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EE141©DigitalIntegratedCircuits2ndCombinationalCircuits1CMOS组合逻辑门设计EE141©DigitalIntegratedCircuits2ndCombinationalCircuits2组合电路与时序电路组合电路时序电路Output=f(In)Output=f(In,PreviousIn)CombinationalLogicCircuitOutInCombinationalLogicCircuitOutInStateEE141©DigitalIntegratedCircuits2ndCombinationalCircuits3静态CMOS设计在静态电路中,每一时刻每个门的输出通过一个低阻路径连到电源或地上。同时在任何时候该门的输出即为该电路实现的布尔函数值(忽略在切换期间的瞬态效应)。动态电路则依赖于把信号值暂时存放在高阻抗电路结点的电容上。EE141©DigitalIntegratedCircuits2ndCombinationalCircuits4静态互补CMOSVDDF(In1,In2,…InN)In1In2InNIn1In2InNPUNPDNPMOSonlyNMOSonlyPUN(上拉网络)和PDN(下拉网络)组成互补逻辑EE141©DigitalIntegratedCircuits2ndCombinationalCircuits5阈值对开关的影响VDDVDD0PDN0VDDCLCLPUNVDD0VDD-VTnCLVDDVDDVDD|VTp|CLSDSDVGSSSDDVGSEE141©DigitalIntegratedCircuits2ndCombinationalCircuits6NMOS管串联/并联连接一个晶体管可以看成是一个由栅信号空置的开关。当控制信号为高时NMOS开关闭合,当控制信号为低时则断开。XYABY=XifAandBXYABY=XifAORBNMOS管产生“强”0和“弱”1EE141©DigitalIntegratedCircuits2ndCombinationalCircuits7PMOS管串联/并联连接XYABY=XifAANDB=A+BXYABY=XifAORB=ABPMOS管产生“强”1和“弱”0PMOS管像一个反开关,当控制信号为低时闭合,当控制信号为高时断开。EE141©DigitalIntegratedCircuits2ndCombinationalCircuits8互补CMOS逻辑EE141©DigitalIntegratedCircuits2ndCombinationalCircuits9例:NANDEE141©DigitalIntegratedCircuits2ndCombinationalCircuits10例:NOREE141©DigitalIntegratedCircuits2ndCombinationalCircuits11复杂CMOS门OUT=D+A•(B+C)DABCDABCEE141©DigitalIntegratedCircuits2ndCombinationalCircuits12如何构成一个复杂CMOS门C(a)下拉网络SN1SN4SN2SN3DFFADBCDFABC(b)下拉网络中子网识别DAABCVDDVDDB(c)互补逻辑门EE141©DigitalIntegratedCircuits2ndCombinationalCircuits13单元设计标准单元通用逻辑能够被综合相同的高度,可变的宽度数据通道单元确定的结构(算术运算单元)包含一些连线确定的高度和宽度EE141©DigitalIntegratedCircuits2ndCombinationalCircuits14标准单元版图策略–1980s信号布线通道VDDGNDEE141©DigitalIntegratedCircuits2ndCombinationalCircuits15标准单元版图策略–1990sM2无布线通道VDDGNDM3VDDGND镜像单元镜像单元EE141©DigitalIntegratedCircuits2ndCombinationalCircuits16标准单元单元边界N阱InOutVDDGNDEE141©DigitalIntegratedCircuits2ndCombinationalCircuits17标准单元AOutVDDGNDB2输入NAND门BVDDAEE141©DigitalIntegratedCircuits2ndCombinationalCircuits18棍棒图无尺寸约束仅表示晶体管的相对位置InOutVDDGND反相器AOutVDDGNDBNAND2EE141©DigitalIntegratedCircuits2ndCombinationalCircuits19棍棒图CABX=C•(A+B)BACijABCEE141©DigitalIntegratedCircuits2ndCombinationalCircuits20两个版本的C•(A+B)XCABABCXVDDGNDVDDGNDEE141©DigitalIntegratedCircuits2ndCombinationalCircuits21棍棒图CABX=C•(A+B)BACijjVDDXXiGNDABCPUNPDNABC逻辑路径EE141©DigitalIntegratedCircuits2ndCombinationalCircuits22欧拉路径法jVDDXXiGNDABCABCEE141©DigitalIntegratedCircuits2ndCombinationalCircuits23OAI22逻辑图BADX=AB+CDBCAGNDXVDDXABDPDNPUNDCCEE141©DigitalIntegratedCircuits2ndCombinationalCircuits24例:x=ab+cdGNDxabcdVDDxGNDxabcdVDDx(a)Logicgraphsfor(ab+cd)(b)EulerPaths{abcd}acdxVDDGND(c)stickdiagramforordering{abcd}bEE141©DigitalIntegratedCircuits2ndCombinationalCircuits25多指晶体管一指两指(折叠)减少了扩散区电容EE141©DigitalIntegratedCircuits2ndCombinationalCircuits26互补CMOS特性全电压摆幅;高噪声容限逻辑功能不依赖于器件尺寸;ratioless稳定状态输出接电源或地;低输出阻抗非常高的输入阻抗;稳定状态输入电流几乎为零稳定状态电源和地之间无通路;无静态功耗传播延时与负载及输出阻抗有关EE141©DigitalIntegratedCircuits2ndCombinationalCircuits27开关延时模型AReqARpARpARnCLACLBRnARpBRpARnCintBRpARpARnBRnCLCintNAND2INVNOR2EE141©DigitalIntegratedCircuits2ndCombinationalCircuits28输入模式对延时的影响延时与输入模式有关由低到高的翻转所有输入都翻转到0–延时0.69Rp/2CL其中一个输入翻转到0–延时0.69RpCL由高到低的翻转所有输入都翻转到1–延时0.692RnCLCLBRnARpBRpARnCintEE141©DigitalIntegratedCircuits2ndCombinationalCircuits29延时与输入的关系-0.500.511.522.530100200300400A=B=10A=10,B=1A=1,B=10time[ps]Voltage[V]输入数据模式延时(psec)A=B=0167A=1,B=0164A=01,B=161A=B=1045A=1,B=1081A=10,B=180NMOS=0.5m/0.25mPMOS=0.75m/0.25mCL=100fFEE141©DigitalIntegratedCircuits2ndCombinationalCircuits30晶体管尺寸CLBRnARpBRpARnCintBRpARpARnBRnCLCint22221144EE141©DigitalIntegratedCircuits2ndCombinationalCircuits31一个复杂COMS门的尺寸OUT=D+A•(B+C)DABCDABC122244886366EE141©DigitalIntegratedCircuits2ndCombinationalCircuits32扇入(Fan-In)考虑DCBADCBACLC3C2C1分布RC模型(Elmore延时)tpHL=0.69Reqn(C1+2C2+3C3+4CL)传播延时在最坏情况下与扇入成平方关系.EE141©DigitalIntegratedCircuits2ndCombinationalCircuits33tp与扇入的关系tpLHtp(psec)fan-in扇入一般情况下不应大于4.025050075010001250246810121416tpHL平方线性tpEE141©DigitalIntegratedCircuits2ndCombinationalCircuits34tp与扇出的关系246810121416tpNOR2tp(psec)eff.fan-out所有的门有相同的驱动电流.tpNAND2tpINVSlopeisafunctionof“drivingstrength”EE141©DigitalIntegratedCircuits2ndCombinationalCircuits35tp与扇入和扇出的关系扇入:由于电阻与电容同时增加,成平方关系扇出:每增加一个额外的扇出就等于增加两个栅电容EE141©DigitalIntegratedCircuits2ndCombinationalCircuits36快速复杂CMOS门:设计技术1晶体管尺寸负载以扇出为主逐级加大晶体管的尺寸InNCLC3C2C1In1In2In3M1M2M3MN分布RC线M1M2M3…MN能够将延时降低超过20%;EE141©DigitalIntegratedCircuits2ndCombinationalCircuits37快速复杂CMOS门:设计技术2重新安排输入C2C1In1In2In3M1M2M3CLC2C1In3In2In1M1M2M3CL关键路径关键路径charged101chargedcharged1延时由CL,C1andC2的放电时间决定延时由CL的放电时间决定1101chargeddischargeddischargedEE141©DigitalIntegratedCircuits2ndCombinationalCircuits38快速复杂CMOS门:设计技术3重组逻辑结构F=ABCDEFGHEE141©DigitalIntegratedCircuits2ndCombinationalCircuits39快速复杂CMOS门:设计技术4利用BUFFER来隔离大的扇出CLCLEE141©DigitalIntegratedCircuits2ndCombinationalCircuits40快速复杂CMOS门:设计技术5降低电压摆幅线性减少功耗同时降低但后面的门会变得更慢!或者利用“灵敏放大器”将电压信号恢复(存储器设计)tpHL=0.69(3/4(CLVDD)/IDSATn)=0.69(3/4(CLVswing)/IDSATn)EE141©DigitalIntegratedCircuits2ndCombinationalCircuits41组合电路的性能通常组合
本文标题:第六章CMOS组合逻辑门的设计
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