CRG03中文资料

CRG032006-11-061TOSHIBARectifierSiliconDiffusedTypeCRG03GeneralPurposeRectifierApplications•Averageforwardcurrent:IF(AV)=1.0A•Repetitivepeakreversevoltage:VRRM=400V•Suitableforcompactassemblyduetosmallsurface-mountpackage“S−FLATTM”(Toshibapackagename)AbsoluteMaximumRatings(Ta=25°C)CharacteristicsSymbolRatingUnitRepetitivePeakReverseVoltageVRRM400VAverageForwardCurrentIF(AV)1.0（Note）APeakOneCycleSurgeForwardCurrent(Non−Repetitive)IFSM15.0(50Hz)16.5(60Hz)AJunctionTemperatureTj−40~150°CStorageTemperatureRangeTstg−40~150°CNote:1Ta=56°CDevicemountedonaceramicboardboardsize:50mm×50mmsolderingland:2mm×2mmboardthickness0.64tNote2:Usingcontinuouslyunderheavyloads(e.g.theapplicationofhightemperature/current/voltageandthesignificantchangeintemperature,etc.)maycausethisproducttodecreaseinthereliabilitysignificantlyeveniftheoperatingconditions(i.e.operatingtemperature/current/voltage,etc.)arewithintheabsolutemaximumratings.PleasedesigntheappropriatereliabilityuponreviewingtheToshibaSemiconductorReliabilityHandbook(“HandlingPrecautions”/DeratingConceptandMethods)andindividualreliabilitydata(i.e.reliabilitytestreportandestimatedfailurerate,etc).ElectricalCharacteristics(Ta=25°C)CharacteristicsSymbolTestConditionMinTyp.MaxUnitVFM(1)IFM=0.1A(Pulsetest)⎯0.86⎯VVFM(2)IFM=0.7A(Pulsetest)⎯0.971.1VPeakforwardvoltageVFM(3)IFM=1.0A(Pulsetest)⎯1.0⎯VRepetitivepeakreversecurrentIRRMVRRM=400V(Pulsetest)⎯⎯10μADevicemountedonaceramicboardBoardsize:50mm×50mmSolderingland:2mm×2mmBoardthickness:0.64t⎯⎯65Rth(j-a)Devicemountedonaglass-epoxyboardBoardsize:50mm×50mmSolderingland:6mm×6mmBoardthickness:1.6t⎯⎯130°C/WThermalresistanceRth(j-ℓ)―⎯⎯20°C/WUnit:mmJEDEC―JEITA―TOSHIBA3-2A1AWeight:0.013g(typ.)CRG032006-11-062MarkingAbbreviationCodePartNo.G3CRG03StandardSolderingPadHandlingPrecautionTheabsolutemaximumratingsdenotetheabsolutemaximumratings,whichareratedvaluesandmustnotbeexceededduringoperation,evenforaninstant.Thefollowingarethegeneralderatingmethodsthatwerecommendwhenyoudesignacircuitwithadevice.VRRM:Werecommendthattheworstcasevoltage,includingsurgevoltage,benogreaterthan80%oftheabsolutemaximumratingofVRRMforaDCcircuitandbenogreaterthan50%ofthatofVRRMforanACcircuit.VRRMhasatemperaturecoefficientof0.1%/℃.Takethistemperaturecoefficientintoaccountdesigningadeviceatlowtemperature.IF(AV):Werecommendthattheworstcasecurrentbenogreaterthan80%oftheabsolutemaximumratingofIF(AV).Carryoutadequateheatdesign.Ifyoucan’tdesignacircuitwithexcellentheatradiation,setthemarginbyusinganallowableTamax-IF(AV)curve.Thisratingspecifiesthenon-repetitivepeakcurrentinonecycleofa50-Hzsinewave,conditionangle180.Therefore,thisisonlyappliedforanabnormaloperation,whichseldomoccursduringthelifespanofthedevice.WerecommendthatadevicebeusedataTjofbelow120℃undertheworstloadandheatradiationconditions.Thermalresistancebetweenjunctionandambientfluctuatesdependingonthedevice’smountingcondition.Whenusingadevice,designacircuitboardandasolderinglandsizetomatchtheappropriatethermalresistancevalue.PleaserefertotheRectifiersdatabookforfurtherinformation.2.81.21.2Unit:mmCRG032006-11-063AverageforwardcurrentIF(AV)(A)Tamax–IF(AV)MaximumallowabletemperatureTamax(°C)NumberofcyclesSurgeforwardcurrent(non-repetitive)PeaksurgeforwardcurrentIFSM(A)InstantaneousforwardvoltagevF(V)iF–vFInstantaneousforwardcurrentiF(A)0.1110160600204080100120140010203025515110010Ta=25°Cf=50HzTimet(s)rth(j-a)–tTransientthermalimpedancerth(j-a)(°C/W)(2)(1)(1)Devicemountedonaceramicboard:Solderingland:2mm×2mm(2)Devicemountedonaglass-epoxyboard:Solderingland:6mm×6mm1101000100000.0010.010.1100110100AverageforwardcurrentIF(AV)(A)PF(AV)–IF(AV)AverageforwardpowerdissipationPF(AV)(W)0.00.20.00.81.40.40.60.81.01.20.20.40.61.01.20.200.40.61.20.8DevicemountedonaceramicboardDevicemountedonaglass-epoxyboard1.00.40.81.21.62.02.42.825°CTj=150°C75°CDevicemountedonaceramicboardDevicemountedonaglass-epoxyboardSolderinglandBoardsizeBoardthickness2mm□6mm□50mm□50mm□0.64t1.6tHalfsinewaveform180°0°Conductionangle180°Halfsinewaveform180°0°Conductionangle180°PulsetestCRG032006-11-064RESTRICTIONSONPRODUCTUSE20070701-EN•Theinformationcontainedhereinissubjecttochangewithoutnotice.•TOSHIBAiscontinuallyworkingtoimprovethequalityandreliabilityofitsproducts.Nevertheless,semiconductordevicesingeneralcanmalfunctionorfailduetotheirinherentelectricalsensitivityandvulnerabilitytophysicalstress.Itistheresponsibilityofthebuyer,whenutilizingTOSHIBAproducts,tocomplywiththestandardsofsafetyinmakingasafedesignfortheentiresystem,andtoavoidsituationsinwhichamalfunctionorfailureofsuchTOSHIBAproductscouldcauselossofhumanlife,bodilyinjuryordamagetoproperty.Indevelopingyourdesigns,pleaseensurethatTOSHIBAproductsareusedwithinspecifiedoperatingrangesassetforthinthemostrecentTOSHIBAproductsspecifications.Also,pleasekeepinmindtheprecautionsandconditionssetforthinthe“HandlingGuideforSemiconductorDevices,”or“TOSHIBASemiconductorReliabilityHandbook”etc.•TheTOSHIBAproductslistedinthisdocumentareintendedforusageingeneralelectronicsapplications(computer,personalequipment,offi