AEC-Q200-Rev-D-Base-Document

AEC-Q200REVDJune1,2010STRESSTESTQUALIFICATIONFORPASSIVECOMPONENTSComponentTechnicalCommitteeAutomotiveElectronicsCouncilAEC-Q200REVDJune1,2010ComponentTechnicalCommitteeAutomotiveElectronicsCouncilPage2of74AcknowledgementAnyDocumentinvolvingacomplextechnologybringstogetherexperienceandskillsfrommanysources.TheAutomotiveElectronicsCouncilwouldespeciallyliketothankthetechnicalcommitteemembersthatprovidedinputforthisdocumentandrecognizethefollowingco-authors:SustainingMembersRobertHulka,Jr.Delphi(765)[e-mail](734)[e-mail](734)[e-mail](734)[e-mail]l(256)[e-mail]lTomMitchellAutoliv(248)[e-mail](616)[e-mail]MaloyTDK(770)[e-mail][e-mail](847)[e-mail](770)[e-mail]+(886)[e-mail]yCarter-BerriosKemet(650)[e-mail]MIS+32(/55)[e-mail](480)[e-mail](256)[e-mail](770)[e-mail](843)[e-mail]-Q200REVDJune1,2010ComponentTechnicalCommitteeAutomotiveElectronicsCouncilPage3of74NOTICEAECdocumentscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheAECTechnicalCommittee.AECdocumentsaredesignedtoservetheautomotiveelectronicsindustrythrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanAECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.AECdocumentsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionAECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheAECdocuments.TheinformationincludedinAECdocumentsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromtheautomotiveelectronicssystemmanufacturerviewpoint.Noclaimstobeinconformancewiththisdocumentshallbemadeunlessallrequirementsstatedinthedocumentaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisAECdocumentshouldbeaddressedtotheAECTechnicalCommitteeonthelink©2010bytheAutomotiveElectronicsCouncil.Thisdocumentmaybefreelyreprintedwiththiscopyrightnotice.ThisdocumentcannotbechangedwithoutapprovalfromtheAECComponentTechnicalCommittee.AEC-Q200REVDJune1,2010ComponentTechnicalCommitteeAutomotiveElectronicsCouncilPage4of74TableofContentsSectionTitlePage(s)1.0Scope61.1Description61.2ReferenceDocuments72.0GeneralRequirements8-103.0QualificationandRequalification11-124.0QualificationTests12-13Table1-QualificationSampleSizeRequirements14-15Table2-TableofMethodsReferencedTantalumandCeramicCapacitors16-17Table2A-Ceramic/TantalumProcessChangeQualificationguidelinesfortheSelectedTest18Table2B-AcceptanceCriteriaforCeramicCOGSMDCapacitors19Table2C-AcceptanceCriteriaforCeramicX7RandX5RSMDCapacitors20Table2D-AcceptanceCriteriaforCeramicTantalumandNiobiumOxideCapacitors21Table3-TableofMethodsReferencedAluminumElectrolyticCapacitors22-23Table3A-ElectrolyticCapacitorProcessChangeQualificationGuidelinesfortheSelectedTest24Table4-TableMethodsReferencedFilmCapacitors25-26Table4A-FilmCapacitorProcessChangeQualificationGuidelinesfortheSelectionofTest27Table5-TableofMethodsReferencedMagnetics(Inductors/Transformers)28-29Table5A-InductiveProductsProcessChangeQualificationGuidelinesfortheselectionofTest30Table6-TableofMethodsReferencedNetworks(R-C/C/R)31-32Table6A/7A-NetworksandResistorsProcessChangeQualificationGuidelinesforSelectionofTest33Table7-TableofMethodsReferenceResistors34-35Table7B-AcceptanceCriteriaforCarbonFilmLeadedFixedResistors36Table7C-AcceptanceCriteriaforMetalFilmLeadedFixedResistors37Table7D-AcceptanceCriteriaforMetalOxideLeadedFixedResistors38Table7E-AcceptanceCriteriaforWireWoundLeadedFixedResistors39Table7F-AcceptanceCriteriaforSMDChipResistors40Table8-TableofMethodsReferencedThermistors41-42Table8A-ThermistorProcessChangeQualificationGuidelinefortheSelectionofTest43Table9-TableofMethodsReferencedTrimmerCapacitors/Resistors44-45Table9A-TrimmersCapacitors/ResistorsProcessChangeQualificationGuidelinesforthe46SelectionofTestTable10-TableofMet