerDensity(W/cm2)HotPlateNuclearReactorRocketNozzle功率密度太大，以至于无法降低结温Courtesy,IntelEE141©DigitalIntegratedCircuits2ndIntroduction26NotOnlyMicroprocessorsDigitalCellularMarket(PhonesShipped)19961997199819992000Units48M86M162M260M435MAnalogBasebandDigitalBaseband(DSP+MCU)PowerManagementSmallSignalRFPowerRF(datafromTexasInstruments)CellPhoneEE141©DigitalIntegratedCircuits2ndIntroduction27ChallengesinDigitalDesign“MicroscopicProblems”•Ultra-highspeeddesign•Interconnect•Noise,Crosstalk•Reliability,Manufacturability•PowerDissipation•Clockdistribution.EverythingLooksaLittleDifferent“MacroscopicIssues”•Time-to-Market•MillionsofGates•High-LevelAbstractions•Reuse&IP:Portability•Predictability•etc.…andThere’saLotofThem!DSM1/DSM?EE141©DigitalIntegratedCircuits2ndIntroduction28ProductivityTrends1101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000LogicTr./ChipTr./StaffMonth.xxxxxxx21%/